US5738568A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Flexible tilted wafer carrier
Assignee: International Business Machines Corp
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Filing: 1996-10-04
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Granted: 1998-04-14
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Expires: 2016-10-04
Abstract
Abstract Disclosed is an improved apparatus and method for polishing a semiconductor wafer, which involves mounting the wafer to a carrier assembly. The wafer carrier assembly has been split into two plates which are joined by springs around the peripheries. The wafer carrier assembly is universally mounted on a rotation shaft which rotates the wafer carrier assembly during cleaning. An adjustment screw tilts the upper plate relative to the lower plate. The adjustment screw can be located at any predetermined point on a circle around the rotation shaft. Since the bottom plate is forced relatively flat by contact with a polishing pad, the net effect of the wafer carrier assembly is to apply increased pressure to the wafer edge under the screw. This provides for an even polishing action to compensate for otherwise non-uniform radial polishing action on the wafer surface.
Inventors
- 👤 Robert A. Jurjevic
- 👤 Richard J. Lebel
- 👤 Matthew K. Miller
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 15:52
CPC Classifications
B; B24; B24B; B24B37/00; B24B37/27; B24B37/30; H; H10; H10P; H10P76/00
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
57 words
A polishing apparatus for polishing a surface of a workpiece comprising: a carrier assembly which is pivotally mounted to a rotation shaft; and tilting means for setting a polishing angle on the carrier assembly by applying pressure to a predetermined point on said carrier assembly, said tilting means being rotationally positionable 360 degrees around said rotation shaft.
Claim 2
Dependent Claim
57 words
A polishing apparatus for polishing a surface of a workpiece comprising: a carrier assembly which is pivotally mounted to a rotation shaft; and tilting means for setting a polishing angle on the carrier assembly by applying pressure to a predetermined point on said carrier assembly, said tilting means being rotationally positionable 360 degrees around said rotation shaft.
Claim 3
Dependent Claim
22 words
The polishing apparatus according to claim 1, wherein the tilting means limits the upward movement of an edge of the carrier assembly.
Claim 4
Dependent Claim
21 words
The polishing apparatus according to claim 1, wherein the tilting means is coupled to a bearing which surrounds the rotation shaft.
Claim 5
Dependent Claim
15 words
The polishing apparatus according to claim 1, wherein the tilting means includes an adjustment screw.
Claim 6
Dependent Claim
17 words
The polishing apparatus according to claim 4, wherein the adjustment screw has a swivel wheel attached thereto.
Claim 7
Dependent Claim
28 words
The polishing apparatus according to claim 1, wherein the carrier assembly includes a first lower plate; and a second upper plate which are connected with vibration dampening devices.
Claim 8
Dependent Claim
17 words
The polishing apparatus according to claim 6, wherein the vibration dampening devices comprise a plurality of springs.
Claim 9
Dependent Claim
15 words
The polishing apparatus according to claim 4, wherein the adjustment screw is a hand screw.
Claim 10
Dependent Claim
17 words
The polishing apparatus according to claim 1, wherein the tilting means is controlled by a pressure gauge.
Claim 11
Dependent Claim
17 words
The polishing apparatus according to claim 1, wherein the tilting means is controlled by a feedback loop.
Claim 12
Dependent Claim
94 words
A polishing apparatus for polishing a surface of a workpiece comprising: a carrier assembly including a first plate, said first plate having a lower surface wherein said workpiece may be held, and a second plate positioned above said first plate; a rotatable shaft wherein said second plate is pivotally mounted thereto; a vibration dampening system interconnecting an upper surface of said first plate to a lower surface of said second plate; and means for tilting said second plate relative to the first plate, wherein said titling means is rotationally mounted to said rotatable shaft.
Claim 13
Dependent Claim
94 words
A polishing apparatus for polishing a surface of a workpiece comprising: a carrier assembly including a first plate, said first plate having a lower surface wherein said workpiece may be held, and a second plate positioned above said first plate; a rotatable shaft wherein said second plate is pivotally mounted thereto; a vibration dampening system interconnecting an upper surface of said first plate to a lower surface of said second plate; and means for tilting said second plate relative to the first plate, wherein said titling means is rotationally mounted to said rotatable shaft.
Claim 14
Dependent Claim
17 words
The polishing apparatus according to claim 11, wherein said vibration dampening system comprises a plurality of springs.
Claim 15
Dependent Claim
15 words
The polishing apparatus according to claim 11, wherein the tilting means includes an adjustment screw.
Claim 16
Dependent Claim
14 words
The polishing apparatus according to claim 11, wherein the workpiece is a semiconductor wafer.
Claim 17
Dependent Claim
21 words
The polishing apparatus according to claim 12, wherein said plurality of springs are located peripherally on the first and second plates.
Claim 18
Dependent Claim
15 words
The polishing apparatus according to claim 13, wherein the adjustment screw is a hand screw.
Claim 19
Dependent Claim
17 words
The polishing apparatus according to claim 11, wherein the tilting means is controlled by a pressure gauge.
Claim 20
Dependent Claim
17 words
The polishing apparatus according to claim 11, wherein the tilting means is controlled by a feedback loop.
Claim 21
Dependent Claim
25 words
The polishing apparatus according to claim 11, and further comprising a bearing which surrounds the rotatable shaft and which is coupled around the adjustment screw.
Claim 22
Dependent Claim
18 words
The polishing apparatus according to claim 13, and further comprising a swivel wheel attached to the adjustment screw.
Claim 23
Independent Claim
120 words
A method of polishing a surface of a workpiece with a polishing apparatus having a carrier assembly, a device for tilting said carrier assembly, and a rotation shaft, wherein said carrier assembly is pivotally mounted to said rotation shaft, and said tilting device is rotationally positionable around said rotation shaft, said method comprising the steps of: a) mounting said workpiece on a lower surface of said carrier assembly; b) positioning said tilting device at a predetermined position on a top surface of the carrier assembly; c) adjusting said tilting device to create a predetermined angle of attack of the carrier assembly; and d) rotatably contacting the workpiece with a rotating polishing pad to effect a polishing action across the workpiece.
Claim 24
Independent Claim
120 words
A method of polishing a surface of a workpiece with a polishing apparatus having a carrier assembly, a device for tilting said carrier assembly, and a rotation shaft, wherein said carrier assembly is pivotally mounted to said rotation shaft, and said tilting device is rotationally positionable around said rotation shaft, said method comprising the steps of: a) mounting said workpiece on a lower surface of said carrier assembly; b) positioning said tilting device at a predetermined position on a top surface of the carrier assembly; c) adjusting said tilting device to create a predetermined angle of attack of the carrier assembly; and d) rotatably contacting the workpiece with a rotating polishing pad to effect a polishing action across the workpiece.
Claim 25
Dependent Claim
13 words
The method of claim 21, wherein said tilting device includes an adjustment screw.
Claim 26
Dependent Claim
27 words
The method of claim 21, wherein said carrier assembly comprises a lower first plate which is interconnected with an upper second plate through a vibration dampening system.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-04-13 | 2001-10-13 | 2002-04-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-04-13 | 2005-10-13 | 2006-04-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-04-13 | 2009-10-13 | 2010-04-14 | $7700.00 | Window Closed / Lapsed |