Patent US5760469A successfully refreshed from Google Patents.
US5760469A
Expired / Lapsed
US
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Semiconductor device and semiconductor device mounting board
Assignee: Fujitsu Ltd
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Filing: 1996-02-16
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Granted: 1998-06-02
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Expires: 2016-02-16
Abstract
Abstract A semiconductor device includes a package having opposing surfaces, a first terminal for an outer connection supported by said package and electronic components supported by said package, and the opposing surfaces of the package having slits so that a shape of the package can be changed in a mounted state. Therefore, stress applied to soldered junctions of the first and second terminals is decreased.
Inventors
- 👤 Yutaka Higashiguchi
- 👤 Mitsuo Inagaki
- 👤 Toshio Kumai
- 👤 Ryoichi Ochiai
- 👤 Yasuhiro Teshima
- 👤 Mamoru Niishiro
- 👤 Yasushi Kobayashi
- 👤 Hideaki Tamura
- 👤 Hiroshi Iimura
- 👤 Seishi Chiba
- 👤 Yukio Sekiya
- 👤 Shuzo Igarashi
- 👤 Yasuhiro Ichihara
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-10 02:30
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W90/00; H10W90/701; H05K1/00; H05K1/02; H05K1/0271; H05K2201/00; H05K2201/06; H05K2201/068; H05K2201/09; H05K2201/09009; H05K2201/09036; H05K2201/10; H05K2201/10431; H05K2201/10439; H05K2201/10477; H05K2201/10568; H05K2201/10613; H05K2201/10621; H05K2201/10666; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W90/751; H10W90/754; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
90 words
A semiconductor device comprising: a package having opposing surfaces, each opposing surface having slits formed thereon, a first terminal supported by said package; an electronic component supported by said package; and a mother board supporting a second terminal, wherein the slits allow a shape of said package to be changed in a mounted state, when said first terminal is connected by a soldered junction to said second terminal provided on the mother board, so that stress applied to the soldered junction of said first and second terminals can be decreased.
Claim 2
Dependent Claim
90 words
A semiconductor device comprising: a package having opposing surfaces, each opposing surface having slits formed thereon, a first terminal supported by said package; an electronic component supported by said package; and a mother board supporting a second terminal, wherein the slits allow a shape of said package to be changed in a mounted state, when said first terminal is connected by a soldered junction to said second terminal provided on the mother board, so that stress applied to the soldered junction of said first and second terminals can be decreased.
Claim 3
Dependent Claim
21 words
The semiconductor device as claimed in claim 1, wherein said slits are formed in straight lines extending in two different directions.
Claim 4
Dependent Claim
19 words
The semiconductor device as claimed in claim 1, wherein each of said slits has a cross-section of substantially V-shape.
Claim 5
Dependent Claim
22 words
The semiconductor device as claimed in claim 1, wherein said first terminal includes at least one solder bump having substantially a ball-shape.
Claim 6
Dependent Claim
68 words
A semiconductor device, comprising: a substantially planar package having first and second opposing surfaces; a slit formed on each surface; and a first terminal supported by said package for electrically connecting the package to a second terminal provided on a mother board, wherein, when the package is mounted on the mother board, the slit makes the package flexible to conform to a non-planar shape of the mother board.
Claim 7
Dependent Claim
68 words
A semiconductor device, comprising: a substantially planar package having first and second opposing surfaces; a slit formed on each surface; and a first terminal supported by said package for electrically connecting the package to a second terminal provided on a mother board, wherein, when the package is mounted on the mother board, the slit makes the package flexible to conform to a non-planar shape of the mother board.
Claim 8
Dependent Claim
40 words
The semiconductor device as claimed in claim 5, wherein the slit on each surface is a plurality of slits, and wherein said plurality of slits on each surface is formed in straight lines extending in first and second different directions.
Claim 9
Dependent Claim
19 words
The semiconductor device as claimed in claim 5, wherein each of said slits has a cross-section of substantially V-shape.
Claim 10
Dependent Claim
20 words
The semiconductor device as claimed in claim 5, wherein said first terminal is a solder bump having substantially a ballshape.
Claim 11
Dependent Claim
28 words
The semiconductor device as recited in claim 5, wherein the slit is a plurality of slits, a majority of which is formed at a periphery of the package.
Claim 12
Dependent Claim
18 words
The semiconductor device as claimed in claim 6, wherein the first direction is perpendicular to the second direction.
Claim 13
Dependent Claim
98 words
A semiconductor device comprising: a substantially planar package having first and second opposing surfaces; a slit formed on each surface; and a first terminal supported by said package for electrically connecting the package to a second terminal provided on a mother board, wherein, when the package is mounted on the mother board, the slit makes the package flexible to conform to a non-planar shape of the mother board, wherein the first terminal is a plurality of first terminals, wherein the slit is a plurality of slits, and wherein each slit is located between two of the first terminals.
Claim 14
Dependent Claim
98 words
A semiconductor device comprising: a substantially planar package having first and second opposing surfaces; a slit formed on each surface; and a first terminal supported by said package for electrically connecting the package to a second terminal provided on a mother board, wherein, when the package is mounted on the mother board, the slit makes the package flexible to conform to a non-planar shape of the mother board, wherein the first terminal is a plurality of first terminals, wherein the slit is a plurality of slits, and wherein each slit is located between two of the first terminals.
Claim 15
Dependent Claim
28 words
The semiconductor device as claimed in claim 11, p1 wherein the slits are formed in longitudinal and transverse directions crossing each other between each of the first terminals.
Claim 16
Dependent Claim
28 words
The semiconductor device as claimed in claim 11, wherein said plurality of slits on each surface is formed in straight lines extending in first and second different directions.
Claim 17
Dependent Claim
19 words
The semiconductor device as claimed in claim 11, wherein each of said slits has a cross-section of substantially V-shape.
Claim 18
Dependent Claim
20 words
The semiconductor device as claimed in claim 11, wherein said first terminal is a solder bump having substantially a ball-shape.
Claim 19
Dependent Claim
31 words
The semiconductor package as recited in claim 11, wherein the slit on each surface is a plurality of slits, a majority of which is formed at a periphery of the package.
Claim 20
Dependent Claim
18 words
The semiconductor device as claimed in claim 13, wherein the first direction is perpendicular to the second direction.
Claim 21
Dependent Claim
89 words
A semiconductor device, comprising: a substantially planar package having first and second opposing surfaces; a slit formed on each surface; and a first terminal supported by said package for electrically connecting the package to a second terminal provided on a mother board, wherein, when the package is mounted on the mother board, the slit makes the package flexible to conform to a non-planar shape of the mother board, wherein the slit is a plurality of slits, a majority of which is formed at a central area of the package.
Claim 22
Dependent Claim
89 words
A semiconductor device, comprising: a substantially planar package having first and second opposing surfaces; a slit formed on each surface; and a first terminal supported by said package for electrically connecting the package to a second terminal provided on a mother board, wherein, when the package is mounted on the mother board, the slit makes the package flexible to conform to a non-planar shape of the mother board, wherein the slit is a plurality of slits, a majority of which is formed at a central area of the package.
Claim 23
Dependent Claim
28 words
The semiconductor device as claimed in claim 18, wherein said plurality of slits on each surface is formed in straight lines extending in first and second different directions.
Claim 24
Dependent Claim
19 words
The semiconductor device as claimed in claim 18, wherein each of said slits has a cross-section of substantially V-shape.
Claim 25
Dependent Claim
20 words
The semiconductor device as claimed in claim 18, wherein said first terminal is a solder bump having substantially a ball-shape.
Claim 26
Dependent Claim
18 words
The semiconductor device as claimed in claim 19, wherein the first direction is perpendicular to the second direction.
Claim 27
Dependent Claim
88 words
A semiconductor device, comprising: a package having first and second opposing surfaces, each opposing surface having slits formed thereon which do not extend to the opposing surface; a through hole extending between and opening to said first and second surfaces; a first terminal supported by said package; an electronic component supported by said package; and a mother board supporting a second terminal, wherein, when the package is mounted on the mother board, the slits make the package flexible to conform to a non-planar shape of the mother board.
Claim 28
Dependent Claim
88 words
A semiconductor device, comprising: a package having first and second opposing surfaces, each opposing surface having slits formed thereon which do not extend to the opposing surface; a through hole extending between and opening to said first and second surfaces; a first terminal supported by said package; an electronic component supported by said package; and a mother board supporting a second terminal, wherein, when the package is mounted on the mother board, the slits make the package flexible to conform to a non-planar shape of the mother board.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-06-01 | 2001-12-01 | 2002-06-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-06-01 | 2005-12-01 | 2006-06-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-06-01 | 2009-12-01 | 2010-06-02 | $7700.00 | Window Closed / Lapsed |