US5042919A
Expired / Lapsed
US
⏱️ 0.0 years remaining
External-circuit connecting and packaging structure
Assignee: Canon Inc
•
Filing: 1990-01-11
•
Granted: 1991-08-27
•
Expires: 2010-01-11
Abstract
Abstract There is disclosed a method of connecting an external circuit, including the steps of disposing between an electrode for connecting the external circuit connected with an electrode for driving a liquid crystal panel and an external circuit electrode connected with the external circuit, a film comprising an insulating resin containing conductive particles dispersed therein, and applying a pulse voltage to a heat tool under the pressure-applied state.
Inventors
- 👤 Shigeki Yabu
- 👤 Hiroshi Takabayashi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 02:38
CPC Classifications
G; G02; G02F; G02F1/00; G02F1/01; G02F1/13; G02F1/133; G02F1/1333; G02F1/1345; G02F1/13452; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H05K3/323; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10681; H05K2203/00; H05K2203/01; H05K2203/0195; H05K3/34; H05K3/3494; H05K3/36; H05K3/361; Y; Y10; Y10S; Y10S257/00; Y10S257/93
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
185 words
A film carrier packaging structure comprising: a plurality of first flexible insulating films having a conductive material pattern formed thereon, with each said conductive material pattern having an outer lead-bonding area and an inner lead-bonding area, with said outer lead-bonding area extending from said first flexible insulating films in the shape of a finger, wherein an inner lead-bonding area of one of said first flexible insulating films connects with a first semiconductor device disposed in a face-up state and an inner lead-bonding area of another one of said first flexible insulating films connects with a second semiconductor device disposed in a face-down state; a wiring substrate having an anisotropic conductive film disposed thereon, with an outer lead-bonding area of one of said first flexible insulating films being disposed on said conductive film and facing said wiring substrate; and a second flexible insulating film thinner than said first flexible insulating films and being disposed on said outer lead-bonding area of said one of said first flexible insulating films, wherein said second flexible insulating film is heated to thermocompression-bond said outer lead-bonding area to said wiring substrate.
Claim 2
Dependent Claim
185 words
A film carrier packaging structure comprising: a plurality of first flexible insulating films having a conductive material pattern formed thereon, with each said conductive material pattern having an outer lead-bonding area and an inner lead-bonding area, with said outer lead-bonding area extending from said first flexible insulating films in the shape of a finger, wherein an inner lead-bonding area of one of said first flexible insulating films connects with a first semiconductor device disposed in a face-up state and an inner lead-bonding area of another one of said first flexible insulating films connects with a second semiconductor device disposed in a face-down state; a wiring substrate having an anisotropic conductive film disposed thereon, with an outer lead-bonding area of one of said first flexible insulating films being disposed on said conductive film and facing said wiring substrate; and a second flexible insulating film thinner than said first flexible insulating films and being disposed on said outer lead-bonding area of said one of said first flexible insulating films, wherein said second flexible insulating film is heated to thermocompression-bond said outer lead-bonding area to said wiring substrate.
Claim 3
Dependent Claim
40 words
The packaging structure of claim 1, wherein a conductive foil of said outer lead-bonding area has a thickness substantially equal to the sum of the thickness of said second flexible insulating film and the thickness of said anisotropic conductive film.
Claim 4
Dependent Claim
186 words
A display apparatus comprising: a display device including a first display substrate having a first group of electrodes and a first group of terminals connected with said first group of electrodes, a second display substrate having a second group of electrodes intersecting said first group of electrodes and a second group of terminals connected with said second group of electrodes, and a display material disposed between said first and second display substrates; first and second film carriers comprising first conductive film portions fixed on said carriers and second conductive film portions extending from said carriers; a first semiconductor element electrically connected with said fixed conductive film portion on said first film carrier in the face-up state, and a second semiconductor element electrically connected with said fixed conductive film portion on said second film carrier in the face-down state; and a first anisotropic conductive member disposed between said first group of terminals and said conductive film portion extending from said first film carrier, and a second anisotropic conductive member disposed between said second group of terminals and said conductive film portion extending from said second film carrier.
Claim 5
Dependent Claim
186 words
A display apparatus comprising: a display device including a first display substrate having a first group of electrodes and a first group of terminals connected with said first group of electrodes, a second display substrate having a second group of electrodes intersecting said first group of electrodes and a second group of terminals connected with said second group of electrodes, and a display material disposed between said first and second display substrates; first and second film carriers comprising first conductive film portions fixed on said carriers and second conductive film portions extending from said carriers; a first semiconductor element electrically connected with said fixed conductive film portion on said first film carrier in the face-up state, and a second semiconductor element electrically connected with said fixed conductive film portion on said second film carrier in the face-down state; and a first anisotropic conductive member disposed between said first group of terminals and said conductive film portion extending from said first film carrier, and a second anisotropic conductive member disposed between said second group of terminals and said conductive film portion extending from said second film carrier.
Claim 6
Dependent Claim
26 words
A display apparatus of claim 3, further comprising insulating members disposed on said extended conductive material film portions extending from said first and second film carriers.
Claim 7
Dependent Claim
15 words
A display apparatus according to claim 3, wherein said display material is a liquid crystal.
Claim 8
Dependent Claim
16 words
A display apparatus according to claim 5, wherein said liquid crystal is a ferroelectric liquid crystal.
Claim 9
Dependent Claim
138 words
A film carrier packaging structure comprising: a plurality of first flexible insulating films having a conductive material pattern formed thereon, with each said conductive material pattern having an outer lead-bonding area and an inner lead-bonding area, with said outer lead-bonding area extending from said first flexible insulating films in the shape of a finger, wherein an inner lead-bonding area of one of said first flexible insulating films connects with a first semiconductor device disposed in a face-up state and an inner lead-bonding area of another one of said first flexible insulating films connects with a second semiconductor device disposed in a face-down state; and a wiring substrate having an anisotropic conductive film disposed thereon, with an outer lead-bonding area of one of said first flexible insulating films being disposed on said conductive film and facing said wiring substrate.
Claim 10
Dependent Claim
138 words
A film carrier packaging structure comprising: a plurality of first flexible insulating films having a conductive material pattern formed thereon, with each said conductive material pattern having an outer lead-bonding area and an inner lead-bonding area, with said outer lead-bonding area extending from said first flexible insulating films in the shape of a finger, wherein an inner lead-bonding area of one of said first flexible insulating films connects with a first semiconductor device disposed in a face-up state and an inner lead-bonding area of another one of said first flexible insulating films connects with a second semiconductor device disposed in a face-down state; and a wiring substrate having an anisotropic conductive film disposed thereon, with an outer lead-bonding area of one of said first flexible insulating films being disposed on said conductive film and facing said wiring substrate.
References Cited (Backward Citations)
US4145120A
Cited
JPS5269646A
Cited
US4336551A
Cited
US4295711A
Cited
US4474432A
Cited
US4386293A
Cited
US4640581A
Cited
US4643536A
Cited
GB2170365A
Cited
US4767189A
Cited
US4826297A
Cited
US4842373A
Cited
US4964700A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-08-26 | 1995-02-25 | 1995-08-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-08-26 | 1999-02-25 | 1999-08-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-08-26 | 2003-02-25 | 2003-08-27 | $7700.00 | Window Closed / Lapsed |