Claims Analysis
Total Claims: 52
Claim 1
Independent Claim
115 words
A method for forming a phase shift reticle comprising: providing a transparent substrate; forming an opaque layer on the substrate; etching the opaque layer to form a pair of spaced opaque members, each opaque member having a first edge and a second edge, each opaque member having a width of from about 0.25 μm to 1.75 μm; and etching the substrate to form a phase shifter between the first edges of the opaque members, said phase shifter having a width of from about 0.25 μm to 1.0 μm, said opaque members and phase shifter configured to print a feature on a target, said feature having edges defined by the second edges of the opaque members.
Claim 2
Independent Claim
115 words
A method for forming a phase shift reticle comprising: providing a transparent substrate; forming an opaque layer on the substrate; etching the opaque layer to form a pair of spaced opaque members, each opaque member having a first edge and a second edge, each opaque member having a width of from about 0.25 μm to 1.75 μm; and etching the substrate to form a phase shifter between the first edges of the opaque members, said phase shifter having a width of from about 0.25 μm to 1.0 μm, said opaque members and phase shifter configured to print a feature on a target, said feature having edges defined by the second edges of the opaque members.
Claim 3
Dependent Claim
16 words
The method as claimed in claim 1 wherein etching the substrate comprises an anisotropic etch process.
Claim 4
Dependent Claim
30 words
The method as claimed in claim 1 wherein etching the substrate comprises anisotropically etching the substrate to a first depth and then isotropically etching the substrate to a second depth.
Claim 5
Dependent Claim
37 words
The method as claimed in claim 1 wherein etching the substrate comprises anisotropically etching the phase shifter to a first depth and then isotropically etching all of the substrate including the phase shifter to a second depth.
Claim 6
Independent Claim
109 words
A method for forming a phase shift reticle comprising: providing a transparent substrate; forming a first opaque member on the substrate, said first opaque member having a first edge and a second edge, said first opaque member having a first width between about 0.25 μm to 1.75 μm; forming a second opaque member on the substrate, said second opaque member having a third edge and a fourth edge, said second opaque member having a second width between about 0.25 μm to 1.75 μm; forming a phase shifter between the first edge and the third edge, said phase shifter having a third width of about 0.25 μm to 1.0 μm.
Claim 7
Independent Claim
109 words
A method for forming a phase shift reticle comprising: providing a transparent substrate; forming a first opaque member on the substrate, said first opaque member having a first edge and a second edge, said first opaque member having a first width between about 0.25 μm to 1.75 μm; forming a second opaque member on the substrate, said second opaque member having a third edge and a fourth edge, said second opaque member having a second width between about 0.25 μm to 1.75 μm; forming a phase shifter between the first edge and the third edge, said phase shifter having a third width of about 0.25 μm to 1.0 μm.
Claim 8
Dependent Claim
31 words
The method as claimed in claim 5 wherein forming the phase shifter comprises etching the substrate to a depth to provide a phase shift of π or odd integral multiple thereof.
Claim 9
Dependent Claim
22 words
The method as claimed in claim 5 wherein a fourth width of the feature corresponds to the first, second and third widths.
Claim 10
Dependent Claim
27 words
The method as claimed in claim 5 further comprising forming an alternating aperture phase shift pattern on the substrate proximate to the first or second opaque member.
Claim 11
Dependent Claim
17 words
The method as claimed in claim 5 wherein forming the phase shifter comprises anisotropically etching the substrate.
Claim 12
Independent Claim
134 words
A method for fabricating a phase shift reticle comprising: providing a transparent substrate; forming a phase shifter on the substrate, said phase shifter having a first edge, a second edge and a width x1; forming a first opaque member on the substrate proximate to the first edge, said first opaque member having a third edge and a width of x2; forming a second opaque member on the substrate proximate to the second edge, said second opaque member having a fourth edge and a width of x3; selecting a dimensional value for x1, x2 and x3 such that during a lithographic process using the reticle, a feature printed on a target has an overall width corresponding to xl+x2+x3, a fifth edge corresponding to the second edge, and a sixth edge corresponding to the third edge.
Claim 13
Independent Claim
134 words
A method for fabricating a phase shift reticle comprising: providing a transparent substrate; forming a phase shifter on the substrate, said phase shifter having a first edge, a second edge and a width x1; forming a first opaque member on the substrate proximate to the first edge, said first opaque member having a third edge and a width of x2; forming a second opaque member on the substrate proximate to the second edge, said second opaque member having a fourth edge and a width of x3; selecting a dimensional value for x1, x2 and x3 such that during a lithographic process using the reticle, a feature printed on a target has an overall width corresponding to xl+x2+x3, a fifth edge corresponding to the second edge, and a sixth edge corresponding to the third edge.
Claim 14
Dependent Claim
15 words
The method as claimed in claim 10 wherein xl equals 0.1 μm to 0.25 μm.
Claim 15
Dependent Claim
15 words
The method as claimed in claim 10 wherein xl equals 0.25 μm to 1.0 μm.
Claim 16
Independent Claim
140 words
A method for forming a phase shift structure for forming an isolated linear feature on a semiconductor wafer, during a lithographic process, said method comprising: forming a transparent substrate; forming a first opaque member on the substrate having an outer edge and an inner edge; forming a second opaque member on the substrate having an outer edge and an inner edge; etching a phase shifter between the inner edges of the first and second opaque members; controlling the etching step to form the phase shifter with a depth to provide a phase shift for light passing through the phase shifter relative to light passing through a remainder of the substrate; and controlling the etching step to form the phase shifter with a width to form the linear feature with longitudinal edges corresponding to the outer edges of the opaque members.
Claim 17
Independent Claim
140 words
A method for forming a phase shift structure for forming an isolated linear feature on a semiconductor wafer, during a lithographic process, said method comprising: forming a transparent substrate; forming a first opaque member on the substrate having an outer edge and an inner edge; forming a second opaque member on the substrate having an outer edge and an inner edge; etching a phase shifter between the inner edges of the first and second opaque members; controlling the etching step to form the phase shifter with a depth to provide a phase shift for light passing through the phase shifter relative to light passing through a remainder of the substrate; and controlling the etching step to form the phase shifter with a width to form the linear feature with longitudinal edges corresponding to the outer edges of the opaque members.
Claim 18
Independent Claim
159 words
A method for forming a phase shift structure for forming an isolated linear feature on a target, during a lithographic process with a 5× optical projection system at an exposure wavelength of 365 nm, said method comprising: forming a transparent substrate; forming a first opaque member on the substrate having an outer edge and an inner edge; forming a second opaque member on the substrate having an outer edge and an inner edge; etching a phase shifter between the inner edges of the first and second opaque members; controlling the etching step to form the phase shifter with a depth to provide a phase shift for light passing through the phase shifter relative to light passing through a remainder of the substrate; and controlling the etching step to form the phase shifter with a width between about 0.25 μm to 1.0 μm to form the linear feature with longitudinal edges corresponding to the outer edges of the opaque members.
Claim 19
Independent Claim
159 words
A method for forming a phase shift structure for forming an isolated linear feature on a target, during a lithographic process with a 5× optical projection system at an exposure wavelength of 365 nm, said method comprising: forming a transparent substrate; forming a first opaque member on the substrate having an outer edge and an inner edge; forming a second opaque member on the substrate having an outer edge and an inner edge; etching a phase shifter between the inner edges of the first and second opaque members; controlling the etching step to form the phase shifter with a depth to provide a phase shift for light passing through the phase shifter relative to light passing through a remainder of the substrate; and controlling the etching step to form the phase shifter with a width between about 0.25 μm to 1.0 μm to form the linear feature with longitudinal edges corresponding to the outer edges of the opaque members.
Claim 20
Independent Claim
175 words
A method for forming a phase shift structure for forming an isolated linear feature on a target, during a lithographic process with a 5× optical projection system at an exposure wavelength of 365 nm, said method comprising: forming a transparent substrate; forming a first opaque member on the substrate having an outer edge and an inner edge, and a first width between about 0.25 μm to 1.75 μm; forming a second opaque member on the substrate having an outer edge and an inner edge, and a second width between about 0.25 μm to 1.75 μm; etching a phase shifter between the inner edges of the first and second opaque members; controlling the etching step to form the phase shifter with a depth to provide a phase shift for light passing through the phase shifter relative to light passing through a remainder of the substrate; and controlling the etching step to form the phase shifter with a third width to form the linear feature with longitudinal edges corresponding to the outer edges of the opaque members.
Claim 21
Independent Claim
175 words
A method for forming a phase shift structure for forming an isolated linear feature on a target, during a lithographic process with a 5× optical projection system at an exposure wavelength of 365 nm, said method comprising: forming a transparent substrate; forming a first opaque member on the substrate having an outer edge and an inner edge, and a first width between about 0.25 μm to 1.75 μm; forming a second opaque member on the substrate having an outer edge and an inner edge, and a second width between about 0.25 μm to 1.75 μm; etching a phase shifter between the inner edges of the first and second opaque members; controlling the etching step to form the phase shifter with a depth to provide a phase shift for light passing through the phase shifter relative to light passing through a remainder of the substrate; and controlling the etching step to form the phase shifter with a third width to form the linear feature with longitudinal edges corresponding to the outer edges of the opaque members.
Claim 22
Independent Claim
159 words
A method for forming a phase shift structure for forming an isolated linear feature on a target, during a lithographic process with a 1× optical projection system at an exposure wavelength of 365 nm, said method comprising: forming a transparent substrate; forming a first opaque member on the substrate having an outer edge and an inner edge; forming a second opaque member on the substrate having an outer edge and an inner edge; etching a phase shifter between the inner edges of the first and second opaque members; controlling the etching step to form the phase shifter with a depth to provide a phase shift for light passing through the phase shifter relative to light passing through a remainder of the substrate; and controlling the etching step to form the phase shifter with a width between about 0.1 μm to 0.25 μm to form the linear feature with longitudinal edges corresponding to the outer edges of the opaque members.
Claim 23
Independent Claim
159 words
A method for forming a phase shift structure for forming an isolated linear feature on a target, during a lithographic process with a 1× optical projection system at an exposure wavelength of 365 nm, said method comprising: forming a transparent substrate; forming a first opaque member on the substrate having an outer edge and an inner edge; forming a second opaque member on the substrate having an outer edge and an inner edge; etching a phase shifter between the inner edges of the first and second opaque members; controlling the etching step to form the phase shifter with a depth to provide a phase shift for light passing through the phase shifter relative to light passing through a remainder of the substrate; and controlling the etching step to form the phase shifter with a width between about 0.1 μm to 0.25 μm to form the linear feature with longitudinal edges corresponding to the outer edges of the opaque members.
Claim 24
Independent Claim
175 words
A method for forming a phase shift structure for forming an isolated linear feature on a target, during a lithographic process with a 1× optical projection system at an exposure wavelength of 365 nm, said method comprising: forming a transparent substrate; forming a first opaque member on the substrate having an outer edge and an inner edge, and a first width between about 0.1 μm to 0.25 μm; forming a second opaque member on the substrate having an outer edge and an inner edge, and a second width between about 0.1 μm to 0.25 μm; etching a phase shifter between the inner edges of the first and second opaque members; controlling the etching step to form the phase shifter with a depth to provide a phase shift for light passing through the phase shifter relative to light passing through a remainder of the substrate; and controlling the etching step to form the phase shifter with a third width to form the linear feature with longitudinal edges corresponding to the outer edges of the opaque members.
Claim 25
Independent Claim
175 words
A method for forming a phase shift structure for forming an isolated linear feature on a target, during a lithographic process with a 1× optical projection system at an exposure wavelength of 365 nm, said method comprising: forming a transparent substrate; forming a first opaque member on the substrate having an outer edge and an inner edge, and a first width between about 0.1 μm to 0.25 μm; forming a second opaque member on the substrate having an outer edge and an inner edge, and a second width between about 0.1 μm to 0.25 μm; etching a phase shifter between the inner edges of the first and second opaque members; controlling the etching step to form the phase shifter with a depth to provide a phase shift for light passing through the phase shifter relative to light passing through a remainder of the substrate; and controlling the etching step to form the phase shifter with a third width to form the linear feature with longitudinal edges corresponding to the outer edges of the opaque members.
Claim 26
Independent Claim
122 words
A method of phase shift lithography comprising: providing a target with a layer of resist; providing a 5× reticle comprising a transparent substrate and a phase shift structure, said phase shift structure comprising a pair of spaced opaque members, each opaque member having a first edge and a second edge, each opaque member having a width of from about 0.25 μm to 1.75 μm, said phase shift structure further comprising a phase shifter between the first edges of the opaque members, said phase shifter having a width of from about 0.25 μm to 1.0 μm; passing an exposure energy through the reticle to print a feature on the target, said feature having edges defined by the second edges of the opaque members.
Claim 27
Independent Claim
122 words
A method of phase shift lithography comprising: providing a target with a layer of resist; providing a 5× reticle comprising a transparent substrate and a phase shift structure, said phase shift structure comprising a pair of spaced opaque members, each opaque member having a first edge and a second edge, each opaque member having a width of from about 0.25 μm to 1.75 μm, said phase shift structure further comprising a phase shifter between the first edges of the opaque members, said phase shifter having a width of from about 0.25 μm to 1.0 μm; passing an exposure energy through the reticle to print a feature on the target, said feature having edges defined by the second edges of the opaque members.
Claim 28
Dependent Claim
18 words
The method as claimed in claim 18 wherein the phase shifter comprises an indentation etched into the substrate.
Claim 29
Dependent Claim
18 words
The method as claimed in claim 18 wherein the opaque members comprise a layer deposited on the substrate.
Claim 30
Dependent Claim
18 words
The method as claimed in claim 18 wherein the exposure energy has a wavelength of about 365 nm.
Claim 31
Independent Claim
122 words
A method of phase shift lithography comprising: providing a target with a layer of resist; providing a 1× reticle comprising a transparent substrate and a phase shift structure, said phase shift structure comprising a pair of spaced opaque members, each opaque member having a first edge and a second edge, each opaque member having a width of from about 0.1 μm to 0.25 μm, said phase shift structure further comprising a phase shifter between the first edges of the opaque members, said phase shifter having a width of from about 0.1 μm to 0.25 μm; passing an exposure energy through the reticle to print a feature on the target, said feature having edges defined by the second edges of the opaque members.
Claim 32
Independent Claim
122 words
A method of phase shift lithography comprising: providing a target with a layer of resist; providing a 1× reticle comprising a transparent substrate and a phase shift structure, said phase shift structure comprising a pair of spaced opaque members, each opaque member having a first edge and a second edge, each opaque member having a width of from about 0.1 μm to 0.25 μm, said phase shift structure further comprising a phase shifter between the first edges of the opaque members, said phase shifter having a width of from about 0.1 μm to 0.25 μm; passing an exposure energy through the reticle to print a feature on the target, said feature having edges defined by the second edges of the opaque members.
Claim 33
Dependent Claim
18 words
The method as claimed in claim 22 wherein the phase shifter comprises an indentation etched into the substrate.
Claim 34
Dependent Claim
18 words
The method as claimed in claim 22 wherein the opaque members comprise a layer deposited on the substrate.
Claim 35
Dependent Claim
18 words
The method as claimed in claim 22 wherein the exposure energy has a wavelength of about 365 nm.
Claim 36
Dependent Claim
132 words
A phase shift structure comprising: a transparent substrate; a phase shifter on the substrate, said phase shifter configured to provide a phase shift in exposure energy passing through the phase shifter, relative to exposure energy passing through a remainder of the substrate, said phase shifter having a width of about 0.1 μm to 0.25 μm; a first opaque member on the substrate, said first opaque member including a first edge proximate to the phase shifter and a second edge; a second opaque member on the substrate, said second opaque member including a third edge proximate to the phase shifter and a fourth edge; said phase shifter, and said first and second opaque members, configured to print a feature on a target, said feature including edges defined by said second and fourth edges.
Claim 37
Dependent Claim
132 words
A phase shift structure comprising: a transparent substrate; a phase shifter on the substrate, said phase shifter configured to provide a phase shift in exposure energy passing through the phase shifter, relative to exposure energy passing through a remainder of the substrate, said phase shifter having a width of about 0.1 μm to 0.25 μm; a first opaque member on the substrate, said first opaque member including a first edge proximate to the phase shifter and a second edge; a second opaque member on the substrate, said second opaque member including a third edge proximate to the phase shifter and a fourth edge; said phase shifter, and said first and second opaque members, configured to print a feature on a target, said feature including edges defined by said second and fourth edges.
Claim 38
Dependent Claim
20 words
The phase shift structure as claimed in claim 26 wherein the feature comprises an isolated line on a semiconductor wafer.
Claim 39
Dependent Claim
27 words
The phase shift structure as claimed in claim 26 wherein a second width of the first and second opaque members is about 0.1 μm to 0.25 μm.
Claim 40
Dependent Claim
20 words
The phase shift structure as claimed in claim 26 wherein the exposure energy has a wavelength of about 365 nm.
Claim 41
Dependent Claim
28 words
The phase shift structure as claimed in claim 26 wherein a depth of the phase shifter is selected to provide a phase shift of π odd multiple thereof.
Claim 42
Dependent Claim
23 words
The phase shift structure as claimed in claim 26 wherein the phase shifter is anisotropically etched into the substrate with a vertical profile.
Claim 43
Dependent Claim
30 words
The phase shift structure as claimed in claim 26 wherein the phase shifter is etched into the substrate with an undercut profile using a combination anisotropic and isotropic etch process.
Claim 44
Dependent Claim
28 words
The phase shift structure as claimed in claim 26 wherein the substrate comprises a material selected from the group consisting of quartz and Al 2 O 3 .
Claim 45
Dependent Claim
26 words
The phase shift structure as claimed in claim 26 further comprising an alternating aperture phase shift pattern formed proximate to the first or second opaque member.
Claim 46
Dependent Claim
122 words
A phase shift structure comprising: a transparent substrate; a first opaque member on the substrate including a first edge and a second edge; a second opaque member on the substrate including a third edge and a fourth edge; a phase shifter on the substrate located between said first and third edges, said phase shifter configured to provide a phase shift for exposure energy passing through the phase shifter relative to exposure energy passing through a remainder of the substrate, said phase shifter having a width of from about 0.25 μm to 1.0 μm; said phase shifter, and said first and second opaque members, configured to print a feature on a target, said feature including edges defined by said second and fourth edges.
Claim 47
Dependent Claim
122 words
A phase shift structure comprising: a transparent substrate; a first opaque member on the substrate including a first edge and a second edge; a second opaque member on the substrate including a third edge and a fourth edge; a phase shifter on the substrate located between said first and third edges, said phase shifter configured to provide a phase shift for exposure energy passing through the phase shifter relative to exposure energy passing through a remainder of the substrate, said phase shifter having a width of from about 0.25 μm to 1.0 μm; said phase shifter, and said first and second opaque members, configured to print a feature on a target, said feature including edges defined by said second and fourth edges.
Claim 48
Dependent Claim
20 words
The phase shift structure as claimed in claim 35 wherein the feature comprises an isolated line on a semiconductor wafer.
Claim 49
Dependent Claim
17 words
The phase shift structure as claimed in claim 35 wherein the phase shifter has a vertical profile.
Claim 50
Dependent Claim
24 words
The phase shift structure as claimed in claim 35 wherein the phase shifter has a profile that is rounded and undercuts the opaque members.
Claim 51
Dependent Claim
24 words
The phase shift structure as claimed in claim 35 further comprising an alternating aperture phase shift structure formed proximate to the phase shift structure.
Claim 52
Dependent Claim
29 words
The phase shift structure as claimed in claim 35 wherein the exposure energy has a wavelength of about 365 nm and the feature is reduced in size by 5×.