Patent US3671255A successfully refreshed from Google Patents.
US5773359A
Expired / Lapsed
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Interconnect system and method of fabrication
Assignee: NXP USA Inc
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Filing: 1995-12-26
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Granted: 1998-06-30
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Expires: 2015-12-26
Abstract
Abstract An interconnect system (31) includes an interconnect bump (29) over an under bump metallurgy (25). The under bump metallurgy (25) includes a barrier layer (26) having a barrier material such as titanium, an adhesion layer (28) having an adhesion material such as copper, and a mixture layer (27) having both the barrier material and the adhesion material. The mixture layer (27) is located between the barrier layer (26) and the adhesion layer (28), and the adhesion layer (28) is located between the mixture layer (27) and the interconnect bump (29). The interconnect bump (29) contains solder and is used as an etch mask when patterning the under bump metallurgy (25).
Inventors
- 👤 Douglas G. Mitchell
- 👤 Francis J. Carney
- 👤 Eric J. Woolsey
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 15:18
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/012; H10W72/01231; H10W72/01251; H10W72/019; H10W72/20; H10W72/251; H10W72/29; H10W72/90; H10W72/921; H10W72/923; H10W72/941; H10W72/9415; H10W72/951; H10W72/952
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
83 words
A method of manufacturing an interconnect system, the method comprising the steps of: providing a substrate; disposing an electrically conductive layer over the substrate; disposing a first layer over the electrically conductive layer, the first layer comprising a barrier material; disposing a second layer over the first layer, the second layer comprising an adhesion material and the barrier material; and disposing a third layer over the second layer after the step of disposing the second layer, the third layer comprising the adhesion material.
Claim 2
Independent Claim
83 words
A method of manufacturing an interconnect system, the method comprising the steps of: providing a substrate; disposing an electrically conductive layer over the substrate; disposing a first layer over the electrically conductive layer, the first layer comprising a barrier material; disposing a second layer over the first layer, the second layer comprising an adhesion material and the barrier material; and disposing a third layer over the second layer after the step of disposing the second layer, the third layer comprising the adhesion material.
Claim 3
Dependent Claim
18 words
The method according to claim 1, further comprising the step of providing a passivation layer over the substrate.
Claim 4
Dependent Claim
55 words
The method according to claim 1, further comprising the steps of: providing an interconnect bump over the third layer, the interconnect bump coupled to the electrically conductive layer through the first, second, and third layers; etching the first, second, and third layers; and using the interconnect bump as an etch mask during the etching step.
Claim 5
Dependent Claim
19 words
The method according to claim 3, further comprising the step of providing tin and lead for the interconnect bump.
Claim 6
Dependent Claim
28 words
The method according to claim 1, further comprising the steps of: sputtering a first metal for the first layer; and sputtering a second metal for the third layer.
Claim 7
Dependent Claim
24 words
The method according to claim 5, further comprising the step of: providing titanium for the first metal; and providing copper for the second metal.
Claim 8
Independent Claim
119 words
A method of manufacturing a semiconductor component, the method comprising the steps of: providing a semiconductor substrate; fabricating an integrated circuit in the semiconductor substrate; forming a metal layer over the semiconductor substrate, the metal layer coupled to the integrated circuit; sputtering a barrier layer over the metal layer, the barrier layer having a barrier material; sputtering a mixture layer over the barrier layer, the mixture layer having the barrier material and an adhesion material; sputtering an adhesion layer over the mixture layer, the adhesion layer having the adhesion material; forming an interconnect bump over the adhesion layer; and using the interconnect bump as an etch mask while etching the adhesion layer, the mixture layer, and the barrier layer.
Claim 9
Independent Claim
119 words
A method of manufacturing a semiconductor component, the method comprising the steps of: providing a semiconductor substrate; fabricating an integrated circuit in the semiconductor substrate; forming a metal layer over the semiconductor substrate, the metal layer coupled to the integrated circuit; sputtering a barrier layer over the metal layer, the barrier layer having a barrier material; sputtering a mixture layer over the barrier layer, the mixture layer having the barrier material and an adhesion material; sputtering an adhesion layer over the mixture layer, the adhesion layer having the adhesion material; forming an interconnect bump over the adhesion layer; and using the interconnect bump as an etch mask while etching the adhesion layer, the mixture layer, and the barrier layer.
Claim 10
Dependent Claim
24 words
The method according to claim 7, further comprising the steps of: providing copper for the adhesion material; and providing titanium for the barrier layer.
Claim 11
Dependent Claim
25 words
The method according to claim 8, wherein the step of forming an interconnect bump includes plating solder over the adhesion layer and the metal layer.
Claim 12
Dependent Claim
43 words
The method according to claim 8, wherein the step of using the interconnect bump as an etch mask includes using a solution comprising hydrogen peroxide, ammonium hydroxide, and (ethylenedinitrilo) tetraacetic acid tetrasodium salt, dihydrate to etch the mixture layer and the barrier layer.
Claim 13
Dependent Claim
43 words
The method according to claim 8, wherein the step of using the interconnect bump as an etch mask includes using a solution comprising hydrogen peroxide, ammonium hydroxide, and (ethylenedinitrilo) tetraacetic acid disodium salt, dihydrate to etch the mixture layer and the barrier layer.
References Cited (Backward Citations)
JPS57154858A
Cited
US5310699A
Cited
JPS61251153A
Cited
US5298459A
Cited
JPH02253628A
Cited
JPH04133330A
Cited
JPH0513421A
Cited
US5447599A
Cited
US5470787A
Cited
US5587336A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-06-29 | 2001-12-29 | 2002-06-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-06-29 | 2005-12-29 | 2006-06-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-06-29 | 2009-12-29 | 2010-06-30 | $7700.00 | Window Closed / Lapsed |