Patent US5721687A successfully refreshed from Google Patents.
US5721687A
Expired / Lapsed
US
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Ultrahigh vacuum focused ion beam micromill and articles therefrom
Assignee: Los Alamos National Security LLC
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Filing: 1995-02-01
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Granted: 1998-02-24
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Expires: 2015-02-01
Abstract
Abstract An ultrahigh vacuum focused ion beam micromilling apparatus and process are disclosed. Additionally, a durable data storage medium using the micromilling process is disclosed, the durable data storage medium capable of storing, e.g., digital or alphanumeric characters as well as graphical shapes or characters.
Inventors
- 👤 Bruce C. Lamartine
- 👤 Roger A. Stutz
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 16:34
CPC Classifications
H; H01; H01J; H01J37/00; H01J37/30; H01J37/305; H01J37/3053; H01J37/3056; H01J2237/00; H01J2237/30; H01J2237/304; H01J2237/30405; H01J2237/30411
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
113 words
A process of machining a bandpass filter microstructure having a milled depth to milled horizontal cut ratio of greater than about 10 within a target substrate comprising: placing a target substrate within an ultrahigh vacuum environment; producing a computer data file adapted for operation of a computer-controlled focused ion beam so as to form a milled bandpass filter microstructure in said target substrate; and, exposing said target substrate to said computer-controlled focused ion beam, said computer-controlled focused ion beam controlled by software utilizing said computer data file whereby a milled bandpass filter microstructure having a milled depth to milled horizontal cut ratio of greater than about 10 is formed in said target substrate.
Claim 2
Dependent Claim
113 words
A process of machining a bandpass filter microstructure having a milled depth to milled horizontal cut ratio of greater than about 10 within a target substrate comprising: placing a target substrate within an ultrahigh vacuum environment; producing a computer data file adapted for operation of a computer-controlled focused ion beam so as to form a milled bandpass filter microstructure in said target substrate; and, exposing said target substrate to said computer-controlled focused ion beam, said computer-controlled focused ion beam controlled by software utilizing said computer data file whereby a milled bandpass filter microstructure having a milled depth to milled horizontal cut ratio of greater than about 10 is formed in said target substrate.
Claim 3
Dependent Claim
116 words
A process of machining a data storage medium microstructure having a milled depth to milled horizontal cut ratio of greater than about 10 within a target substrate comprising: placing a target substrate within an ultrahigh vacuum environment; producing a computer data file adapted for operation of a computer-controlled focused ion beam so as to form a milled data storage medium microstructure in said target substrate; and, exposing said target substrate to said computer-controlled focused ion beam, said computer-controlled focused ion beam controlled by software utilizing said computer data file whereby a milled data storage medium microstructure having a milled depth to milled horizontal cut ratio of greater than about 10 is formed in said target substrate.
Claim 4
Dependent Claim
116 words
A process of machining a data storage medium microstructure having a milled depth to milled horizontal cut ratio of greater than about 10 within a target substrate comprising: placing a target substrate within an ultrahigh vacuum environment; producing a computer data file adapted for operation of a computer-controlled focused ion beam so as to form a milled data storage medium microstructure in said target substrate; and, exposing said target substrate to said computer-controlled focused ion beam, said computer-controlled focused ion beam controlled by software utilizing said computer data file whereby a milled data storage medium microstructure having a milled depth to milled horizontal cut ratio of greater than about 10 is formed in said target substrate.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-02-23 | 2001-08-25 | 2002-02-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-02-23 | 2005-08-25 | 2006-02-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-02-23 | 2009-08-25 | 2010-02-24 | $7700.00 | Window Closed / Lapsed |