Flexible electronic card and method

Claim 1

A method for manufacturing a flexible electronic card for use with an electronic card reader comprising providing a semiconductor wafer having front and back sides, forming a plurality of semiconductor devices in the front side of the semiconductor wafer in a pattern permitting dicing of the wafer, providing a mounting plate having a planar flat surface, placing lint-free tissue paper on the planar flat surface, placing a wax on the lint-free paper and spinning the mounting plate to cause a uniform distribution of the wax on the lint-free paper, placing the front side of the wafer against the lint-free paper, compressing the wafer against the lint-free paper while subjecting the mounting plate to heat in excess of 250° C., grinding the back side of the wafer while it is supported by the mounting plate to reduce the thickness of the semiconductor wafer, polishing the back side after the grinding operation has been completed without removing the wafer from the mounting plate to further reduce the thickness of the wafer, heating the mounting plate, removing the wafer from the mounting plate, removing the wax from the front surface of the wafer, cleaning the wafer, die cutting the wafer to provide individual semiconductor die, providing a flexible substrate formed of plastic and having dimensions such that it can fit into a conventional billfold, mounting one of the semiconductor die on the flexible substrate so that the electronic card reader can communicate with the semiconductor device to provide an electronic card which can withstand bending over a 2" radius or less without breaking or damage to the semiconductor device.

Claim 2

A method for manufacturing a flexible electronic card for use with an electronic card reader comprising providing a semiconductor wafer having front and back sides, forming a plurality of semiconductor devices in the front side of the semiconductor wafer in a pattern permitting dicing of the wafer, providing a mounting plate having a planar flat surface, placing lint-free tissue paper on the planar flat surface, placing a wax on the lint-free paper and spinning the mounting plate to cause a uniform distribution of the wax on the lint-free paper, placing the front side of the wafer against the lint-free paper, compressing the wafer against the lint-free paper while subjecting the mounting plate to heat in excess of 250° C., grinding the back side of the wafer while it is supported by the mounting plate to reduce the thickness of the semiconductor wafer, polishing the back side after the grinding operation has been completed without removing the wafer from the mounting plate to further reduce the thickness of the wafer, heating the mounting plate, removing the wafer from the mounting plate, removing the wax from the front surface of the wafer, cleaning the wafer, die cutting the wafer to provide individual semiconductor die, providing a flexible substrate formed of plastic and having dimensions such that it can fit into a conventional billfold, mounting one of the semiconductor die on the flexible substrate so that the electronic card reader can communicate with the semiconductor device to provide an electronic card which can withstand bending over a 2" radius or less without breaking or damage to the semiconductor device.