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US5795215A Expired / Lapsed US ⏱️ 0.0 years remaining

Method and apparatus for using a retaining ring to control the edge effect

Assignee: Applied Materials Inc
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Filing: 1996-06-19
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Granted: 1998-08-18
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Expires: 2016-06-19
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Abstract

Abstract A process using a retaining ring assembly of a carrier head to precompress a polishing pad to reduce or minimize the edge effect in a chemical mechanical polishing process.

Inventors

  • 👤 William L. Guthrie
  • 👤 Tsungnan Cheng
  • 👤 Sen-Hou Ko
  • 👤 Harry Q. Lee
  • 👤 Michael T. Sherwood
  • 👤 Norm Shendon

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 23:07
CPC Classifications
B; B24; B24B; B24B5/00; B24B37/00; B24B37/04; B24B37/042; B24B37/27; B24B37/30; B24B37/32; B24B49/00; B24B49/16

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 99 words
A method of chemically mechanically polishing a substrate, comprising the steps of: positioning a substrate adjacent to a polishing pad by means of a carrier head, said carrier head including a mounting assembly and a retaining ring; moving said substrate relative to said polishing pad; applying a first load to said mounting assembly to press said substrate against said polishing pad; selecting a second load to be applied by said retaining ring to minimize an edge effect on said substrate; and independently applying said second load to said retaining ring to press said retaining ring against said polishing pad.
Claim 2
Independent Claim 99 words
A method of chemically mechanically polishing a substrate, comprising the steps of: positioning a substrate adjacent to a polishing pad by means of a carrier head, said carrier head including a mounting assembly and a retaining ring; moving said substrate relative to said polishing pad; applying a first load to said mounting assembly to press said substrate against said polishing pad; selecting a second load to be applied by said retaining ring to minimize an edge effect on said substrate; and independently applying said second load to said retaining ring to press said retaining ring against said polishing pad.
Claim 3
Dependent Claim 24 words
The method of claim 1 wherein the step of moving the substrate relative to the polishing pad includes the step of rotating said substrate.
Claim 4
Dependent Claim 25 words
The method of claim 1 further the step of moving the substrate relative to the polishing pad includes the step of rotating the polishing pad.
Claim 5
Dependent Claim 15 words
The method of claim 1 wherein the first load is greater than the second load.
Claim 6
Dependent Claim 15 words
The method of claim 1 wherein the second load is greater than the first load.

References Cited (Backward Citations)

US5584751A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2001-08-17 2002-02-16 2002-08-18 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2005-08-17 2006-02-16 2006-08-18 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2009-08-17 2010-02-16 2010-08-18 $7700.00 Window Closed / Lapsed

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