Patent US5780321A successfully refreshed from Google Patents.
US5780321A
Expired / Lapsed
US
⏱️ 0.0 years remaining
LED display packaging with substrate removal and method of fabrication
Assignee: RYO HOLDINGS LLC
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Filing: 1996-08-19
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Granted: 1998-07-14
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Expires: 2016-08-19
Abstract
Abstract A light emitting diode display package and method of fabricating a light emitting diode (LED) display package including a light emitting diode array on a substrate, having row and column connection pads routed to display connection pads positioned on an uppermost surface of the LED array device, a separate silicon driver device having connection pads routed to an uppermost surface, positioned to cooperatively meet those of the LED device when properly registered, the LED device flip chip bump bonded to the driver device using standard C5 DCA, an underfill layer positioned between the space defined by the LED device and the driver device. The LED display and driver device package subsequently having selectively removed the substrate onto which the LED array was initially formed. The light emitted from the LED display device, being emitted through the remaining indium-gallium-aluminum-phosphide (InGaAlP) epilayer of the LED device.
Inventors
- 👤 Chan-Long Shieh
- 👤 Hsing-Chung Lee
- 👤 Paige M. Holm
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 22:40
CPC Classifications
H; H10; H10H; H10H29/00; H10H29/01; H10H29/011; H10H20/00; H10H20/01; H10H20/011; H10H20/019; H10H29/036; H10H29/0362; H10H29/0364; H10H29/10; H10H29/14; H10H29/142; H10H29/80; H10H29/85; H10H29/852; H10H29/857; H10W; H10W90/00
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
69 words
A method of fabricating a light emitting diode display package comprising the steps of: providing a substrate with a major surface; forming an array of light emitting diodes on the major surface of the substrate, thereby forming a light emitting diode device having a defined display area; and selectively removing the substrate from the light emitting diode devices thereby leaving an indium-gallium-aluminum-phosphide epilayer of the light emitting device exposed.
Claim 2
Independent Claim
69 words
A method of fabricating a light emitting diode display package comprising the steps of: providing a substrate with a major surface; forming an array of light emitting diodes on the major surface of the substrate, thereby forming a light emitting diode device having a defined display area; and selectively removing the substrate from the light emitting diode devices thereby leaving an indium-gallium-aluminum-phosphide epilayer of the light emitting device exposed.
Claim 3
Dependent Claim
126 words
A method of fabricating a light emitting diode display package as claimed in claim 1 further including the steps of forming a plurality of bond pads, in electrical cooperation with the array of light emitting diodes, providing a driver device formed on a silicon substrate, having a plurality of drive components formed therein, forming a plurality of bond pads, in electrical cooperation with the drive components, cooperatively positioned to engage the bond pads of the array of light emitting diodes and interfacing the plurality of bond pads, in electrical cooperation with the array of light emitting diodes, to the plurality of bond pads, in electrical cooperation with the drive components of the driver device, thereby electrically connecting the light emitting diode device to the driver device.
Claim 4
Dependent Claim
56 words
A method of fabricating a light emitting diode display package as claimed in claim 2 wherein the interfacing of the plurality of bond pads, in electrical cooperation with the-array of light emitting diodes, to the plurality of bond pads in electrical cooperation with the driver device includes flip chip solder bump bonding of the bond pads.
Claim 5
Dependent Claim
44 words
A method of fabricating a light emitting diode display package as claimed in claim 3 further including the step of underfilling an area formed between the light emitting diode device and the driver device with one of a nonconductive polymer or an epoxy material.
Claim 6
Dependent Claim
40 words
A method of fabricating a light emitting diode display package as claimed in claim 1 wherein the step of removing the substrate from the light emitting diode device includes a release layer, whereby the release layer is selectively etched away.
Claim 7
Independent Claim
167 words
A method of fabricating a light emitting diode display package comprising the steps of: providing a substrate with a major surface; forming an array of light emitting diodes on the major surface of the substrate comprised of a plurality of indium-gallium-aluminum-phosphide (InGaAlP) light emitting diode structures, having a defined display area; forming a plurality of bond pads, in electrical cooperation with the array of light emitting diodes; providing a driver device formed on a silicon substrate, having a plurality of drive components formed therein; forming a plurality of bond pads, in electrical cooperation with the drive components, cooperatively positioned to engage the bond pads of the array of light emitting diodes; interfacing the plurality of bond pads, in electrical cooperation with the array of light emitting diodes, to the plurality of bond pads, in electrical cooperation with the drive components of the driver device, thereby electrically connecting the light emitting diode device to the driver device; and selectively removing the substrate from the light emitting diode device.
Claim 8
Independent Claim
167 words
A method of fabricating a light emitting diode display package comprising the steps of: providing a substrate with a major surface; forming an array of light emitting diodes on the major surface of the substrate comprised of a plurality of indium-gallium-aluminum-phosphide (InGaAlP) light emitting diode structures, having a defined display area; forming a plurality of bond pads, in electrical cooperation with the array of light emitting diodes; providing a driver device formed on a silicon substrate, having a plurality of drive components formed therein; forming a plurality of bond pads, in electrical cooperation with the drive components, cooperatively positioned to engage the bond pads of the array of light emitting diodes; interfacing the plurality of bond pads, in electrical cooperation with the array of light emitting diodes, to the plurality of bond pads, in electrical cooperation with the drive components of the driver device, thereby electrically connecting the light emitting diode device to the driver device; and selectively removing the substrate from the light emitting diode device.
Claim 9
Dependent Claim
116 words
A method of fabricating a light emitting diode display package as claimed in claim 6 wherein the step of forming a plurality of bond pads, in electrical cooperation with the array of light emitting diodes, includes the step of forming a plurality of row and column connection pads routed to the bond pads, in electrical cooperation with the array of light emitting diodes, located on an uppermost surface of the display area and the step of forming a plurality of bond pads, in electrical cooperation with the drive components, includes routing the bond pads to an uppermost surface of the driver device, cooperatively positioned to engage the bond pads of the array of light emitting diodes.
Claim 10
Dependent Claim
57 words
A method of fabricating a light emitting diode display package as claimed in claim 7 wherein the interfacing of the plurality of bond pads, in electrical cooperation with the array of light emitting diodes, to the plurality of bond pads in electrical cooperation with the driver device includes flip chip solder bump bonding of the bond pads.
Claim 11
Dependent Claim
44 words
A method of fabricating a light emitting diode display package as claimed in claim 8 further including the step of underfilling an area formed between the light emitting diode device and the driver device with one of a nonconductive polymer or an epoxy material.
Claim 12
Dependent Claim
29 words
A method of fabricating a light emitting diode display package as claimed in claim 6 wherein the step of providing a substrate includes providing a substrate of gallium arsenide.
Claim 13
Dependent Claim
134 words
A method of fabricating a light emitting diode display package as claimed in claim 6 wherein the step of forming an array of light emitting diodes further includes forming an etch stop layer of material on the major surface of the substrate, forming a conductive layer of material on the etch stop layer, forming a first carrier confinement layer on the conductive layer, forming an active layer on the first carrier confinement layer, forming a second carrier confinement layer on the active layer, selectively forming a conductive cap layer on the second carrier confinement layer to provide exposed surface areas of the second confinement layer, thereby defining exposed row areas and exposed column areas, with an array of diode light emitting areas covered by the conductive cap layer positioned in rows and columns therebetween.
Claim 14
Dependent Claim
40 words
A method of fabricating a light emitting diode display package as claimed in claim 6 wherein the step of forming an array of light emitting diodes further includes providing a plurality of LED contact metallizations, comprised of a reflective metal.
Claim 15
Dependent Claim
46 words
A method of fabricating a light emitting diode display package as claimed in claim 6 wherein the step of removing the substrate from the light emitting diode device includes selectively etching away the substrate, thereby leaving an indium-galium-aluminium-phosphide epilayer of the light emitting diode device exposed.
Claim 16
Dependent Claim
51 words
A method of fabricating a light emitting diode display package as claimed in claim 6 wherein the step of removing the substrate from the light emitting diode device includes a release layer, whereby the release layer is selectively etched away, leaving an indium-gallium-aluminum-phosphide epilayer of the light emitting diode chip exposed.
Claim 17
Independent Claim
242 words
A method of fabricating a light emitting diode display package comprising the steps of: providing a substrate of semiconductor material with a major surface; forming an array of light emitting diodes on the major surface of the substrate comprised of a plurality of indium-gallium-aluminum-phosphide (InGaAlP) light emitting diode structures, thereby forming a light emitting diode device having a defined display area; forming a plurality of bond pads, in electrical cooperation with the array of light emitting diodes, positioned on an uppermost surface of the display area; forming a plurality of row and column connections, routed to the plurality of bond pads in electrical cooperation with the array of light emitting diodes; providing a driver device formed on a silicon substrate, having a plurality of drive components formed therein; forming a plurality of bond pads, in electrical cooperation with the drive components, routed to an uppermost surface of the driver device, cooperatively positioned to engage the bond pads of the array of light emitting diodes; bump bonding the plurality of bond pads, in electrical cooperation with the array of light emitting diodes, to the plurality of bond pads, in electrical cooperation with the drive components of the driver device, thereby electrically connecting the light emitting diode device to the driver device; underfilling an area formed between the light emitting diode device and the driver device with a non-conductive material; and selectively removing the substrate of semiconductor material from the light emitting diode device.
Claim 18
Independent Claim
242 words
A method of fabricating a light emitting diode display package comprising the steps of: providing a substrate of semiconductor material with a major surface; forming an array of light emitting diodes on the major surface of the substrate comprised of a plurality of indium-gallium-aluminum-phosphide (InGaAlP) light emitting diode structures, thereby forming a light emitting diode device having a defined display area; forming a plurality of bond pads, in electrical cooperation with the array of light emitting diodes, positioned on an uppermost surface of the display area; forming a plurality of row and column connections, routed to the plurality of bond pads in electrical cooperation with the array of light emitting diodes; providing a driver device formed on a silicon substrate, having a plurality of drive components formed therein; forming a plurality of bond pads, in electrical cooperation with the drive components, routed to an uppermost surface of the driver device, cooperatively positioned to engage the bond pads of the array of light emitting diodes; bump bonding the plurality of bond pads, in electrical cooperation with the array of light emitting diodes, to the plurality of bond pads, in electrical cooperation with the drive components of the driver device, thereby electrically connecting the light emitting diode device to the driver device; underfilling an area formed between the light emitting diode device and the driver device with a non-conductive material; and selectively removing the substrate of semiconductor material from the light emitting diode device.
Claim 19
Dependent Claim
29 words
A method of fabricating a light emitting diode display package as claimed in claim 15 wherein the step of providing a substrate includes providing a substrate of gallium arsenide.
Claim 20
Dependent Claim
133 words
A method of fabricating a light emitting diode display package as claimed in claim 15 wherein the step of forming an array of light emitting diodes further includes forming an etch stop layer of material on the major surface of the substrate, forming a conductive layer on the etch stop layer, forming a first carrier confinement layer on the conductive layer, forming an active layer on the first carrier confinement layer, forming a second carrier confinement layer on the active layer, selectively forming a conductive cap layer on the second carrier confinement layer to provide exposed surface areas of the second carrier confinement layer, thereby defining exposed row areas and exposed column areas, with an array of diode light emitting areas covered by the conductive cap layer positioned in rows and columns therebetween.
Claim 21
Dependent Claim
40 words
A method of fabricating a light emitting diode display package as claimed in claim 15 wherein the step of forming an array of light emitting diodes further includes forming a plurality of LED contact metallizations, comprised of a reflective metal.
Claim 22
Dependent Claim
49 words
A method of fabricating a light emitting diode display package as claimed in claim 15 wherein the step of underfilling an area formed between the light emitting diode device and the driver device with a non-conductive material includes underfilling with one of a polymer material or an epoxy material.
Claim 23
Dependent Claim
50 words
A method of fabricating a light emitting diode display package as claimed in claim 15 wherein the step of removing the substrate of semiconductor material from the light emitting diode device includes selectively etching away the substrate, thereby leaving an indium-galium-aluminium-phosphide phosphide layer of the light emitting diode device exposed.
Claim 24
Dependent Claim
54 words
A method of fabricating a light emitting diode display package as claimed in claim 15 wherein the step of removing the substrate of semiconductor material from the light emitting diode device includes a release layer, whereby the release layer is selectively etched away, leaving an indium-galium-aluminium-phosphide epilayer of the light emitting diode device exposed.
Claim 25
Independent Claim
241 words
A method of fabricating a light emitting diode display package comprising the steps of: providing a substrate of gallium arsenide with a major surface; forming an array of light emitting diodes on the major surface of the substrate comprised of a plurality of indium-gallium-aluminum-phosphide (InGaAlP) light emitting diode structures, thereby forming a light emitting diode device having a defined display area; forming a plurality of bond pads in electrical cooperation with the array of light emitting diodes, positioned on an uppermost surface of the display area; forming a plurality of row and column connections, routed to the plurality of bond pads in electrical cooperation with the array of light emitting diodes; providing a separate driver device formed on a silicon substrate, having a plurality of drive components formed therein; forming a plurality of bond pads in electrical cooperation with the drive components, routed to an uppermost surface of the driver device; bump bonding the plurality of bond pads in electrical cooperation with the light emitting diodes, in flip chip attachment of the plurality of bond pads in electrical cooperation with the drive components of the driver device, thereby electrically connecting the light emitting diode device to the driver device; underfilling an area formed between the light emitting diode device and the driver device with at least one of an epoxy and a polymer; and selectively removing the gallium arsenide substrate from the light emitting diode device thereby leaving an exposed epilayer.
Claim 26
Independent Claim
241 words
A method of fabricating a light emitting diode display package comprising the steps of: providing a substrate of gallium arsenide with a major surface; forming an array of light emitting diodes on the major surface of the substrate comprised of a plurality of indium-gallium-aluminum-phosphide (InGaAlP) light emitting diode structures, thereby forming a light emitting diode device having a defined display area; forming a plurality of bond pads in electrical cooperation with the array of light emitting diodes, positioned on an uppermost surface of the display area; forming a plurality of row and column connections, routed to the plurality of bond pads in electrical cooperation with the array of light emitting diodes; providing a separate driver device formed on a silicon substrate, having a plurality of drive components formed therein; forming a plurality of bond pads in electrical cooperation with the drive components, routed to an uppermost surface of the driver device; bump bonding the plurality of bond pads in electrical cooperation with the light emitting diodes, in flip chip attachment of the plurality of bond pads in electrical cooperation with the drive components of the driver device, thereby electrically connecting the light emitting diode device to the driver device; underfilling an area formed between the light emitting diode device and the driver device with at least one of an epoxy and a polymer; and selectively removing the gallium arsenide substrate from the light emitting diode device thereby leaving an exposed epilayer.
Claim 27
Dependent Claim
152 words
A method of fabricating a light emitting diode display package as claimed in claim 22 wherein the step of forming an array of light emitting diodes on the major surface of the substrate, includes forming a plurality of layers of material on the substrate, including at least an etch stop layer of material, supported by the major surface of the substrate, a conductive layer of material on the etch stop layer, a first carrier confinement layer on the conductive layer, an active layer on the first carrier confinement layer, and a second carrier confinement layer on the active layer and implanting impurities in the plurality of layers of material into a plurality of isolated light emitting diodes positioned in an array of rows and columns and to form a plurality of vertical conductors through at least some of the plurality of layers to provide surface contacts to each diode in the array.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-07-13 | 2002-01-12 | 2002-07-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-07-13 | 2006-01-12 | 2006-07-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-07-13 | 2010-01-12 | 2010-07-14 | $7700.00 | Window Closed / Lapsed |