Molded encapsulated electronic component

Claim 1

The method of forming a molded encapsulated electronic component including a lead frame onto which is mounted an integrated circuit which comprises maintaining said lead frame in the lower half of an enveloping mold cavity having upper and lower mold halves; placing on said lead frame a thin, elastomeric, anisotropic, electrically conductive, compliant interconnect having a first and a second face, the first face of said interconnect being in contact with said lead frame; placing the first face of an integrated circuit, having a first face and a second face on the second face of said interconnect; positioning an enclosing upper mold half having a cavity wall adapted to receive said second face of said integrated circuit, on said lower mold half, said upper mold half pressing against said integrated circuit and said elastomeric, anisotropic, electrically conductive, compliant interconnect thereby compressing the latter and maintaining said integrated circuit in a predetermined position within said enclosed mold, said second face of said integrated circuit being coplanar with the cavity wall of said upper mold half; admitting to the interior of said mold cavity a shear-thinning, thermosetting plastic; curing said shear thinning, thermosetting plastic thereby forming a molded electronic component including said lead frame bearing said thin compressed, elastomeric anisotropic, compliant, electronically conductive interconnect on which is mounted said integrated circuit wherein said elastomeric, anisotropic, electrically conductive, compliant interconnect is maintained in a compressed state; and, recovering said molded electronic component including said lead frame bearing said thin, compressed, elastomeric anisotropic, compliant, electrically conductive, interconnect on which is mounted said integrated circuit.

Claim 2

The method of forming a molded encapsulated electronic component including a lead frame onto which is mounted an integrated circuit which comprises maintaining said lead frame in the lower half of an enveloping mold cavity having upper and lower mold halves; placing on said lead frame a thin, elastomeric, anisotropic, electrically conductive, compliant interconnect having a first and a second face, the first face of said interconnect being in contact with said lead frame; placing the first face of an integrated circuit, having a first face and a second face on the second face of said interconnect; positioning an enclosing upper mold half having a cavity wall adapted to receive said second face of said integrated circuit, on said lower mold half, said upper mold half pressing against said integrated circuit and said elastomeric, anisotropic, electrically conductive, compliant interconnect thereby compressing the latter and maintaining said integrated circuit in a predetermined position within said enclosed mold, said second face of said integrated circuit being coplanar with the cavity wall of said upper mold half; admitting to the interior of said mold cavity a shear-thinning, thermosetting plastic; curing said shear thinning, thermosetting plastic thereby forming a molded electronic component including said lead frame bearing said thin compressed, elastomeric anisotropic, compliant, electronically conductive interconnect on which is mounted said integrated circuit wherein said elastomeric, anisotropic, electrically conductive, compliant interconnect is maintained in a compressed state; and, recovering said molded electronic component including said lead frame bearing said thin, compressed, elastomeric anisotropic, compliant, electrically conductive, interconnect on which is mounted said integrated circuit.

Claim 8

A method of forming a molded encapsulated electronic component including a lead frame onto which is mounted an integrated circuit which comprises: maintaining said lead frame in an enveloping cavity of a mold lower half; placing on said lead frame a thin anisotropically conductive elastomer having a first face and a second face, wherein said first face is in contact with said lead frame; placing an integrated circuit having a first face and a second face, on said second face of said thin anisotropically conductive elastomer; positioning a mold upper half having a cavity adapted to receive said second face of said integrated circuit, on said mold lower half, said mold upper half pressing against said integrated circuit and said thin anisotropically conductive elastomer thereby placing said thin anisotropically conductive elastomer in a compressed state and maintaining said integrated circuit in a predetermined position within said cavity of said mold upper half, wherein said enveloping cavity of said mold upper half and said cavity of said mold lower half define an interior cavity; admitting to said interior cavity an encapsulating material; curing said encapsulating material thereby forming a molded electronic component wherein said thin anisotropically conductive elastomer is maintained in said compressed state.

Claim 9

A method of forming a molded encapsulated electronic component including a lead frame onto which is mounted an integrated circuit which comprises: maintaining said lead frame in an enveloping cavity of a mold lower half; placing on said lead frame a thin anisotropically conductive elastomer having a first face and a second face, wherein said first face is in contact with said lead frame; placing an integrated circuit having a first face and a second face, on said second face of said thin anisotropically conductive elastomer; positioning a mold upper half having a cavity adapted to receive said second face of said integrated circuit, on said mold lower half, said mold upper half pressing against said integrated circuit and said thin anisotropically conductive elastomer thereby placing said thin anisotropically conductive elastomer in a compressed state and maintaining said integrated circuit in a predetermined position within said cavity of said mold upper half, wherein said enveloping cavity of said mold upper half and said cavity of said mold lower half define an interior cavity; admitting to said interior cavity an encapsulating material; curing said encapsulating material thereby forming a molded electronic component wherein said thin anisotropically conductive elastomer is maintained in said compressed state.