US5786589A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Photoelectric converting device with anisotropically conductive film for connecting leads of wiring board and electrode pads of photoelectric converting device
Assignee: Toshiba Corp
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Filing: 1997-02-20
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Granted: 1998-07-28
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Expires: 2017-02-20
Abstract
Abstract A plurality of leads are formed on a wiring board which is adhered onto a light transmitting member for transmitting a light beam. A plurality of electrode pads are formed, corresponding to the leads, on a photoelectric converting device. An anisotropically conductive film is formed between each of the leads and each of the corresponding electrode pads.
Inventors
- 👤 Masao Segawa
- 👤 Kazushige Ooi
- 👤 Masanobu Kimura
- 👤 Shuichi Sugi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 13:21
CPC Classifications
H; H10; H10F; H10F39/00; H10F39/80; H10F39/804; H04; H04N; H04N23/00; H04N23/50; H04N23/54; H10F39/011; H10F77/00; H10F77/40; H10F77/413; H10F77/50; H10F77/93; H10F77/933; H04N23/555; H10W; H10W74/00; H10W74/10; H10W74/15; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
56 words
A photoelectric converting device fabrication method, comprising the steps of: (a) forming a plurality of leads on a first surface of a wiring board: (b) adhering a second surface of the wiring board onto a light transmitting member; and (c) forming an anisotropically conductive film between the leads and electrode pads of the photoelectric converting device.
Claim 2
Dependent Claim
56 words
A photoelectric converting device fabrication method, comprising the steps of: (a) forming a plurality of leads on a first surface of a wiring board: (b) adhering a second surface of the wiring board onto a light transmitting member; and (c) forming an anisotropically conductive film between the leads and electrode pads of the photoelectric converting device.
Claim 3
Dependent Claim
107 words
The fabrication method as set forth in claim 1, wherein the wiring board has an opened portion and wherein the leads are formed on at least part of the first surface of the wiring board along the opened portion, wherein said step (b) adheres the second surface of the wiring board to the light transmitting member, wherein said step (c) forms the anisotropically conductive film on the wiring board so that the opened portion is fully covered by the anisotropically conductive film, and further comprising a step (d) of connecting the leads and the corresponding electrode pads of the photoelectric converting device through the anisotropically conductive film.
Claim 4
Dependent Claim
72 words
The fabrication method as set forth in claim 1, wherein said step (b) includes the steps of: connecting the leads of the wiringboard and the corresponding electrode pads of the photoelectric converting device through the anisotropically conductive film, the leads being formed on at least part of the first surface of the wiring board along the opened portion; and adhering the second surface of the wiring board to the light transmitting member.
Claim 5
Dependent Claim
26 words
The fabrication method as set forth in claim 1, wherein the anisotropically conductive film is made of a conductive paste and formed by a dispenser method.
Claim 6
Dependent Claim
35 words
The fabrication method as set forth in claim 1, further comprising the step of: disposing a dummy lead between the first surface of the wiring board and the light transmitting member before the step (c).
Claim 7
Dependent Claim
28 words
The fabrication method as set forth in claim 1, further comprising the step of: mounting an electronic device on the wiring board before the steps (b) and (c).
Claim 8
Dependent Claim
54 words
The fabrication method as set forth in claim 2, wherein at least one of said step (b) and said step (c) includes forming a blank portion of the anisotropically conductive film on the wiring board along the opened portion, and further comprising a step (e) of closing the blank portion after said step (d).
Claim 9
Dependent Claim
53 words
The fabrication method as set forth in claim 1, wherein metal clads are formed on both surfaces of the wiring board by adhesive agent layers, and further comprising the step of: removing one of said metal clads adhered on both surfaces of the wiring board so that said adhesive agent layer thereon remains.
Claim 10
Dependent Claim
27 words
The fabrication method as set forth in claim 1, wherein the anisotropically conductive film is made of a conductive paste and formed by a screen printing method.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-07-27 | 2002-01-26 | 2002-07-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-07-27 | 2006-01-26 | 2006-07-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-07-27 | 2010-01-26 | 2010-07-28 | $7700.00 | Window Closed / Lapsed |