Patent US5733176A successfully refreshed from Google Patents.
US5733176A
Expired / Lapsed
US
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Polishing pad and method of use
Assignee: Micron Technology Inc
•
Filing: 1996-05-24
•
Granted: 1998-03-31
•
Expires: 2016-05-24
Abstract
Abstract A novel polishing pad having voids and optional abrasives incorporated therein is disclosed. The contents of each void facilitates the detection of the end point at which the polishing pad becomes worn out during a polishing operation. Chemicals stored within voids are released by the breaching of the voids caused by the polishing operation. The chemical released is selected to halt the chemical polishing, change the color of the pad, or to detectably change the torque load on the rotating fixed abrasive pad. Empty voids cause an noise from fluids such as air being forced into the voids. The visual or audible diagnostic resulting from the breaching of voids help to control the polishing operation and thus increase yield.
Inventors
- 👤 Karl M. Robinson
- 👤 Michael A. Walker
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 16:21
CPC Classifications
B; B24; B24B; B24B37/00; B24B37/11; B24B37/20; B24B37/24; B24B37/245; B24B37/22; B24B37/26; B24D; B24D11/00; B24D3/00; B24D3/34; Y; Y10; Y10S; Y10S451/00; Y10S451/921
Claims Analysis
Total Claims: 75
Claim 1
Independent Claim
47 words
A polishing pad comprising: an elastomeric substance having a polishing surface; and an end point indicator substance comprising a fluid incorporated within the elastomeric substance beneath the polishing surface for producing a detectable signal as abrading of the elastomeric substance releases the end point indicator substance therefrom.
Claim 2
Dependent Claim
47 words
A polishing pad comprising: an elastomeric substance having a polishing surface; and an end point indicator substance comprising a fluid incorporated within the elastomeric substance beneath the polishing surface for producing a detectable signal as abrading of the elastomeric substance releases the end point indicator substance therefrom.
Claim 3
Dependent Claim
24 words
The polishing pad as defined in claim 1, wherein the detectable signal is a color and the end point indicator substance is a dye.
Claim 4
Dependent Claim
25 words
The polishing pad as defined in claim 1, wherein the detectable signal is a sound and the end point indicator substance is a gaseous fluid.
Claim 5
Dependent Claim
49 words
The polishing pad as defined in claim 1, wherein the detectable signal is a change in the pH of a first fluid on the polishing pad, and the end point indicator substance is a second fluid having a pH opposite that of the first fluid on the polishing pad.
Claim 6
Dependent Claim
52 words
The polishing pad as defined in claim 1, wherein the detectable signal is a change in electrical conductivity of a first fluid on the polishing pad, and the end point indicator substance is a second fluid causing a change having electrical conductivity when introduced to the first fluid on the polishing pad.
Claim 7
Dependent Claim
58 words
The polishing pad as defined in claim 1, wherein the detectable signal is a change in a metal contaminants concentration a first fluid on the polishing pad, and the end point indicator substance is a second fluid causing a change the metal contaminants concentration of the first fluid when introduced to the first fluid on the polishing pad.
Claim 8
Dependent Claim
57 words
The polishing pad as defined in claim 1, wherein the detectable signal is a change in a coefficient of friction between the elastomeric substance in contact with a polished surface, and the end point indicator substance is a lubricant causing a change the coefficient of friction between the elastomeric substance and the polished surface when introduced therebetween.
Claim 9
Dependent Claim
44 words
The polishing pad as defined in claim 1, wherein the detectable signal is a change in the temperature of the elastomeric substance, and the end point indicator substance is a material causing an exothermic reaction when exposed to the ambient outside the elastomeric substance.
Claim 10
Dependent Claim
32 words
The polishing pad as defined in claim 1, wherein a void is incorporated within the elastomeric substance beneath the polishing surface and is partially filled by said end point indicator substance therein.
Claim 11
Dependent Claim
15 words
The polishing pad as defined in claim 9, further comprising a plurality of said void.
Claim 12
Dependent Claim
22 words
The polishing pad as defined in claim 10, wherein said plurality of said void are configured in substantially a single geometric plane.
Claim 13
Dependent Claim
17 words
The polishing pad as defined in claim 10, wherein said plurality of said void are vertically staggered.
Claim 14
Dependent Claim
18 words
The polishing pad as defined in claim 1, wherein an abrasive material is incorporated within said elastomeric substance.
Claim 15
Dependent Claim
94 words
A polishing system comprising: a polishing pad including: a composite substance having a polishing surface; and an end point indicator substance comprising a fluid incorporated within the composite substance beneath the polishing surface for producing a detectable signal as abrading of the composite substance releases the end point indicator substance therefrom; a semiconductor substrate having a surface to be polished by said polishing pad; and a tool for moving at least one of the polishing pad and the surface to be polished by said polishing pad relative to and in contact with the other.
Claim 16
Dependent Claim
94 words
A polishing system comprising: a polishing pad including: a composite substance having a polishing surface; and an end point indicator substance comprising a fluid incorporated within the composite substance beneath the polishing surface for producing a detectable signal as abrading of the composite substance releases the end point indicator substance therefrom; a semiconductor substrate having a surface to be polished by said polishing pad; and a tool for moving at least one of the polishing pad and the surface to be polished by said polishing pad relative to and in contact with the other.
Claim 17
Dependent Claim
24 words
The polishing system as defined in claim 14, wherein the detectable signal is a color and the end point indicator substance is a dye.
Claim 18
Dependent Claim
25 words
The polishing system as defined in claim 14, wherein the detectable signal is a sound and the end point indicator substance is a gaseous fluid.
Claim 19
Dependent Claim
65 words
The polishing system as defined in claim 14, wherein a first fluid is positively introduced between said polishing pad and said semiconductor substrate, and wherein the detectable signal is a change in the pH of the first fluid on the polishing pad, and the end point indicator substance is a second fluid having a pH opposite that of the first fluid on the polishing pad.
Claim 20
Dependent Claim
70 words
The polishing system as defined in claim 14, wherein a first fluid is positively introduced between said polishing pad and said semiconductor substrate, and wherein the detectable signal is a change in electrical conductivity of said first fluid positively introduced between said polishing pad and said semiconductor substrate, and the end point indicator substance is a second fluid causing a change having electrical conductivity when introduced to the first fluid.
Claim 21
Dependent Claim
77 words
The polishing system as defined in claim 14, wherein a first fluid is positively introduced between said polishing pad and said semiconductor substrate, and wherein the detectable signal is a change in a metal contaminants concentration of the first fluid positively introduced between said polishing pad and said semiconductor substrate, and the end point indicator substance is a second fluid causing a change the metal contaminants concentration of the first fluid when introduced to the first fluid.
Claim 22
Dependent Claim
57 words
The polishing system as defined in claim 14, wherein the detectable signal is a change in a coefficient of friction between the composite substance in contact with a polished surface, and the end point indicator substance is a lubricant causing a change the coefficient of friction between the composite substance and the polished surface when introduced therebetween.
Claim 23
Dependent Claim
57 words
The polishing system as defined in claim 14, wherein a first fluid is positively introduced between said polishing pad and said semiconductor wafer, and wherein the detectable signal is a change in the temperature of the first fluid, and the end point indicator substance is a material causing an exothermic reaction when exposed to said first fluid.
Claim 24
Dependent Claim
18 words
The polishing system as defined in claim 14, wherein a void has said end point indicator substance therein.
Claim 25
Dependent Claim
15 words
The polishing system as defined in claim 22, further comprising a plurality of said void.
Claim 26
Dependent Claim
22 words
The polishing system as defined in claim 23, wherein said plurality of said void are configured in substantially a single geometric plane.
Claim 27
Dependent Claim
17 words
The polishing system as defined in claim 23, wherein said plurality of said void are vertically staggered.
Claim 28
Dependent Claim
17 words
The polishing system as defined in claim 14, wherein an abrasive material is incorporated within composite substance.
Claim 29
Independent Claim
138 words
A method of detecting the wear end-point of a polishing pad comprising the steps of: providing a polishing pad including: a composite substance having a polishing surface; and an end point indicator substance comprising a fluid incorporated within the composite substance beneath the polishing surface for producing a detectable signal as abrading of the composite substance releases the end point indicator substance therefrom; providing a semiconductor substrate having a unpolished surface to be polished by said polishing pad; moving the polishing pad relative to and in contact with the unpolished surface to be polished by said polishing pad so as to abrade the composite substance and release therefrom the end point indicator substance; and detecting said detectable signal when the composite substance releases the end point indicator substance therefrom; whereby a status of said polishing pad is indicated.
Claim 30
Independent Claim
138 words
A method of detecting the wear end-point of a polishing pad comprising the steps of: providing a polishing pad including: a composite substance having a polishing surface; and an end point indicator substance comprising a fluid incorporated within the composite substance beneath the polishing surface for producing a detectable signal as abrading of the composite substance releases the end point indicator substance therefrom; providing a semiconductor substrate having a unpolished surface to be polished by said polishing pad; moving the polishing pad relative to and in contact with the unpolished surface to be polished by said polishing pad so as to abrade the composite substance and release therefrom the end point indicator substance; and detecting said detectable signal when the composite substance releases the end point indicator substance therefrom; whereby a status of said polishing pad is indicated.
Claim 31
Dependent Claim
118 words
The method as defined in claim 27, further comprising the steps of: (a) stopping the movement of at least one of said another polishing pad and the unpolished surface relative to and in contact with the other; (b) removing the polishing pad; (c) providing another polishing pad of like kind; (d) moving at least one of said another polishing pad and the unpolished surface relative to and in contact with the other so as to abrade the composite substance and release therefrom the end point indicator substance; and (e) detecting said detectable signal when the composite substance releases the end point indicator substance therefrom; whereby a status of said another polishing pad is indicated. (f) repeating steps (a)-(e).
Claim 32
Dependent Claim
23 words
The method as defined in claim 27, wherein the detectable signal is a color and the end point indicator substance is a dye.
Claim 33
Dependent Claim
24 words
The method as defined in claim 27, wherein the detectable signal is a sound and the end point indicator substance is a gaseous fluid.
Claim 34
Dependent Claim
67 words
The method as defined in claim 27, further comprising the step of positively introducing a first fluid between said polishing pad and said semiconductor substrate, and wherein the detectable signal is a change in the pH of the first fluid on the polishing pad, and the end point indicator substance is a second fluid having a pH opposite that of the first fluid on the polishing pad.
Claim 35
Dependent Claim
72 words
The method as defined in claim 27, further comprising the step of positively introducing a first fluid between said polishing pad and said semiconductor substrate, and wherein the detectable signal is a change in electrical conductivity of said first fluid positively introduced between said polishing pad and said semiconductor substrate, and the end point indicator substance is a second fluid causing a change having electrical conductivity when introduced to the first fluid.
Claim 36
Dependent Claim
79 words
The method as defined in claim 27, further comprising the step of positively introducing a first fluid between said polishing pad and said semiconductor substrate, and wherein the detectable signal is a change in a metal contaminants concentration of the first fluid positively introduced between said polishing pad and said semiconductor substrate, and the end point indicator substance is a second fluid causing a change the metal contaminants concentration of the first fluid when introduced to the first fluid.
Claim 37
Dependent Claim
56 words
The method as defined in claim 27, wherein the detectable signal is a change in a coefficient of friction between the composite substance in contact with a polished surface, and the end point indicator substance is a lubricant causing a change the coefficient of friction between the composite substance and the polished surface when introduced therebetween.
Claim 38
Dependent Claim
56 words
The method as defined in claim 27, wherein a first fluid is positively introduced between said polishing pad and said semiconductor substrate, and wherein the detectable signal is a change in the temperature of the first fluid, and the end point indicator substance is a material causing an exothermic reaction when exposed to said first fluid.
Claim 39
Dependent Claim
17 words
The method as defined in claim 27, wherein a void has said end point indicator substance therein.
Claim 40
Dependent Claim
14 words
The method as defined in claim 36, further comprising a plurality of said void.
Claim 41
Dependent Claim
21 words
The method as defined in claim 37, wherein said plurality of said void are configured in substantially a single geometric plane.
Claim 42
Dependent Claim
16 words
The method as defined in claim 37, wherein said plurality of said void are vertically staggered.
Claim 43
Dependent Claim
17 words
The method as defined in claim 27, wherein an abrasive material is incorporated within the composite substance.
Claim 44
Dependent Claim
27 words
The method as defined in claim 27, wherein the detectable signal is proportional to the amount of the end point indicator substance released from the composite substance.
Claim 45
Dependent Claim
55 words
A polishing pad comprising: an elastomeric substance having a polishing surface; and a void, incorporated within the elastomeric substance beneath the polishing surface and containing therein an end point indicator substance comprising a fluid, wherein a detectable signal is produced as abrading of the elastomeric substance releases the end point indicator substance from said void.
Claim 46
Dependent Claim
55 words
A polishing pad comprising: an elastomeric substance having a polishing surface; and a void, incorporated within the elastomeric substance beneath the polishing surface and containing therein an end point indicator substance comprising a fluid, wherein a detectable signal is produced as abrading of the elastomeric substance releases the end point indicator substance from said void.
Claim 47
Dependent Claim
15 words
The polishing system as defined in claim 42, further comprising a plurality of said void.
Claim 48
Dependent Claim
22 words
The polishing system as defined in claim 43, wherein said plurality of said void are configured in substantially a single geometric plane.
Claim 49
Dependent Claim
17 words
The polishing system as defined in claim 43, wherein said plurality of said void are vertically staggered.
Claim 50
Dependent Claim
24 words
The polishing pad as defined in claim 42, wherein the detectable signal is a color and the end point indicator substance is a dye.
Claim 51
Dependent Claim
25 words
The polishing pad as defined in claim 42, wherein the detectable signal is a sound and the end point indicator substance is a gaseous fluid.
Claim 52
Dependent Claim
49 words
The polishing pad as defined in claim 42, wherein the detectable signal is a change in the pH of a first fluid on the polishing pad, and the end point indicator substance is a second fluid having a pH opposite that of the first fluid on the polishing pad.
Claim 53
Dependent Claim
52 words
The polishing pad as defined in claim 42, wherein the detectable signal is a change in electrical conductivity of a first fluid on the polishing pad, and the end point indicator substance is a second fluid causing a change having electrical conductivity when introduced to the first fluid on the polishing pad.
Claim 54
Dependent Claim
58 words
The polishing pad as defined in claim 42, wherein the detectable signal is a change in a metal contaminants concentration a first fluid on the polishing pad, and the end point indicator substance is a second fluid causing a change the metal contaminants concentration of the first fluid when introduced to the first fluid on the polishing pad.
Claim 55
Dependent Claim
57 words
The polishing pad as defined in claim 42, wherein the detectable signal is a change in a coefficient of friction between the elastomeric substance in contact with a polished surface, and the end point indicator substance is a lubricant causing a change the coefficient of friction between the elastomeric substance and the polished surface when introduced therebetween.
Claim 56
Dependent Claim
44 words
The polishing pad as defined in claim 42, wherein the detectable signal is a change in the temperature of the elastomeric substance, and the end point indicator substance is a material causing an exothermic reaction when exposed to the ambient outside the elastomeric substance.
Claim 57
Dependent Claim
18 words
The polishing pad as defined in claim 42, wherein an abrasive material is incorporated within said elastomeric substance.
Claim 58
Dependent Claim
55 words
A polishing pad comprising: an elastomeric substance having a polishing surface; and a lubricant incorporated within the elastomeric substance beneath the polishing surface for producing a change in a coefficient of friction between the elastomeric substance in contact with a polished surface as abrading of the elastomeric substance releases the end point indicator substance therefrom.
Claim 59
Dependent Claim
55 words
A polishing pad comprising: an elastomeric substance having a polishing surface; and a lubricant incorporated within the elastomeric substance beneath the polishing surface for producing a change in a coefficient of friction between the elastomeric substance in contact with a polished surface as abrading of the elastomeric substance releases the end point indicator substance therefrom.
Claim 60
Dependent Claim
60 words
A polishing pad comprising: an elastomeric substance having a polishing surface; and a material causing an exothermic reaction when exposed to the ambient outside the elastomeric substance, said material being incorporated within the elastomeric substance beneath the polishing surface and producing a change in the temperature of the elastomeric substance as abrading of the elastomeric substance releases the material therefrom.
Claim 61
Dependent Claim
60 words
A polishing pad comprising: an elastomeric substance having a polishing surface; and a material causing an exothermic reaction when exposed to the ambient outside the elastomeric substance, said material being incorporated within the elastomeric substance beneath the polishing surface and producing a change in the temperature of the elastomeric substance as abrading of the elastomeric substance releases the material therefrom.
Claim 62
Dependent Claim
54 words
A polishing pad comprising: an elastomeric substance having a polishing surface; and a void incorporated within the elastomeric substance beneath the polishing surface, said void being partially filled with an end point indicator substance for producing a detectable signal as abrading of the elastomeric substance releases the end point indicator substance from said void.
Claim 63
Dependent Claim
54 words
A polishing pad comprising: an elastomeric substance having a polishing surface; and a void incorporated within the elastomeric substance beneath the polishing surface, said void being partially filled with an end point indicator substance for producing a detectable signal as abrading of the elastomeric substance releases the end point indicator substance from said void.
Claim 64
Dependent Claim
102 words
A polishing system comprising: a polishing pad including: a composite substance having a polishing surface; and a lubricant, incorporated within the composite substance beneath the polishing surface, for producing a change in a coefficient of friction between the composite substance in contact with a polished surface as abrading of the composite substance releases the end point indicator substance therefrom; a semiconductor substrate having a surface to be polished by said polishing pad; and a tool for moving at least one of the polishing pad and the surface to be polished by said polishing pad relative to and in contact with the other.
Claim 65
Dependent Claim
102 words
A polishing system comprising: a polishing pad including: a composite substance having a polishing surface; and a lubricant, incorporated within the composite substance beneath the polishing surface, for producing a change in a coefficient of friction between the composite substance in contact with a polished surface as abrading of the composite substance releases the end point indicator substance therefrom; a semiconductor substrate having a surface to be polished by said polishing pad; and a tool for moving at least one of the polishing pad and the surface to be polished by said polishing pad relative to and in contact with the other.
Claim 66
Dependent Claim
139 words
A polishing system comprising: a polishing pad including: a composite substance having a polishing surface; and end point indicator substance incorporated within the composite substance beneath the polishing surface for producing a detectable signal as abrading of the composite substance releases the end point indicator substance therefrom; a semiconductor substrate having a surface to be polished by said polishing pad, wherein a first fluid is positively introduced between said polishing pad and said semiconductor substrate, and wherein the detectable signal is a change in the temperature of the first fluid, and the end point indicator substance is a material causing an exothermic reaction when exposed to said first fluid; and a tool for moving at least one of the polishing pad and the surface to be polished by said polishing pad relative to and in contact with the other.
Claim 67
Dependent Claim
139 words
A polishing system comprising: a polishing pad including: a composite substance having a polishing surface; and end point indicator substance incorporated within the composite substance beneath the polishing surface for producing a detectable signal as abrading of the composite substance releases the end point indicator substance therefrom; a semiconductor substrate having a surface to be polished by said polishing pad, wherein a first fluid is positively introduced between said polishing pad and said semiconductor substrate, and wherein the detectable signal is a change in the temperature of the first fluid, and the end point indicator substance is a material causing an exothermic reaction when exposed to said first fluid; and a tool for moving at least one of the polishing pad and the surface to be polished by said polishing pad relative to and in contact with the other.
Claim 68
Dependent Claim
99 words
A polishing system comprising: a polishing pad including: a composite substance having a polishing surface; and a void incorporated within the elastomeric substance beneath the polishing surface and partially filled with an end point indicator substance for producing a detectable signal as abrading of the elastomeric substance releases the end point indicator substance from said void; a semiconductor substrate having a surface to be polished by said polishing pad; and a tool or moving at least one of the polishing pad and the surface to be polished by said polishing pad relative to and in contact with the other.
Claim 69
Dependent Claim
99 words
A polishing system comprising: a polishing pad including: a composite substance having a polishing surface; and a void incorporated within the elastomeric substance beneath the polishing surface and partially filled with an end point indicator substance for producing a detectable signal as abrading of the elastomeric substance releases the end point indicator substance from said void; a semiconductor substrate having a surface to be polished by said polishing pad; and a tool or moving at least one of the polishing pad and the surface to be polished by said polishing pad relative to and in contact with the other.
Claim 70
Independent Claim
147 words
A method of detecting the wear end-point of a polishing pad comprising: providing a polishing pad including: a composite substance having a polishing surface; and a lubricant incorporated within the elastomeric substance beneath the polishing surface for producing a detectable signal comprising a change in a coefficient of friction between the elastomeric substance in contact with a polished surface as abrading of the elastomeric substance releases the end point indicator substance therefrom; providing a semiconductor substrate having a unpolished surface to be polished by said polishing pad; moving the polishing pad relative to and in contact with the unpolished surface to be polished by said polishing pad so as to abrade the composite substance and release therefrom the end point indicator substance; and detecting said detectable signal when the composite substance releases the end point indicator substance therefrom; whereby a status of said polishing pad is indicated.
Claim 71
Independent Claim
147 words
A method of detecting the wear end-point of a polishing pad comprising: providing a polishing pad including: a composite substance having a polishing surface; and a lubricant incorporated within the elastomeric substance beneath the polishing surface for producing a detectable signal comprising a change in a coefficient of friction between the elastomeric substance in contact with a polished surface as abrading of the elastomeric substance releases the end point indicator substance therefrom; providing a semiconductor substrate having a unpolished surface to be polished by said polishing pad; moving the polishing pad relative to and in contact with the unpolished surface to be polished by said polishing pad so as to abrade the composite substance and release therefrom the end point indicator substance; and detecting said detectable signal when the composite substance releases the end point indicator substance therefrom; whereby a status of said polishing pad is indicated.
Claim 72
Independent Claim
179 words
A method of detecting the wear end-point of a polishing pad comprising: providing a polishing pad including: a composite substance having a polishing surface; and end point indicator substance incorporated within the composite substance beneath the polishing surface for producing a detectable signal as abrading of the composite substance releases the end point indicator substance therefrom; providing a semiconductor substrate having a surface to be polished by said polishing pad, wherein a first fluid is positively introduced between said polishing pad and said semiconductor substrate, and wherein the detectable signal is a change in the temperature of the first fluid, and the end point indicator substance is a material causing an exothermic reaction when exposed to said first fluid; moving the polishing pad relative to and in contact with the unpolished surface to be polished by said polishing pad so as to abrade the composite substance and release therefrom the end point indicator substance; and detecting said detectable signal when the composite substance releases the end point indicator substance therefrom; whereby a status of said polishing pad is indicated.
Claim 73
Independent Claim
179 words
A method of detecting the wear end-point of a polishing pad comprising: providing a polishing pad including: a composite substance having a polishing surface; and end point indicator substance incorporated within the composite substance beneath the polishing surface for producing a detectable signal as abrading of the composite substance releases the end point indicator substance therefrom; providing a semiconductor substrate having a surface to be polished by said polishing pad, wherein a first fluid is positively introduced between said polishing pad and said semiconductor substrate, and wherein the detectable signal is a change in the temperature of the first fluid, and the end point indicator substance is a material causing an exothermic reaction when exposed to said first fluid; moving the polishing pad relative to and in contact with the unpolished surface to be polished by said polishing pad so as to abrade the composite substance and release therefrom the end point indicator substance; and detecting said detectable signal when the composite substance releases the end point indicator substance therefrom; whereby a status of said polishing pad is indicated.
Claim 74
Independent Claim
188 words
A method of detecting the wear end-point of a polishing pad comprising: providing a polishing pad including: a composite substance having a polishing surface; and a void incorporated within the elastomeric substance beneath the polishing surface and partially filled with an end point indicator substance for producing a detectable signal as abrading of the elastomeric substance releases the end point indicator substance from said void; providing a semiconductor substrate having a surface to be polished by said polishing pad, wherein a first fluid is positively introduced between said polishing pad and said semiconductor substrate, and wherein the detectable signal is a change in the temperature of the first fluid, and the end point indicator substance is a material causing an exothermic reaction when exposed to said first fluid; moving the polishing pad relative to and in contact with the unpolished surface to be polished by said polishing pad so as to abrade the composite substance and release therefrom the end point indicator substance; and detecting said detectable signal when the composite substance releases the end point indicator substance therefrom; whereby a status of said polishing pad is indicated.
Claim 75
Independent Claim
188 words
A method of detecting the wear end-point of a polishing pad comprising: providing a polishing pad including: a composite substance having a polishing surface; and a void incorporated within the elastomeric substance beneath the polishing surface and partially filled with an end point indicator substance for producing a detectable signal as abrading of the elastomeric substance releases the end point indicator substance from said void; providing a semiconductor substrate having a surface to be polished by said polishing pad, wherein a first fluid is positively introduced between said polishing pad and said semiconductor substrate, and wherein the detectable signal is a change in the temperature of the first fluid, and the end point indicator substance is a material causing an exothermic reaction when exposed to said first fluid; moving the polishing pad relative to and in contact with the unpolished surface to be polished by said polishing pad so as to abrade the composite substance and release therefrom the end point indicator substance; and detecting said detectable signal when the composite substance releases the end point indicator substance therefrom; whereby a status of said polishing pad is indicated.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-03-30 | 2001-09-29 | 2002-03-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-03-30 | 2005-09-29 | 2006-03-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-03-30 | 2009-09-29 | 2010-03-31 | $7700.00 | Window Closed / Lapsed |