Patent US5751556A successfully refreshed from Google Patents.
US5751556A
Expired / Lapsed
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Method and apparatus for reducing warpage of an assembly substrate
Assignee: Intel Corp
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Filing: 1996-03-29
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Granted: 1998-05-12
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Expires: 2016-03-29
Abstract
Abstract A method and apparatus for reducing warpage of an assembly substrate and providing registration between a surface mount technology (SMT) component and the assembly substrate. The SMT component includes mounting pins extending from the component and capable of engaging corresponding apertures in the assembly substrate. Each mounting pin is registrable with a corresponding aperture in the assembly substrate. The mounting pins are capable of providing an interference fit between the SMT component and the assembly substrate.
Inventors
- 👤 Peter O. Butler
- 👤 Ricardo E. Suarez-Gartner
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 21:47
CPC Classifications
H; H01; H01R; H01R12/00; H01R12/50; H01R12/51; H01R12/55; H01R12/57; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H05K2201/00; H05K2201/10; H05K2201/10431; H05K2201/10568; H05K2201/10598; H05K2201/10613; H05K2201/10621; H05K2201/10734; H05K2203/00; H05K2203/16; H05K2203/167; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
71 words
An apparatus for reducing warpage of an assembly substrate with respect to a surface mount technology (SMT) component, said assembly substrate including a plurality of apertures therethrough, said apparatus comprising: a plurality of mounting pins extending from said SMT component, said mounting pins corresponding to and registrable with said apertures in said assembly substrate, said mounting pins adapted to provide an interference fit between said SMT component and said assembly substrate.
Claim 2
Independent Claim
71 words
An apparatus for reducing warpage of an assembly substrate with respect to a surface mount technology (SMT) component, said assembly substrate including a plurality of apertures therethrough, said apparatus comprising: a plurality of mounting pins extending from said SMT component, said mounting pins corresponding to and registrable with said apertures in said assembly substrate, said mounting pins adapted to provide an interference fit between said SMT component and said assembly substrate.
Claim 3
Dependent Claim
21 words
The apparatus of claim 1 wherein each mounting pin provides a snap-fit connection between said SMT component and said assembly substrate.
Claim 4
Dependent Claim
24 words
The apparatus of claim 1 wherein each mounting pin is tapered to provide a press-fit connection between said SMT component and said assembly substrate.
Claim 5
Dependent Claim
31 words
The apparatus of claim 1 further including a plurality of self-capturing fasteners adapted to be secured to said plurality of mounting pins to secure said SMT component to said assembly substrate.
Claim 6
Dependent Claim
28 words
The apparatus of claim 1 wherein each mounting pin includes an annular shoulder to maintain a substantially uniform separation distance between said SMT component and said assembly substrate.
Claim 7
Independent Claim
71 words
An apparatus for reducing warpage of an assembly substrate with respect to a surface mount technology (SMT) component, said SMT component including a plurality of apertures therein, said apparatus comprising: a plurality of mounting pins extending from said assembly substrate, said mounting pins corresponding to and registrable with said apertures in said SMT component, said mounting pins adapted to provide an interference fit between said assembly substrate and said SMT component.
Claim 8
Independent Claim
71 words
An apparatus for reducing warpage of an assembly substrate with respect to a surface mount technology (SMT) component, said SMT component including a plurality of apertures therein, said apparatus comprising: a plurality of mounting pins extending from said assembly substrate, said mounting pins corresponding to and registrable with said apertures in said SMT component, said mounting pins adapted to provide an interference fit between said assembly substrate and said SMT component.
Claim 9
Dependent Claim
21 words
The apparatus of claim 6 wherein each mounting pin provides a snap-fit connection between said assembly substrate and said SMT component.
Claim 10
Dependent Claim
24 words
The apparatus of claim 6 wherein each mounting pin is tapered to provide a press-fit connection between said assembly substrate and said SMT component.
Claim 11
Dependent Claim
31 words
The apparatus of claim 6 further including a plurality of self-capturing fasteners adapted to be secured to said plurality of mounting pins to secure said assembly substrate to said SMT component.
Claim 12
Dependent Claim
28 words
The apparatus of claim 6 wherein each mounting pin includes an annular shoulder to maintain a substantially uniform separation distance between said assembly substrate and said SMT component.
Claim 13
Independent Claim
96 words
An apparatus for providing registration between an assembly substrate and a surface mount technology (SMT) component, said assembly substrate including a plurality of apertures therethrough, said apparatus comprising: a plurality of mounting pins extending from said SMT component, said mounting pins corresponding to and registrable with said apertures in said assembly substrate, said mounting pins adapted to engage said apertures in said assembly substrate to register said SMT component with said assembly substrate wherein the interaction between said mounting pins and said apertures in said assembly substrate securely joins said SMT component to said assembly substrate.
Claim 14
Independent Claim
96 words
An apparatus for providing registration between an assembly substrate and a surface mount technology (SMT) component, said assembly substrate including a plurality of apertures therethrough, said apparatus comprising: a plurality of mounting pins extending from said SMT component, said mounting pins corresponding to and registrable with said apertures in said assembly substrate, said mounting pins adapted to engage said apertures in said assembly substrate to register said SMT component with said assembly substrate wherein the interaction between said mounting pins and said apertures in said assembly substrate securely joins said SMT component to said assembly substrate.
Claim 15
Dependent Claim
28 words
The apparatus of claim 11 wherein each mounting pin includes an annular shoulder to maintain a substantially uniform separation distance between said SMT component and said assembly substrate.
Claim 16
Dependent Claim
33 words
The apparatus of claim 11 wherein each mounting pin includes a first diameter and each aperture in said assembly substrate includes a second diameter, said first diameter being less than said second diameter.
Claim 17
Independent Claim
98 words
A method for reducing warpage of an assembly substrate with respect to a surface mount technology (SMT) component, wherein said assembly substrate includes a plurality of apertures therethrough and said SMT component includes a plurality of mounting pins extending therefrom, said method comprising the steps of: aligning said plurality of mounting pins with said plurality of apertures in said assembly substrate; inserting said plurality of mounting pins into said plurality of apertures in said assembly substrate; and urging said SMT component toward said assembly substrate to generate an interference fit between said SMT component and said assembly substrate.
Claim 18
Independent Claim
98 words
A method for reducing warpage of an assembly substrate with respect to a surface mount technology (SMT) component, wherein said assembly substrate includes a plurality of apertures therethrough and said SMT component includes a plurality of mounting pins extending therefrom, said method comprising the steps of: aligning said plurality of mounting pins with said plurality of apertures in said assembly substrate; inserting said plurality of mounting pins into said plurality of apertures in said assembly substrate; and urging said SMT component toward said assembly substrate to generate an interference fit between said SMT component and said assembly substrate.
Claim 19
Dependent Claim
24 words
The method of claim 14 further including the step of maintaining a substantially uniform separation distance between said SMT component and said assembly substrate.
Claim 20
Dependent Claim
23 words
The apparatus of claim 1 wherein said SMT component is in electrical contact with said assembly substrate when said interference fit is established.
Claim 21
Dependent Claim
23 words
The apparatus of claim 6 wherein said SMT component is in electrical contact with said assembly substrate when said interference fit is established.
Claim 22
Dependent Claim
23 words
The apparatus of claim 11 wherein said SMT component is in electrical contact with said assembly substrate when said interference fit is established.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-05-11 | 2001-11-10 | 2002-05-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-05-11 | 2005-11-10 | 2006-05-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-05-11 | 2009-11-10 | 2010-05-12 | $7700.00 | Window Closed / Lapsed |