Patent US5707749A successfully refreshed from Google Patents.
US5707749A
Expired / Lapsed
US
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Method for producing thin film multilayer wiring board
Assignee: Hitachi Ltd
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Filing: 1995-06-26
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Granted: 1998-01-13
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Expires: 2015-06-26
Abstract
Abstract A thin film multilayer wiring material excellent in reliability, yield, productivity, and higher positioning accuracy includes an insulation organic film having a wiring pattern on one surface and an adhesive layer on another principal surface. The insulation organic film is a polyimide film having a heat resistance at a pyrolysis beginning temperature of 350 DEG to 550 DEG C., a dielectric constant of 3.5-2.2 and a flame retardance of V-0 or V-1 according to the UL-94 standard. The adhesive layer contains an ether bismaleimide compound.
Inventors
- 👤 Junichi Katagiri
- 👤 Akio Takahashi
- 👤 Akira Nagai
- 👤 Haruo Akahoshi
- 👤 Kouji Fujisaki
- 👤 Akio Mukoh
- 👤 Fumiyuki Kobayashi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:51
CPC Classifications
B; B32; B32B; B32B15/00; B32B15/04; B32B15/08; B32B27/00; B32B27/28; B32B27/281; H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4652; H05K3/4655; B32B2307/00; B32B2307/20; B32B2307/206; B32B2307/30; B32B2307/306; B32B2307/3065; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154; H05K2201/0183; H05K2201/0195; H05K2203/00; H05K2203/10; H05K2203/107; H05K3/0011; H05K3/0017; H05K3/38; H05K3/386; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49165; Y10T428/00; Y10T428/28; Y10T428/2848; Y10T428/31504; Y10T428/31721
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
131 words
A thin film multilayer wiring material which comprises an insulation organic film having a wiring pattern layer on one principal surface and an adhesive layer on another principal surface; said insulation organic film being a polyimide film having a repeating structure represented by the following formula: ##STR7## wherein X represents an aromatic diamine residue and the adhesive layer contains an ether bismaleimide compound represented by the following formula: ##STR8## wherein R 1 represents a hydrogen atom, a lower alkyl group or a lower fluoroalkyl group, R 2 represents a hydrogen atom, a lower alkyl group or a lower fluoroalkyl group, m represents an integer of 1 to 4, and R 3 and R 4 each represents CH 3 or CF 3 and may be identical with or different from each other.
Claim 2
Dependent Claim
131 words
A thin film multilayer wiring material which comprises an insulation organic film having a wiring pattern layer on one principal surface and an adhesive layer on another principal surface; said insulation organic film being a polyimide film having a repeating structure represented by the following formula: ##STR7## wherein X represents an aromatic diamine residue and the adhesive layer contains an ether bismaleimide compound represented by the following formula: ##STR8## wherein R 1 represents a hydrogen atom, a lower alkyl group or a lower fluoroalkyl group, R 2 represents a hydrogen atom, a lower alkyl group or a lower fluoroalkyl group, m represents an integer of 1 to 4, and R 3 and R 4 each represents CH 3 or CF 3 and may be identical with or different from each other.
Claim 3
Dependent Claim
50 words
A thin film multilayer wiring materiel according to claim 1, wherein the insulation organic film comprises a polymer having a heat resistance at a pyrolysis beginning temperature of 350°to 550° C., a dielectric constant of 3.5- 2.2, and a flame retardance of V-0 or V-1 according to the UL-94 standard.
Claim 4
Dependent Claim
23 words
A thin film multilayer wiring material according to claim 1, wherein the insulation organic film has a thickness of 1 to 100 μm.
Claim 5
Dependent Claim
35 words
A thin film multilayer wiring material according to claim 1, wherein line thickness and line width of the wiring pattern formed on one surface of the insulation organic film are both 10 to 40 μm.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-01-12 | 2001-07-14 | 2002-01-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-01-12 | 2005-07-14 | 2006-01-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-01-12 | 2009-07-14 | 2010-01-13 | $7700.00 | Window Closed / Lapsed |