Patent US1763728A successfully refreshed from Google Patents.
Patent US5723375A successfully refreshed from Google Patents.
US5723375A
Expired / Lapsed
US
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Method of making EEPROM transistor for a DRAM
Assignee: Micron Technology Inc
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Filing: 1996-04-26
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Granted: 1998-03-03
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Expires: 2016-04-26
Abstract
Abstract A floating gate transistor is formed by simultaneously creating buried contact openings on both EEPROM transistor gates and DRAM access transistor source/drain diffusions. Conventional DRAM process steps are used to form cell storage capacitors in all the buried contact openings, including buried contact openings on EEPROM transistor gates. An EEPROM transistor gate and its associated cell storage capacitor bottom plate together forms a floating gate completely surrounded by insulating material. The top cell storage capacitor plate on an EEPROM transistor is used as a control gate to apply programming voltages to the EEPROM transistor. Reading, writing, and erasing the EEPROM element are analogous to conventional floating-gate tunneling oxide (FLOTOX) EEPROM devices. In this way, existing DRAM process steps are used to implement an EEPROM floating gate transistor nonvolatile memory element.
Inventors
- 👤 Manny K. F. Ma
- 👤 Yauh-Ching Liu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 15:10
CPC Classifications
H; H10; H10B; H10B12/00; H10B12/01; H10B12/02; H10B12/03; H10B12/033
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
151 words
A method of forming an electrically reprogrammable integrated circuit transistor, the method comprising the steps of: forming active regions on a semiconductor substrate; forming field-effect transistor (FET) source/drain regions in the active regions; forming FET gate regions in the active regions and extending at least partially outside of the active regions; forming a first insulating layer on the semiconductor substrate; forming a buried contact opening through the first insulating layer and over at least a portion of the gate region outside the active region, thereby exposing at least a portion of the underlying gate region; forming a conductive bottom plate layer within the buried contact opening and on the first insulating layer, thereby physically and electrically contacting the exposed portion of the underlying gate region; forming a dielectric layer on the conductive bottom plate layer and over the entire substrate; and forming a conductive top plate layer on the dielectric layer.
Claim 2
Independent Claim
151 words
A method of forming an electrically reprogrammable integrated circuit transistor, the method comprising the steps of: forming active regions on a semiconductor substrate; forming field-effect transistor (FET) source/drain regions in the active regions; forming FET gate regions in the active regions and extending at least partially outside of the active regions; forming a first insulating layer on the semiconductor substrate; forming a buried contact opening through the first insulating layer and over at least a portion of the gate region outside the active region, thereby exposing at least a portion of the underlying gate region; forming a conductive bottom plate layer within the buried contact opening and on the first insulating layer, thereby physically and electrically contacting the exposed portion of the underlying gate region; forming a dielectric layer on the conductive bottom plate layer and over the entire substrate; and forming a conductive top plate layer on the dielectric layer.
Claim 3
Dependent Claim
23 words
The method of claim 1 wherein the gate region, conductive bottom plate layer, and conductive top plate layer comprise conductively doped polycrystalline silicon.
Claim 4
Dependent Claim
12 words
The method of claim 1 wherein the dielectric layer comprises silicon nitride.
Claim 5
Dependent Claim
45 words
The method of claim 1 wherein the step of forming the buried contact opening includes the step of forming a dynamic random access memory (DRAM) cell buried contact opening through the first insulating layer over a transistor source/drain region, thereby exposing the underlying source/drain region.
Claim 6
Dependent Claim
55 words
The method of claim 4 wherein the step of forming the conductive bottom plate layer includes the step of forming the conductive bottom plate layer within the DRAM cell buried contact opening such that the conductive bottom plate layer physically and electrically contacts the exposed underlying source/drain region within the memory cell buried contact opening.
Claim 7
Independent Claim
208 words
A method of fabricating an integrated circuit having both a dynamic random access memory (DRAM) cell and an electrically reprogrammable transistor, the method comprising the steps of: forming active regions on a semiconductor substrate; forming field-effect transistor (FET) source/drain regions in the active regions; forming FET gate regions in the active regions and extending at least partially outside the active regions; forming a first insulating layer on the semiconductor substrate; forming a buried contact opening through the first insulating layer and over at least a portion of an electrically programmable transistor gate region outside the active region, thereby exposing at least a portion of the underlying gate region; forming a buffed contact opening through the first insulating layer and over at least a portion of the source/drain region in the DRAM cell, thereby exposing at least a portion of the underlying source/drain region; forming a conductive bottom plate layer within the buffed contact openings and on the first insulating layer, thereby physically and electrically contacting the exposed portion of the underlying electrically reprogrammable transistor gate region and the DRAM cell source/drain region; forming a dielectric layer on the conductive bottom plate layer and over the entire substrate; and forming a conductive top plate layer on the dielectric layer.
Claim 8
Independent Claim
208 words
A method of fabricating an integrated circuit having both a dynamic random access memory (DRAM) cell and an electrically reprogrammable transistor, the method comprising the steps of: forming active regions on a semiconductor substrate; forming field-effect transistor (FET) source/drain regions in the active regions; forming FET gate regions in the active regions and extending at least partially outside the active regions; forming a first insulating layer on the semiconductor substrate; forming a buried contact opening through the first insulating layer and over at least a portion of an electrically programmable transistor gate region outside the active region, thereby exposing at least a portion of the underlying gate region; forming a buffed contact opening through the first insulating layer and over at least a portion of the source/drain region in the DRAM cell, thereby exposing at least a portion of the underlying source/drain region; forming a conductive bottom plate layer within the buffed contact openings and on the first insulating layer, thereby physically and electrically contacting the exposed portion of the underlying electrically reprogrammable transistor gate region and the DRAM cell source/drain region; forming a dielectric layer on the conductive bottom plate layer and over the entire substrate; and forming a conductive top plate layer on the dielectric layer.
Claim 9
Independent Claim
133 words
A method of contacting a gate region of an integrated circuit transistor, the method comprising the steps of: forming an active region on a semiconductor substrate; forming field-effect transistor (FET) source/drain regions in the active region; forming a FET gate region in the active region and extending at least partially outside the active region; forming a first insulating layer on the semiconductor substrate; forming a buffed contact opening through the first insulating layer and over at least a portion of the gate region outside the active region, thereby exposing at least a portion of the underlying gate region; and forming a conductive bottom plate layer within the buried contact opening and on the first insulating layer, thereby physically and electrically contacting the exposed portion of the underlying gate region outside the active region.
Claim 10
Independent Claim
133 words
A method of contacting a gate region of an integrated circuit transistor, the method comprising the steps of: forming an active region on a semiconductor substrate; forming field-effect transistor (FET) source/drain regions in the active region; forming a FET gate region in the active region and extending at least partially outside the active region; forming a first insulating layer on the semiconductor substrate; forming a buffed contact opening through the first insulating layer and over at least a portion of the gate region outside the active region, thereby exposing at least a portion of the underlying gate region; and forming a conductive bottom plate layer within the buried contact opening and on the first insulating layer, thereby physically and electrically contacting the exposed portion of the underlying gate region outside the active region.
Claim 11
Dependent Claim
40 words
The method of claim 6, wherein the steps of forming the buried contact openings through the first insulating layer over each of the electrically programmable transistor gate region and the source/drain region in the DRAM cell are carried out simultaneously.
Claim 12
Dependent Claim
36 words
The method of claim 6, wherein the step of forming a dielectric layer includes forming an interpoly dielectric layer in the electrically reprogrammable transistor, and simultaneously forming a memory cell capacitor dielectric in the DRAM cell.
Claim 13
Dependent Claim
40 words
The method of claim 6, wherein the step of forming a conductive top plate layer includes forming a control gate electrode in the electrically reprogrammable transistor, and simultaneously forming a memory cell capacitor top plate electrode in the DRAM cell.
Claim 14
Dependent Claim
23 words
The method of claim 6, wherein the gate region, conductive bottom plate layer, and conductive top plate layer comprise conductively doped polycrystalline silicon.
Claim 15
Dependent Claim
12 words
The method of claim 6, wherein the dielectric layer comprises silicon nitride.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-03-02 | 2001-09-01 | 2002-03-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-03-02 | 2005-09-01 | 2006-03-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-03-02 | 2009-09-01 | 2010-03-03 | $7700.00 | Window Closed / Lapsed |