US5723356A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Fabrication method for semiconductor device
Assignee: Sony Corp
•
Filing: 1996-07-29
•
Granted: 1998-03-03
•
Expires: 2016-07-29
Abstract
Abstract A first Poly-Si film and an a-Si film are formed on a semiconductor base body at a first step, and phosphorus ions (N-type impurity) are implanted in the a-Si film at an NMOS forming region and boron ions (P-type impurity) are implanted in the a-Si film at a PMOS forming region at a second step. The a-Si film is crystallized to form a second Poly-Si film and at the same time the impurities are diffused in the second Poly-Si film thus obtained and the first Poly-Si film at a third step. After that, a WSi x film is formed on the second Poly-Si film at a fourth step, and an offset oxide film is formed on the WSi x film at a fifth step. With this method, it is possible to suppress mutual diffusion of impurities having conducting types different from each other and hence to fabricate a semiconductor device such as a CMOS, which is low in variations in threshold voltage and excellent in device characteristics.
Inventors
- 👤 Masanori Tsukamoto
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 22:17
CPC Classifications
H; H10; H10D; H10D64/00; H10D64/01; H10D64/013; H10D64/01302; H10D64/01304; H10D64/01306; H10D64/01308; H10D64/01312; H10D84/00; H10D84/01; H10D84/0123; H10D84/0126; H10D84/0165; H10D84/0172; H10D84/0174; H10D84/0177; H10D84/02; H10D84/03; H10D84/038
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
224 words
A fabrication method for a semiconductor device including a semiconductor base body; and a first semiconducting element having a first conductive portion of a first conducting type and a second semiconducting element having a second conductive portion of a second conducting type, which are formed on said semiconductor base body; wherein each of said first and second conductive portions of said first and second semiconducting elements is composed of a polysilicon film, and a metal film or a metal compound film formed on said polysilicon film, said method comprising: a first step of forming an amorphous silicon film on said semiconductor base body; a second step of implanting ions of an impurity having the first conducting type in said amorphous silicon film at a region on which said first semiconducting element is to be formed, and implanting ions of an impurity having the second conducting type in said amorphous silicon film at a region on which said second semiconducting element is to be formed; a third step of crystallizing said amorphous silicon film to form said polysilicon film and at the same time diffusing said impurities in said polysilicon film, by heat treatment; a fourth step of forming a metal or metal compound film on said polysilicon film; and a fifth step of forming an insulating film on said metal or metal compound film.
Claim 2
Dependent Claim
224 words
A fabrication method for a semiconductor device including a semiconductor base body; and a first semiconducting element having a first conductive portion of a first conducting type and a second semiconducting element having a second conductive portion of a second conducting type, which are formed on said semiconductor base body; wherein each of said first and second conductive portions of said first and second semiconducting elements is composed of a polysilicon film, and a metal film or a metal compound film formed on said polysilicon film, said method comprising: a first step of forming an amorphous silicon film on said semiconductor base body; a second step of implanting ions of an impurity having the first conducting type in said amorphous silicon film at a region on which said first semiconducting element is to be formed, and implanting ions of an impurity having the second conducting type in said amorphous silicon film at a region on which said second semiconducting element is to be formed; a third step of crystallizing said amorphous silicon film to form said polysilicon film and at the same time diffusing said impurities in said polysilicon film, by heat treatment; a fourth step of forming a metal or metal compound film on said polysilicon film; and a fifth step of forming an insulating film on said metal or metal compound film.
Claim 3
Dependent Claim
50 words
A fabrication method for a semiconductor device according to claim 1, wherein said third step comprises: a first heat-treatment step of crystallizing said amorphous silicon film; and a second heat-treatment step of diffusing said impurities in said polysilicon film at a temperature higher than that in said first heat-treatment step.
Claim 4
Dependent Claim
22 words
A fabrication method for a semiconductor device according to claim 2, wherein said second heat-treatment step is performed by rapid thermal annealing.
Claim 5
Dependent Claim
25 words
A fabrication method for a semiconductor device according to claim 1, wherein said heat treatment in said third step is performed by rapid thermal annealing.
Claim 6
Dependent Claim
249 words
A fabrication method for a semiconductor device including a semiconductor base body; and a first semiconducting element having a first conductive portion of a first conducting type and a second semiconducting element having a second conductive portion of a second conducting type, which are formed on said semiconductor base body; wherein each of said first and second conductive portions of said first and second semiconducting elements is composed of a first polysilicon film, a second polysilicon film formed on said first polysilicon film, and a metal film or a metal compound film formed on said second polysilicon film, said method comprising: a first step of forming said first polysilicon film and an amorphous silicon film respectively stacked on said semiconductor base body; a second step of implanting ions of an impurity having the first conducting type in said amorphous silicon at a region on which said first semiconducting element is to be formed, and implanting ions of an impurity having the second conducting type in said amorphous silicon at a region on which said second semiconducting element is to be formed; a third step of crystallizing said amorphous silicon film to form said second polysilicon film and at the same time diffusing said impurities in said second polysilicon film and said first polysilicon film, by heat treatment; a fourth step of forming a metal or metal compound film on said second polysilicon film; and a fifth step of forming an insulating film on said metal or metal compound film.
Claim 7
Dependent Claim
249 words
A fabrication method for a semiconductor device including a semiconductor base body; and a first semiconducting element having a first conductive portion of a first conducting type and a second semiconducting element having a second conductive portion of a second conducting type, which are formed on said semiconductor base body; wherein each of said first and second conductive portions of said first and second semiconducting elements is composed of a first polysilicon film, a second polysilicon film formed on said first polysilicon film, and a metal film or a metal compound film formed on said second polysilicon film, said method comprising: a first step of forming said first polysilicon film and an amorphous silicon film respectively stacked on said semiconductor base body; a second step of implanting ions of an impurity having the first conducting type in said amorphous silicon at a region on which said first semiconducting element is to be formed, and implanting ions of an impurity having the second conducting type in said amorphous silicon at a region on which said second semiconducting element is to be formed; a third step of crystallizing said amorphous silicon film to form said second polysilicon film and at the same time diffusing said impurities in said second polysilicon film and said first polysilicon film, by heat treatment; a fourth step of forming a metal or metal compound film on said second polysilicon film; and a fifth step of forming an insulating film on said metal or metal compound film.
Claim 8
Dependent Claim
78 words
A fabrication method for a semiconductor device according to claim 5, wherein said third step comprises: a first heat-treatment step of crystallizing said amorphous silicon film such that a crystal grain thereof is larger than that of said first polysilicon silicon film, to form said second polysilicon film; and a second heat-treatment step of diffusing said impurities in said first polysilicon film and said second polysilicon film at a temperature higher than that in said first heat-treatment step.
Claim 9
Dependent Claim
22 words
A fabrication method for a semiconductor device according to claim 6, wherein said second heat-treatment step is performed by rapid thermal annealing.
Claim 10
Dependent Claim
25 words
A fabrication method for a semiconductor device according to claim 5, wherein said heat treatment in said third step is performed by rapid thermal annealing.
References Cited (Backward Citations)
US5180690A
Cited
US5459101A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-03-02 | 2001-09-01 | 2002-03-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-03-02 | 2005-09-01 | 2006-03-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-03-02 | 2009-09-01 | 2010-03-03 | $7700.00 | Window Closed / Lapsed |