Patent US5543008A successfully refreshed from Google Patents.
Patent US5725938A successfully refreshed from Google Patents.
US5725938A
Expired / Lapsed
US
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Metallization of ceramic through application of an adherent reducible layer
Assignee: Nokia of America Corp
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Filing: 1996-08-29
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Granted: 1998-03-10
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Expires: 2016-08-29
Abstract
Abstract The present invention provides improved techniques for metallizing ceramic substrates. The method comprises providing a ceramic substrate and depositing a layer of reducible material on the ceramic substrate. The layer of reducible material includes a reducible ceramic such as copper oxide. The ceramic substrate having the layer of reducible material disposed thereon is heated and the reducible material is contacted with a reducing agent to create a conductive region. The conductive region is either a metallized region formed by reduction, or it is a conductive ceramic formed through surface reduction. The present invention further provides a metallized ceramic substrate. The metallized layer comprises ceramic regions having at least one constituent in common with the ceramic substrate. The ceramic substrate and the ceramic regions of the metallized layer are sintered to each other such that the metallized region is interspersed between the sintered ceramic regions. In this fashion, the metal is firmly held to the ceramic substrate due to the presence of the bonded ceramic within the metallized layer.
Inventors
- 👤 Sungho Jin
- 👤 David Wilfred Johnson, Jr.
- 👤 Henry Hon Law
- 👤 John Thomson, Jr.
- 👤 Thomas Henry Tiefel
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:14
CPC Classifications
C; C04; C04B; C04B41/00; C04B41/009; C04B41/45; C04B41/4505; C04B41/455; C04B41/4558; C04B41/50; C04B41/51; C04B41/52; C04B41/80; C04B41/81; C04B41/85; C04B41/88; C04B41/89; H; H05; H05K; H05K3/00; H05K3/10; H05K3/105; H10; H10N; H10N30/00; H10N30/01; H10N30/06; H10N60/00; H10N60/01; H10N60/0268; H10N60/0744; C04B2111/00; C04B2111/00474; C04B2111/00844; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/12; Y10T428/12007; Y10T428/12493; Y10T428/24; Y10T428/24802; Y10T428/24926
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
128 words
An electrical device including a metallized portion comprising: a ceramic substrate; and a metallized layer disposed on the ceramic substrate, the metallized layer including metallic regions and ceramic regions, the ceramic regions having at least one constituent in common with the ceramic substrate, the metallic and ceramic regions formed from a mixture comprising a reducible ceramic material which forms the metallic regions and a nonreducible ceramic material which forms the ceramic regions, the nonreducible ceramic material being used in an amount ranging from between 20% to 50% by volume of the mixture, the ceramic substrate and at least a portion of the ceramic regions of the metallized layer being sintered to each other such that the sintered ceramic regions are interspersed between metallic regions of the metallized layer.
Claim 2
Dependent Claim
128 words
An electrical device including a metallized portion comprising: a ceramic substrate; and a metallized layer disposed on the ceramic substrate, the metallized layer including metallic regions and ceramic regions, the ceramic regions having at least one constituent in common with the ceramic substrate, the metallic and ceramic regions formed from a mixture comprising a reducible ceramic material which forms the metallic regions and a nonreducible ceramic material which forms the ceramic regions, the nonreducible ceramic material being used in an amount ranging from between 20% to 50% by volume of the mixture, the ceramic substrate and at least a portion of the ceramic regions of the metallized layer being sintered to each other such that the sintered ceramic regions are interspersed between metallic regions of the metallized layer.
Claim 3
Dependent Claim
21 words
An electrical device including a metallized portion according to claim 1 further comprising: a metal layer disposed on said metallized layer.
Claim 4
Dependent Claim
19 words
An electrical device including a metallized portion according to claim 2 wherein the metal layer is formed by electroplating.
Claim 5
Dependent Claim
20 words
An electrical device including a metallized portion according to claim 2 wherein the metal layer is formed by electroless deposition.
Claim 6
Dependent Claim
34 words
An electrical device according to claim 1 wherein a particular pattern of the metallized layer disposed on at least one surface of the substrate forms windings of a component selected from inductors and transformers.
Claim 7
Dependent Claim
17 words
An electrical device according to claim 1 wherein the metallic regions of the metallized layer contain copper.
Claim 8
Dependent Claim
14 words
An electrical device according to claim 1 wherein the ceramic substrate is copper oxide.
Claim 9
Dependent Claim
15 words
An electrical device according to claim 1 wherein the ceramic substrate is a magnetic ferrite.
Claim 10
Dependent Claim
14 words
An electrical device according to claim 1 wherein the ceramic substrate is aluminum oxide.
References Cited (Backward Citations)
US2993815A
Cited
US3180756A
Cited
US4072771A
Cited
US4172919A
Cited
US4833004A
Cited
US4323483A
Cited
US4436785A
Cited
US4714570A
Cited
US4770953A
Cited
US5063121A
Cited
EP0345870A1
Cited
US5066620A
Cited
JPH03214716A
Cited
US5239744A
Cited
EP0586264A1
Cited
JPH06184724A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-03-09 | 2001-09-08 | 2002-03-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-03-09 | 2005-09-08 | 2006-03-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-03-09 | 2009-09-08 | 2010-03-10 | $7700.00 | Window Closed / Lapsed |