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US5773369A Expired / Lapsed US ⏱️ 0.0 years remaining

Photoelectrochemical wet etching of group III nitrides

Assignee: University of California
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Filing: 1996-04-30
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Granted: 1998-06-30
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Expires: 2016-04-30
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Abstract

Abstract A method of processing semiconductor films and layers, especially Group III Nitride films, has been achieved, using laser-enhanced, room-temperature wet etching with dilute etchants. Etch rates of a few hundred Å/min up to a few thousand Å/min have been achieved for unintentionally doped n-type Group III Nitride films grown by MOCVD on a sapphire substrate. The etching is thought to take place photoelectrochemically with holes and electrons generated by incident illumination from 4.5 mW of HeCd laser power enhancing the oxidation and reduction reactions in an electrochemical cell.

Inventors

  • 👤 Evelyn Lynn Hu
  • 👤 Milan Singh Minsky

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-26 22:51
CPC Classifications
H; H10; H10P; H10P50/00; H10P50/60; H10P50/61; H10P50/617; C; C25; C25F; C25F3/00; C25F3/02; C25F3/12; C25F3/14

Claims Analysis

Total Claims: 13
Claim 1
Independent Claim 127 words
A method of wet etching a Group III Nitride semiconductor layer, comprising the steps of: overlaying the Group III Nitride semiconductor layer with a mask, wherein the mask defines a pattern to be transferred to the Group III Nitride semiconductor layer and facilitates a flow of photogenerated carriers from an area of the Group III Nitride semiconductor layer to be etched; immersing the Group III Nitride semiconductor layer in an etchant solution, the etchant solution being unable to etch the Group III Nitride semiconductor layer, the etchant solution further being unheated; and illuminating the immersed Group III Nitride semiconductor layer using an optical source containing frequencies above the bandgap of the Group III Nitride semiconductor layer, wherein the step of illuminating etches the Group III Nitride layer.
Claim 2
Independent Claim 127 words
A method of wet etching a Group III Nitride semiconductor layer, comprising the steps of: overlaying the Group III Nitride semiconductor layer with a mask, wherein the mask defines a pattern to be transferred to the Group III Nitride semiconductor layer and facilitates a flow of photogenerated carriers from an area of the Group III Nitride semiconductor layer to be etched; immersing the Group III Nitride semiconductor layer in an etchant solution, the etchant solution being unable to etch the Group III Nitride semiconductor layer, the etchant solution further being unheated; and illuminating the immersed Group III Nitride semiconductor layer using an optical source containing frequencies above the bandgap of the Group III Nitride semiconductor layer, wherein the step of illuminating etches the Group III Nitride layer.
Claim 3
Dependent Claim 31 words
The method of claim 1, wherein the method further comprises the step of coupling the mask to a conductive path which draws electrons from the mask to a higher electrical potential.
Claim 4
Dependent Claim 21 words
The method of claim 1, wherein a sidewall of the area to be etched substantially mirrors the geometry of the mask.
Claim 5
Dependent Claim 14 words
The method of claim 1, wherein an etch rate exceeds 100 angstroms per minute.
Claim 6
Dependent Claim 18 words
The method of claim 1, wherein the temperature of the etchant solution is less than 40 degrees centigrade.
Claim 7
Dependent Claim 22 words
The method of claim 1, wherein the mask comprises at least one of the group comprising: gold; silver; titanium; or composite metals.
Claim 8
Dependent Claim 15 words
The method of claim 1, wherein the power of the optical source is 4.5 mW.
Claim 9
Dependent Claim 30 words
The method of claim 1, wherein a concentration of the etchant solution is less than the concentration required to etch the Group III Nitride semiconductor layer without the optical source.
Claim 10
Dependent Claim 22 words
The method of claim 1, wherein the type of etchant solution is selected from the group comprising: Potassium Hydroxide; and Hydrochloric Acid.
Claim 11
Dependent Claim 15 words
The method of claim 1, wherein the Group III Nitride semiconductor layer comprises a heterostructure.
Claim 12
Independent Claim 121 words
A method of etching a Group III Nitride layer, comprising the steps of: overlaying the Group III Nitride layer with a mask, wherein the mask ensures an unimpeded flow of photogenerated carriers from an area of the layer to be etched; immersing the Group III Nitride layer in an etchant solution, the etchant solution being unable to etch the Group III Nitride layer, the etchant solution further being unheated; coupling the mask to a conductive path which draws electrons from the mask to a higher electrical potential; and illuminating the immersed Group III Nitride layer using an optical source containing frequencies above the bandgap of the Group III Nitride layer, wherein the step of illuminating etches the Group III Nitride layer.
Claim 13
Independent Claim 121 words
A method of etching a Group III Nitride layer, comprising the steps of: overlaying the Group III Nitride layer with a mask, wherein the mask ensures an unimpeded flow of photogenerated carriers from an area of the layer to be etched; immersing the Group III Nitride layer in an etchant solution, the etchant solution being unable to etch the Group III Nitride layer, the etchant solution further being unheated; coupling the mask to a conductive path which draws electrons from the mask to a higher electrical potential; and illuminating the immersed Group III Nitride layer using an optical source containing frequencies above the bandgap of the Group III Nitride layer, wherein the step of illuminating etches the Group III Nitride layer.

References Cited (Backward Citations)

US4559115A Cited
US4576691A Cited
US4613417A Cited
US4874484A Cited
DE4126916A1 Cited
US5454915A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2001-06-29 2001-12-29 2002-06-30 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2005-06-29 2005-12-29 2006-06-30 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2009-06-29 2009-12-29 2010-06-30 $7700.00 Window Closed / Lapsed

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