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US5796166A Expired / Lapsed US ⏱️ 0.0 years remaining

Tasin oxygen diffusion barrier in multilayer structures

Assignee: GlobalFoundries Inc
•
Filing: 1996-06-21
•
Granted: 1998-08-18
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Expires: 2016-06-21
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Abstract

Abstract A multilayer structure having an oxygen or dopant diffusion barrier fabricated of an electrically conductive, thermally stable material of refractory metal-silicon-nitrogen which is resistant to oxidation, prevents out-diffusion of dopants from silicon and has a wide process window wherein the refractory metal is selected from Ta, W, Nb, V, Ti, Zr, Hf, Cr and Mo.

Inventors

  • 👤 Paul David Agnello
  • 👤 Cyril Cabral, Jr.
  • 👤 Alfred Grill
  • 👤 Christopher Vincent Jahnes
  • 👤 Thomas John Licata
  • 👤 Ronnen Andrew Roy

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 17:24
CPC Classifications
H; H10; H10P; H10P36/00; H10D; H10D64/00; H10D64/01; H10D64/013; H10D64/01302; H10D64/01332; H10D64/01336; H10D64/0134; H10D1/00; H10D1/60; H10D1/62; H10D1/66; H10D64/01304; H10D64/01306; H10D64/01308; H10D64/01312; H10D64/01344; H10D64/60; H10D64/66; H10D64/661; H10D64/662; H10D64/664; H10D64/665; H10D64/666; H10D64/68; H10D64/681; H10D64/685; H10D64/693; H10D84/00; H10D84/01; H10D84/0123; H10D84/0126; H10D84/0165; H10D84/0172; H10D84/0174; H10D84/0177; H10D84/02; H10D84/03; H10D84/038

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 77 words
A semiconductor structure comprising: a silicon base layer having a top surface, and a refractory metal-silicon-nitrogen diffusion barrier layer adhered to the top surface of said silicon base layer, said diffusion barrier layer is deposited between a silicon base layer and a contact layer with a high permittivity oxide film deposited on top of said contact layer, whereby said refractory metal-silicon-nitrogen layer protects said silicon base layer from oxidation upon contact with oxygen by the semiconductor structure.
Claim 2
Dependent Claim 77 words
A semiconductor structure comprising: a silicon base layer having a top surface, and a refractory metal-silicon-nitrogen diffusion barrier layer adhered to the top surface of said silicon base layer, said diffusion barrier layer is deposited between a silicon base layer and a contact layer with a high permittivity oxide film deposited on top of said contact layer, whereby said refractory metal-silicon-nitrogen layer protects said silicon base layer from oxidation upon contact with oxygen by the semiconductor structure.
Claim 3
Dependent Claim 52 words
A semiconductor structure according to claim 1, wherein said contact layer is made of at least one oxidation resistant metal selected from the group consisting of Pt, Ir and Au, or an electrically conductive oxide selected from the group of RuO 2 , IrO 2 , and Re 2 O 3 .
Claim 4
Dependent Claim 30 words
A semiconductor structure according to claim 1, wherein said structure is a capacitor which further comprises an oxidation resistant contact layer, a high permittivity oxide layer and a contact electrode.
Claim 5
Dependent Claim 19 words
A semiconductor structure according to claim 1, wherein said structure is a polycide gate stack in a CMOS device.
Claim 6
Dependent Claim 32 words
A capacitor in a semiconductor device comprising: a silicon substrate, a refractory metal-silicon-nitrogen diffusion barrier layer, an oxidation resistant contact layer, a high permittivity oxide layer, and a contact metal electrode layer.
Claim 7
Dependent Claim 32 words
A capacitor in a semiconductor device comprising: a silicon substrate, a refractory metal-silicon-nitrogen diffusion barrier layer, an oxidation resistant contact layer, a high permittivity oxide layer, and a contact metal electrode layer.
Claim 8
Dependent Claim 27 words
A capacitor according to claim 5, wherein said refractory metal is selected from the group consisting of Ta, W, Nb, V, Ti, Zr, Hf, Cr and Mo.
Claim 9
Dependent Claim 17 words
A capacitor according to claim 5, wherein said refractory metal-silicon-nitrogen diffusion barrier layer is a TaSiN layer.

References Cited (Backward Citations)

US4855798A Cited
US5170242A Cited
US5440174A Cited
US5341016A Cited
US5440173A Cited
US5504041A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2001-08-17 2002-02-16 2002-08-18 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2005-08-17 2006-02-16 2006-08-18 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2009-08-17 2010-02-16 2010-08-18 $7700.00 Window Closed / Lapsed

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