Process for collective manufacture of chips with electrodes selectively covered by a deposit

Claim 1

Process for collective manufacture of chips comprising electrodes selectively covered by a deposit, characterized in that the process comprises the following steps: a) make a set of chips (110, 210, 310, 410, 111, 211, 311, 411, 112, 212, 412, 113, 213, 413) on a substrate (100, 200, 300, 400), each comprising several electrodes (110a, 110b, 111a, 111b, 230, 231, 232, 233, 330, 331, 430, 431, 432, 433), b) individual validity test on each chip, and the formation of at least one network of electrical connections (117a, 117b, 370i, 370j, 370k, 370l, 465, 466, 467, 468, 499) for addressing at least one set of "matched" electrodes of different chips, each network being made in accordance with a given connections plan and electrically connecting valid chips to each other, c) make a deposit on electrodes in each set of matched electrodes in sequence, by dipping the substrate in an appropriate electrochemical bath and by applying appropriate polarization voltages on the connections network corresponding to the set of matched electrodes, to selectively provoke an electrochemical reaction on the electrodes in the set of matched electrodes.