US5728600A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Circuit encapsulation process
Assignee: VLT Corp
•
Filing: 1994-11-15
•
Granted: 1998-03-17
•
Expires: 2014-11-15
Abstract
Abstract A method for encapsulating portions of a circuit formed on a substrate. The substrate has two faces and perimeter sides. Encapsulating surrounds, in molding compound, a portion of one of the faces of the substrate and a portion of the sides of the substrate, and during encapsulation a portion of the one face of the substrate that bears conductive pads is left unencapsulated. An encapsulated circuit including a substrate having two faces and perimeter sides around the faces and a circuit formed on the substrate. The substrate also includes conductive pads that are formed on a portion of one of the faces near one of the sides and are connected to the circuit. An integrally formed encapsulating mass encapsulates all of the one face except in the region of the pads, all of the other face except in a region opposite to the region of the pads, and all of the sides.
Inventors
- 👤 John R. Saxelby, Jr.
- 👤 Walter R. Hedlund, III
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 12:09
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/284; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
110 words
A method for encapsulating portions of a circuit formed on a substrate having two faces and perimeter sides, comprising inserting the substrate into a mold, closing a top of the mold and a bottom of the mold against the substrate, pushing molding compound from a conduit having a top defined by the substrate into a chamber in the mold, and encapsulating, in the molding compound, a first portion of one of the faces of the substrate and a portion of the sides of the substrate, and, during encapsulation, leaving a second portion of the one face of the substrate unencapsulated, the second portion of the one face bearing conductive pads.
Claim 2
Independent Claim
110 words
A method for encapsulating portions of a circuit formed on a substrate having two faces and perimeter sides, comprising inserting the substrate into a mold, closing a top of the mold and a bottom of the mold against the substrate, pushing molding compound from a conduit having a top defined by the substrate into a chamber in the mold, and encapsulating, in the molding compound, a first portion of one of the faces of the substrate and a portion of the sides of the substrate, and, during encapsulation, leaving a second portion of the one face of the substrate unencapsulated, the second portion of the one face bearing conductive pads.
Claim 3
Dependent Claim
19 words
The method of claim 1, further comprising encapsulating a portion of the other of the faces of the substrate.
Claim 4
Dependent Claim
21 words
The method of claim 2, further comprising leaving a second portion of the other of the faces of the substrate unencapsulated.
Claim 5
Dependent Claim
18 words
The method of claim 3, wherein the second portion of the other of the faces bears conductive pads.
Claim 6
Dependent Claim
29 words
The method of claim 1, wherein the conductive pads are electrically connected to electronic components, the electronic components being mounted on the substrate and encapsulated in the molding compound.
Claim 7
Independent Claim
168 words
A method for encapsulating portions of a circuit formed on a substrate having two faces and perimeter sides, comprising inserting the substrate into a mold, the substrate including an active portion on which the conductive pads and electronic components electrically connected to the conductive pads, are mounted, and a waste portion connected to the active portion by a segment in the area of the conductive pads, closing a top of the mold and a bottom of the mold against the waste portion and against the segment of the active portion in the area of the conductive pads, pushing molding compound from a conduit, having a top defined by the waste portion into a chamber in the mold, and encapsulating, in the molding compound, a first portion of one of the faces of the substrate and a portion of the sides of the substrate, and, during encapsulation, leaving a second portion of the one face of the substrate unencapsulated, the second portion of the one face bearing conductive pads.
Claim 8
Independent Claim
168 words
A method for encapsulating portions of a circuit formed on a substrate having two faces and perimeter sides, comprising inserting the substrate into a mold, the substrate including an active portion on which the conductive pads and electronic components electrically connected to the conductive pads, are mounted, and a waste portion connected to the active portion by a segment in the area of the conductive pads, closing a top of the mold and a bottom of the mold against the waste portion and against the segment of the active portion in the area of the conductive pads, pushing molding compound from a conduit, having a top defined by the waste portion into a chamber in the mold, and encapsulating, in the molding compound, a first portion of one of the faces of the substrate and a portion of the sides of the substrate, and, during encapsulation, leaving a second portion of the one face of the substrate unencapsulated, the second portion of the one face bearing conductive pads.
Claim 9
Dependent Claim
10 words
The method of claim 6, wherein the segment includes segments.
Claim 10
Dependent Claim
65 words
The method of claim 6, wherein closing the mold comprises causing a ridge on the top of the mold to extend down against the waste portion and the segment of the active portion in the area of the conductive pads, and causing a first ridge on the bottom of the mold to press up against the waste portion and the segment including the conductive pads.
Claim 11
Dependent Claim
23 words
The method of claim 8, further comprising defining an end of the conduit with a second ridge on the bottom of the mold.
Claim 12
Dependent Claim
38 words
The method of claim 8, further comprising causing the top of the mold to extend down against a second segment of the active portion, and causing the bottom of the mold to press up against the second segment.
Claim 13
Dependent Claim
11 words
The method of claim 10, wherein the second segment includes segments.
Claim 14
Dependent Claim
23 words
The method of claim 10, further comprising defining an end of the conduit with a second ridge on the bottom of the mold.
Claim 15
Dependent Claim
22 words
The method of claim 1, wherein the top of the mold and the bottom of the mold are separated by the substrate.
Claim 16
Dependent Claim
31 words
The method of claim 1, wherein the mold is connected to a compliance mechanism of a press, the press provides an even pressure distribution across the substrate through the compliance mechanism.
Claim 17
Dependent Claim
37 words
The method of claim 14, wherein the press includes molds and a compliance mechanism for attachment to each of the molds to enable the press to provide an even pressure distribution across substrates inserted in the molds.
Claim 18
Dependent Claim
12 words
The method of claim 14, wherein the compliance mechanism comprises a spring.
Claim 19
Dependent Claim
13 words
The method of claim 14, wherein the compliance mechanism comprises a pneumatic cylinder.
Claim 20
Dependent Claim
13 words
The method of claim 14, wherein the compliance mechanism comprises a hydraulic cylinder.
Claim 21
Dependent Claim
31 words
The method of claim 1, further comprising curing the molding compound, removing the substrate with exposed conductive pads from the mold, and cutting away the waste portion and waste molding compound.
Claim 22
Dependent Claim
14 words
The method of claim 1, wherein the conduit includes a pot and a runner.
Claim 23
Dependent Claim
18 words
The method of claim 20, wherein the pot and the runner are in the bottom of the mold.
Claim 24
Independent Claim
146 words
A method for encapsulating a circuit, comprising inserting a substrate into a mold, wherein the substrate includes an active portion bearing electronic components and conductive pads for connecting to the components and a waste portion connected to the active portion by a segment in the area of the conductive pads, closing the mold causing a ridge on a top of the mold to extend down against the waste portion and the segment including the conductive pads and causing a first ridge on a bottom of the mold to press up against the waste portion and the segment including the conductive pads, pushing molding compound from a conduit having a top defined by the waste portion and an end defined by a second ridge on the bottom of the mold, into a mold cavity to encapsulate a portion of the active area, leaving the conductive pads exposed.
Claim 25
Independent Claim
146 words
A method for encapsulating a circuit, comprising inserting a substrate into a mold, wherein the substrate includes an active portion bearing electronic components and conductive pads for connecting to the components and a waste portion connected to the active portion by a segment in the area of the conductive pads, closing the mold causing a ridge on a top of the mold to extend down against the waste portion and the segment including the conductive pads and causing a first ridge on a bottom of the mold to press up against the waste portion and the segment including the conductive pads, pushing molding compound from a conduit having a top defined by the waste portion and an end defined by a second ridge on the bottom of the mold, into a mold cavity to encapsulate a portion of the active area, leaving the conductive pads exposed.
Claim 26
Independent Claim
134 words
A method for encapsulating circuits, comprising inserting a substrate into a mold, wherein the substrate includes active portions bearing electronic components and conductive pads for connecting to the components and waste portions connected to the active portions by segments in the areas of the conductive pads, closing the mold causing ridges on a top of the mold to extend down against the waste portions and the segments including the conductive pads and causing first ridges on a bottom of the mold to press up against the waste portions and the segments including the conductive pads, pushing molding compound from conduits having tops defined by the waste portions and ends defined by second ridges on the bottom of the mold, into mold cavities to encapsulate portions of the active areas, leaving the conductive pads exposed.
Claim 27
Independent Claim
134 words
A method for encapsulating circuits, comprising inserting a substrate into a mold, wherein the substrate includes active portions bearing electronic components and conductive pads for connecting to the components and waste portions connected to the active portions by segments in the areas of the conductive pads, closing the mold causing ridges on a top of the mold to extend down against the waste portions and the segments including the conductive pads and causing first ridges on a bottom of the mold to press up against the waste portions and the segments including the conductive pads, pushing molding compound from conduits having tops defined by the waste portions and ends defined by second ridges on the bottom of the mold, into mold cavities to encapsulate portions of the active areas, leaving the conductive pads exposed.
Claim 28
Dependent Claim
31 words
The method of claim 23, wherein the mold is connected to a compliance mechanism of a press, the press provides an even pressure distribution across the substrate through the compliance mechanism.
Claim 29
Independent Claim
111 words
A method for encapsulating portions of a circuit formed on a substrate, comprising inserting the substrate into a mold, the substrate including an active portion on which conductive pads and electronic components electrically connected to the conductive pads are mounted and a waste portion connected to the active portion by a segment in the vicinity of the conductive pads, closing a top of the mold and a bottom of the mold against the waste portion and against the segment of the active portion in the vicinity of the conductive pads, and pushing molding compound from a conduit, having a top defined by the waste portion, into a chamber in the mold.
Claim 30
Independent Claim
111 words
A method for encapsulating portions of a circuit formed on a substrate, comprising inserting the substrate into a mold, the substrate including an active portion on which conductive pads and electronic components electrically connected to the conductive pads are mounted and a waste portion connected to the active portion by a segment in the vicinity of the conductive pads, closing a top of the mold and a bottom of the mold against the waste portion and against the segment of the active portion in the vicinity of the conductive pads, and pushing molding compound from a conduit, having a top defined by the waste portion, into a chamber in the mold.
References Cited (Backward Citations)
US2669753A
Cited
US2724864A
Cited
US2937409A
Cited
US3238287A
Cited
US3354529A
Cited
US3408438A
Cited
US3539675A
Cited
US3621338A
Cited
US3769702A
Cited
US3683241A
Cited
US3737729A
Cited
US4029388A
Cited
JPS53124075A
Cited
US4218724A
Cited
JPS55118640A
Cited
US4336009A
Cited
US4400762A
Cited
US4528749A
Cited
US4551747A
Cited
US4551746A
Cited
JPS6076130A
Cited
US4554613A
Cited
US4736520A
Cited
US4783697A
Cited
JPS61193460A
Cited
JPS6232622A
Cited
US4724283A
Cited
US4750092A
Cited
US4750089A
Cited
JPS62193131A
Cited
US4899257A
Cited
US4724514A
Cited
US4688152A
Cited
US4769525A
Cited
US4691265A
Cited
US4918811A
Cited
US4783695A
Cited
US4933042A
Cited
US4740414A
Cited
US4881884A
Cited
JPS63172433A
Cited
US4953005A
Cited
US4879630A
Cited
US4832324A
Cited
US4861251A
Cited
US4868349A
Cited
US5019946A
Cited
US5028987A
Cited
US5206986A
Cited
US5331203A
Cited
JPH0423442A
Cited
US5375322A
Cited
US5334857A
Cited
US5365403A
Cited
US5395226A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-03-16 | 2001-09-15 | 2002-03-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-03-16 | 2005-09-15 | 2006-03-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-03-16 | 2009-09-15 | 2010-03-17 | $7700.00 | Window Closed / Lapsed |