Semiconductor device lead frame having sunk die pad portions

Claim 1

A lead frame and pressure sensor assembly comprising: a unitary lead frame including: an annular outer frame having four sides and lying in a first plane; a die pad disposed within said frame comprising one main die pad and two auxiliary die pads separate from and disposed on opposite sides of said main die pad, said main and auxiliary die pads being commonly disposed in a second plane spaced from the first plane; a main die pad supporting lead connected to a first side of said frame and to said main die pad and two auxiliary die pad supporting leads connected to a second side of said frame opposite the first side of said frame and to said two auxiliary die pads, respectively, each supporting lead having a predetermined length so that said main die pad and said two auxiliary die pads lie in the second plane, said main die pad supporting lead and said auxiliary die pad supporting leads respectively extending inwardly from said frame in opposite directions; at least one connecting lead extending inwardly from said frame for establishing an electrical connection to an element mounted on said main die pad and said two auxiliary die pads; and a semiconductor pressure detecting element mounted on said main die pad and said two auxiliary die pads.