Patent US5763300A successfully refreshed from Google Patents.
← Back to Patent Explorer
US5763300A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of fabricating microelectronic capacitors having tantalum pentoxide dielectrics and oxygen barriers

Assignee: Mosaid Technologies Inc
•
Filing: 1996-09-10
•
Granted: 1998-06-09
•
Expires: 2016-09-10
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A microelectronic capacitor is formed by nitrating the surface of a conducting electrode on a microelectronic substrate. The nitrated surface of the conductive electrode is then oxidized. The nitrating and oxidizing steps collectively form a film of silicon oxynitride on the conductive electrode. A tantalum pentoxide film is then formed on the oxidized and nitrated surface of the conductive electrode. The tantalum pentoxide film may then be thermally treated in the presence of oxygen gas. High performance microelectronic capacitors are thereby provided.

Inventors

  • 👤 In-sung Park
  • 👤 Kyung-hoon Kim

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 12:33
CPC Classifications
H; H10; H10D; H10D1/00; H10D1/60; H10D1/68; H10P; H10P14/00; H10P14/60

Claims Analysis

Total Claims: 20
Claim 1
Independent Claim 51 words
A method of fabricating a microelectronic capacitor comprising the steps of: forming a silicon oxynitride film on a conductive electrode on a microelectronic substrate; and forming a tantalum pentoxide film on the silicon oxynitride film, the tantalum pentoxide film being spaced apart from the conductive electrode by the silicon oxynitride film.
Claim 2
Independent Claim 51 words
A method of fabricating a microelectronic capacitor comprising the steps of: forming a silicon oxynitride film on a conductive electrode on a microelectronic substrate; and forming a tantalum pentoxide film on the silicon oxynitride film, the tantalum pentoxide film being spaced apart from the conductive electrode by the silicon oxynitride film.
Claim 3
Dependent Claim 33 words
A method according to claim 1 wherein said step of forming a tantalum pentoxide film is followed by the step of: thermally treating the tantalum pentoxide film in the presence of oxygen gas.
Claim 4
Dependent Claim 29 words
A method according to claim 1 wherein said tantalum pentoxide film forming step is followed by the step of forming a second conductive electrode on the tantalum pentoxide film.
Claim 5
Dependent Claim 29 words
A method according to claim 2 wherein said thermally treating step is followed by the step of forming a second conductive electrode on the thermally treated tantalum pentoxide film.
Claim 6
Independent Claim 46 words
A method of fabricating a microelectronic capacitor comprising the steps of: nitrating the surface of a conductive electrode on a microelectronic substrate; oxidizing the nitrated surface of the conductive electrode; and forming a tantalum pentoxide film on the oxidized and nitrated surface of the conductive electrode.
Claim 7
Independent Claim 46 words
A method of fabricating a microelectronic capacitor comprising the steps of: nitrating the surface of a conductive electrode on a microelectronic substrate; oxidizing the nitrated surface of the conductive electrode; and forming a tantalum pentoxide film on the oxidized and nitrated surface of the conductive electrode.
Claim 8
Dependent Claim 25 words
A method according to claim 5 wherein said nitrating step and said oxidizing step collectively form a film of silicon oxynitride on the conductive electrode.
Claim 9
Dependent Claim 33 words
A method according to claim 5 wherein said step of forming a tantalum pentoxide film is followed by the step of: thermally treating the tantalum pentoxide film in the presence of oxygen gas.
Claim 10
Dependent Claim 29 words
A method according to claim 5 wherein said tantalum pentoxide film forming step is followed by the step of forming a second conductive electrode on the tantalum pentoxide film.
Claim 11
Dependent Claim 29 words
A method according to claim 7 wherein said thermally treating step is followed by the step of forming a second conductive electrode on the thermally treated tantalum pentoxide film.
Claim 12
Dependent Claim 18 words
A method according to claim 5 wherein said nitrating step is performed in a rapid thermal processing furnace.
Claim 13
Dependent Claim 32 words
A method according to claim 5 wherein said nitrating step is performed at temperatures between about 800° C. and about 900° C. for times between about 10 seconds and about 200 seconds.
Claim 14
Dependent Claim 30 words
A method according to claim 5 wherein the following step is performed between said steps of nitrating and oxidizing: transferring the nitrated microelectronic substrate to an oxidizing station under vacuum.
Claim 15
Dependent Claim 28 words
A method according to claim 5 wherein the following step is performed between said steps of nitrating and oxidizing: performing a nitrogen purge on the nitrated microelectronic substrate.
Claim 16
Dependent Claim 27 words
A method according to claim 5 wherein said nitrating step is performed using at least one of NH 3 , N 2 O and N 2 gasses.
Claim 17
Dependent Claim 20 words
A method according to claim 7 wherein said step of thermally treating is performed in a rapid thermal processing furnace.
Claim 18
Dependent Claim 31 words
A method according to claim 5 wherein said nitrating step is preceded by the step of: transferring the microelectronic substrate having a conductive electrode thereon to a nitrating station under vacuum.
Claim 19
Dependent Claim 26 words
A method according to claim 5 wherein the following step is performed prior to said step of nitrating: performing a nitrogen purge on the microelectronic substrate.
Claim 20
Dependent Claim 33 words
A method according to claim 7 wherein said thermally treating step is performed at temperatures between about 800° C. and about 900° C. for times between about 10 seconds and about 200 seconds.

References Cited (Backward Citations)

US5452178A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2001-06-08 2001-12-08 2002-06-09 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2005-06-08 2005-12-08 2006-06-09 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2009-06-08 2009-12-08 2010-06-09 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag