US5734156A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Optical device assembly and its preparation using metallic bump bonding and a stand-off for bonding together two planar optical components
Assignee: Raytheon Co
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Filing: 1996-03-29
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Granted: 1998-03-31
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Expires: 2016-03-29
Abstract
Abstract An optical device assembly includes a planar optical filter and a planar sensor having an optically active area. The optical filter and the sensor are joined together with a gap therebetween by a standoff structure extending between the optical filter and the sensor. The standoff structure is positioned at a location outside of the optically active area of the planar sensor. The standoff structure includes a standoff element, a first bonding element between the standoff and the filter, and a second bonding element between the standoff and the sensor. The two bonding elements each preferably comprise a cold-weldable indium bump. If the standoff structure, the filter, or the sensor is made of a material to which indium does not readily cold weld, a bonding pad of a material such as titanium/nickel can be inserted to facilitate the cold welding.
Inventors
- 👤 Michael J. Dahlin
- 👤 Jose A. Santana
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 14:06
CPC Classifications
H; H10; H10W; H10W90/00; H10F; H10F77/00; H10F77/50
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
123 words
An optical device assembly, comprising: a planar optical filter having a first face; a planar sensor having a second face and an optically active area; standoff structure means for joining the optical filter to the sensor with a gap therebetween, the standoff structure means comprising a standoff extending between the optical filter and the sensor; a first bonding element disposed between the standoff and the first face of the optical filter, and a second bonding element disposed between the standoff and the second face of the sensor, the second bonding element being at a location outside of the optically active area of the planar sensor, at least one of said first bonding element and said second bonding element comprising a cold-weldable metallic bump.
Claim 2
Dependent Claim
123 words
An optical device assembly, comprising: a planar optical filter having a first face; a planar sensor having a second face and an optically active area; standoff structure means for joining the optical filter to the sensor with a gap therebetween, the standoff structure means comprising a standoff extending between the optical filter and the sensor; a first bonding element disposed between the standoff and the first face of the optical filter, and a second bonding element disposed between the standoff and the second face of the sensor, the second bonding element being at a location outside of the optically active area of the planar sensor, at least one of said first bonding element and said second bonding element comprising a cold-weldable metallic bump.
Claim 3
Dependent Claim
12 words
The assembly of claim 1, wherein the standoff is made of silicon.
Claim 4
Dependent Claim
17 words
The assembly of claim 1, wherein the first bonding element comprises a bump of a deformable metal.
Claim 5
Dependent Claim
15 words
The assembly of claim 1, wherein the first bonding element comprises a bump of indium.
Claim 6
Dependent Claim
17 words
The assembly of claim 1, wherein the second bonding element comprises a bump of a deformable metal.
Claim 7
Dependent Claim
15 words
The assembly of claim 1, wherein the second bonding element comprises a bump of indium.
Claim 8
Dependent Claim
30 words
The assembly of claim 1, wherein the second bonding element comprises a pad contacting the standoff, and a bump of a deformable metal between the pad and the planar sensor.
Claim 9
Dependent Claim
55 words
The assembly of claim 1, wherein the planar sensor comprises a readout layer, a detector layer, and an electrical interconnect between the readout layer and the detector layer, the second face of the sensor being on the readout layer and the gap lying between the detector layer and the first face of the optical filter.
Claim 10
Dependent Claim
154 words
An optical device assembly, comprising: a planar first optical component; a planar second optical component having an optically active area, the first optical component being positioned in a facing relationship to the second optical component with a gap therebetween; and a standoff structure extending between the first optical component and the second optical component and bonding the first optical component and the second optical component together, the standoff structure contacting the second optical component at a location outside of its optically active area;. wherein the standoff structure comprises a standoff, a first bonding element disposed between the standoff and the first optical component, and a second bonding element disposed between the standoff and the second optical component, the second bonding element being at a location outside of the optically active area of the second optical component at least one of said first bonding element and said second bonding element comprising a cold-weldable metallic bump.
Claim 11
Dependent Claim
154 words
An optical device assembly, comprising: a planar first optical component; a planar second optical component having an optically active area, the first optical component being positioned in a facing relationship to the second optical component with a gap therebetween; and a standoff structure extending between the first optical component and the second optical component and bonding the first optical component and the second optical component together, the standoff structure contacting the second optical component at a location outside of its optically active area;. wherein the standoff structure comprises a standoff, a first bonding element disposed between the standoff and the first optical component, and a second bonding element disposed between the standoff and the second optical component, the second bonding element being at a location outside of the optically active area of the second optical component at least one of said first bonding element and said second bonding element comprising a cold-weldable metallic bump.
Claim 12
Dependent Claim
21 words
The assembly of claim 9, wherein the first optical component is a filter and the second optical component is a sensor.
Claim 13
Dependent Claim
29 words
The assembly of claim 9, wherein the second bonding element comprises a pad contacting the planar sensor, and a bump of deformable metal between the pad and the standoff.
Claim 14
Dependent Claim
17 words
The assembly of claim 9, wherein the first bonding element comprises a bump of a deformable metal.
Claim 15
Dependent Claim
15 words
The assembly of claim 9, wherein the first bonding element comprises a bump of indium.
Claim 16
Dependent Claim
17 words
The assembly of claim 9, wherein the second bonding element comprises a bump of a deformable metal.
Claim 17
Dependent Claim
15 words
The assembly of claim 9, wherein the second bonding element comprises a bump of indium.
Claim 18
Independent Claim
113 words
A method for preparing an optical device assembly, comprising the steps of: furnishing a planar first optical component having a first optically active area; furnishing a planar second optical component having a second optically active area; bonding the first optical component to the second optical component using a standoff structure, the standoff structure including a standoff extending between the first optical component and the second optical component; a second bonding element disposed between the standoff and the second optical component, the second bonding element being at a location outside of the second optically active area, at least one of said first bonding elements and said second bonding element comprising a cold-weldable metallic bump.
Claim 19
Independent Claim
113 words
A method for preparing an optical device assembly, comprising the steps of: furnishing a planar first optical component having a first optically active area; furnishing a planar second optical component having a second optically active area; bonding the first optical component to the second optical component using a standoff structure, the standoff structure including a standoff extending between the first optical component and the second optical component; a second bonding element disposed between the standoff and the second optical component, the second bonding element being at a location outside of the second optically active area, at least one of said first bonding elements and said second bonding element comprising a cold-weldable metallic bump.
Claim 20
Dependent Claim
11 words
An optical device assembly prepared by the method of claim 16.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-03-30 | 2001-09-29 | 2002-03-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-03-30 | 2005-09-29 | 2006-03-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-03-30 | 2009-09-29 | 2010-03-31 | $7700.00 | Window Closed / Lapsed |