US5770981A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Composite microwave circuit module having a pseudo-waveguide structure
Assignee: NEC Corp
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Filing: 1996-03-28
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Granted: 1998-06-23
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Expires: 2016-03-28
Abstract
Abstract A composite microwave circuit module includes a multilayer dielectric substrate, upper- and lower-surface grounds, an antenna pattern, a plurality of shield via holes, and a large number of first holes. The upper- and lower-surface grounds are formed on upper and lower surfaces of the multilayer dielectric substrate, respectively, and the upper-surface ground has an opening portion for waveguide coupling. The antenna pattern is formed on an interlayer of the multilayer dielectric substrate by a high-frequency signal line in correspondence with the opening portion. The plurality of shield via holes are formed around the antenna pattern and filled with a filler material to form a pseudo waveguide structure. The first holes have cavities formed in the multilayer dielectric substrate in correspondence with the pseudo waveguide structure between the antenna pattern and the opening portion of the upper-surface substrate. A method of manufacturing this circuit module is also disclosed.
Inventors
- 👤 Takao Koizumi
- 👤 Yuhei Kosugi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 18:04
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/20; H01; H01P; H01P11/00; H01Q; H01Q1/00; H01Q1/36; H01Q1/38; H01Q1/52; H01Q1/526; H01Q9/00; H01Q9/04; H01Q9/0407; H10W44/203; H10W44/216; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49016
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
153 words
A composite microwave circuit module comprising: a multilayer dielectric substrate; upper- and lower-surface grounds provided on upper and lower surfaces of said multilayer dielectric substrate, respectively, said upper-surface ground having an opening portion for waveguide coupling; an antenna pattern disposed on an interlayer of said multilayer dielectric substrate comprised of a high-frequency signal line in correspondence with the opening portion; a plurality of shield via holes provided surrounding said antenna pattern, the shield via holes including a filling of a filler material to define a pseudo waveguide structure; a large number of first holes having cavities provided in said multilayer dielectric substrate in correspondence with said pseudo waveguide structure between said antenna pattern and the opening portion of said upper-surface ground; and a cavity provided in said multilayer dielectric substrate in correspondence with said pseudo waveguide structure between said antenna pattern and said lower-substrate ground, and a metal cap for sealing the cavity.
Claim 2
Dependent Claim
153 words
A composite microwave circuit module comprising: a multilayer dielectric substrate; upper- and lower-surface grounds provided on upper and lower surfaces of said multilayer dielectric substrate, respectively, said upper-surface ground having an opening portion for waveguide coupling; an antenna pattern disposed on an interlayer of said multilayer dielectric substrate comprised of a high-frequency signal line in correspondence with the opening portion; a plurality of shield via holes provided surrounding said antenna pattern, the shield via holes including a filling of a filler material to define a pseudo waveguide structure; a large number of first holes having cavities provided in said multilayer dielectric substrate in correspondence with said pseudo waveguide structure between said antenna pattern and the opening portion of said upper-surface ground; and a cavity provided in said multilayer dielectric substrate in correspondence with said pseudo waveguide structure between said antenna pattern and said lower-substrate ground, and a metal cap for sealing the cavity.
Claim 3
Dependent Claim
37 words
A module according to claim 1, further comprising a large number of second holes having cavities provided in said multilayer dielectric substrate in correspondence with said pseudo waveguide structure between said antenna pattern and said lower-surface ground.
Claim 4
Dependent Claim
21 words
A module according to claim 1, wherein the first holes are provided by through holes extending through said multilayer dielectric substrate.
Claim 5
Dependent Claim
20 words
A module according to claim 1, wherein the first holes are arranged in a matrix, thereby obtaining a uniform distribution.
Claim 6
Dependent Claim
47 words
A module according to claim 1, wherein said multilayer dielectric substrate is constituted by a first layer between said high-frequency signal line and said upper-surface ground, and a second layer between said high-frequency signal line and said lower-surface ground, said first and second layers having different permittivities.
Claim 7
Dependent Claim
29 words
A module according to claim 1, further comprising a waveguide electrically and physically connected to the opening portion of said upper-surface ground and coupled to said pseudo waveguide structure.
Claim 8
Dependent Claim
40 words
A module according to claim 6, wherein said waveguide has a low-impedance structure from a connection portion of the opening portion of said upper-surface ground to a point corresponding to 1/4 of a wavelength of a radio wave in use.
Claim 9
Dependent Claim
160 words
A composite microwave circuit module comprising: a multilayer dielectric substrate; upper- and lower-surface grounds provided on upper and lower surfaces of said multilayer dielectric substrate, respectively, said upper-surface ground having an opening portion for waveguide coupling; an antenna pattern disposed on an interlayer of said multilayer dielectric substrate comprised of a high-frequency signal line in correspondence with the opening portion; a plurality of shield via holes provided surrounding said antenna pattern, the shield via holes including a filling of a filler material to define a pseudo waveguide structure; a large number of first holes having cavities provided in said multilayer dielectric substrate in correspondence with said pseudo waveguide structure between said antenna pattern and the opening portion of said upper-surface around; a waveguide electrically and physically connected to the opening portion of said upper-surface ground and coupled to said pseudo waveguide structure; and a pressurized anisotropic conductive film electrically connecting the opening portion of said upper-surface ground to said waveguide.
Claim 10
Dependent Claim
160 words
A composite microwave circuit module comprising: a multilayer dielectric substrate; upper- and lower-surface grounds provided on upper and lower surfaces of said multilayer dielectric substrate, respectively, said upper-surface ground having an opening portion for waveguide coupling; an antenna pattern disposed on an interlayer of said multilayer dielectric substrate comprised of a high-frequency signal line in correspondence with the opening portion; a plurality of shield via holes provided surrounding said antenna pattern, the shield via holes including a filling of a filler material to define a pseudo waveguide structure; a large number of first holes having cavities provided in said multilayer dielectric substrate in correspondence with said pseudo waveguide structure between said antenna pattern and the opening portion of said upper-surface around; a waveguide electrically and physically connected to the opening portion of said upper-surface ground and coupled to said pseudo waveguide structure; and a pressurized anisotropic conductive film electrically connecting the opening portion of said upper-surface ground to said waveguide.
References Cited (Backward Citations)
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