Patent US5705435A successfully refreshed from Google Patents.
US5705435A
Expired / Lapsed
US
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Chemical-mechanical polishing (CMP) apparatus
Assignee: Transpacific IP Ltd
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Filing: 1996-08-09
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Granted: 1998-01-06
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Expires: 2016-08-09
Abstract
Abstract An improved and new apparatus and process for chemical-mechanical polishing (CMP) the surface of a semiconductor substrate to a planar condition has beed developed. The planarization endpoint, which is independent of topographic pattern density, is detected by monitoring the ratio of the rate of insulator material removal over a pattern feature to the rate of insulator material removal over an area without an underlying pattern feature.
Inventors
- 👤 Lai-Tuh Chen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 23:31
CPC Classifications
B; B24; B24B; B24B37/00; B24B37/005; B24B37/013; B24B37/04; B24B37/042; B24B49/00; B24B49/12; H; H10; H10P; H10P74/00; H10P74/23; H10P95/00; H10P95/06; H10P95/062
Claims Analysis
Total Claims: 41
Claim 1
Independent Claim
280 words
An apparatus for planarizing semiconductor substrates comprising: a rotatable platen and polishing pad for chemical-mechanical polishing (CMP) an insulating layer deposited over a metallization pattern formed on the surface of a semiconductor substrate; a reservoir for a polishing slurry and means to dispense the slurry onto the polishing pad; a rotatable substrate carrier and means for holding the surface of the semiconductor substrate in juxtaposition relative to said rotatable platen and polishing pad with an applied pressure between the rotatable substrate carrier and the rotatable platen and polishing pad; a means to transfer the semiconductor substrate from the rotatable substrate carrier to an in-line cleaning station comprising a water spray nozzle and an air spray nozzle; a means to transfer the semiconductor substrate from the in-line cleaning station to an in-line optical thickness measurement tool; a means to align the semiconductor substrate in the in-line optical thickness measurement tool; a means to measure the thickness of the insulating layer over said metallization pattern before and after polishing; a means to measure the thickness of the insulating layer over said semiconductor substrate before and after polishing; a means to compute a first polish removal rate of said insulating layer over said metallization pattern; a means to compute a second polish removal rate of said insulating layer over said semiconductor substrate; a means of computing a polish removal rate ratio by dividing said first polish removal rate by said second polish removal rate; and a means to transfer the semiconductor substrate from the in-line optical thickness measurement tool to the rotatable substrate carrier for additional chemical-mechanical polishing (CMP) until said polish removal rate ratio is less than between about 0.9 to 1.1.
Claim 2
Independent Claim
280 words
An apparatus for planarizing semiconductor substrates comprising: a rotatable platen and polishing pad for chemical-mechanical polishing (CMP) an insulating layer deposited over a metallization pattern formed on the surface of a semiconductor substrate; a reservoir for a polishing slurry and means to dispense the slurry onto the polishing pad; a rotatable substrate carrier and means for holding the surface of the semiconductor substrate in juxtaposition relative to said rotatable platen and polishing pad with an applied pressure between the rotatable substrate carrier and the rotatable platen and polishing pad; a means to transfer the semiconductor substrate from the rotatable substrate carrier to an in-line cleaning station comprising a water spray nozzle and an air spray nozzle; a means to transfer the semiconductor substrate from the in-line cleaning station to an in-line optical thickness measurement tool; a means to align the semiconductor substrate in the in-line optical thickness measurement tool; a means to measure the thickness of the insulating layer over said metallization pattern before and after polishing; a means to measure the thickness of the insulating layer over said semiconductor substrate before and after polishing; a means to compute a first polish removal rate of said insulating layer over said metallization pattern; a means to compute a second polish removal rate of said insulating layer over said semiconductor substrate; a means of computing a polish removal rate ratio by dividing said first polish removal rate by said second polish removal rate; and a means to transfer the semiconductor substrate from the in-line optical thickness measurement tool to the rotatable substrate carrier for additional chemical-mechanical polishing (CMP) until said polish removal rate ratio is less than between about 0.9 to 1.1.
Claim 3
Dependent Claim
23 words
The apparatus of claim 1, wherein said rotatable platen and polishing pad are rotated at a speed between about 10 to 100 rpm.
Claim 4
Dependent Claim
21 words
The apparatus of claim 1, wherein said rotatable substrate carrier is rotated at a speed between about 10 to 100 rpm.
Claim 5
Dependent Claim
28 words
The apparatus of claim 1, wherein said applied pressure between the rotatable substrate carrier and the rotatable platen and polishing pad is between about 0.1 to 10 psi.
Claim 6
Dependent Claim
24 words
The apparatus of claim 1, wherein said polishing slurry comprises abrasive particles and a chemical etchant at a pH between about pH=9 to pH=14.
Claim 7
Dependent Claim
24 words
The apparatus of claim 1, wherein said metallization pattern comprises a metal island having length and width dimensions between about 50 to 1,000 μm.
Claim 8
Dependent Claim
18 words
The apparatus of claim 1, wherein said metallization pattern has a thickness between about 3,000 to 8,000 Angstroms.
Claim 9
Dependent Claim
12 words
The apparatus of claim 1, wherein said insulating layer is silicon oxide.
Claim 10
Dependent Claim
23 words
The apparatus of claim 1, wherein the means to measure the thickness of the insulating layer over said metallization pattern is optical interferometry.
Claim 11
Dependent Claim
23 words
The apparatus of claim 1, wherein the means to measure the thickness of the insulating layer over said semiconductor substrate is optical interferometry.
Claim 12
Independent Claim
256 words
A method of chemical-mechanical polishing (CMP) a semiconductor substrate comprising: depositing a first insulating layer on said semiconductor substrate; forming a metallization pattern on said first insulating layer; conformally depositing a second insulating layer over said first insulating layer and said metallization pattern; measuring the thickness of said second insulating layer over said metallization pattern; measuring the combined thicknesses of said second insulating layer and said first insulating layer over said semiconductor substrate; performing chemical-mechanical polishing (CMP) of said second insulating layer; transferring said semiconductor substrate to an in-line cleaning station comprising a water spray nozzle and an air spray nozzle; removing the polishing slurry from the semiconductor substrate with water from said water spray nozzle; drying the semiconductor substrate with air from said air spray nozzle; transferring said semiconductor substrate to an in-line optical thickness measurement tool; aligning said semiconductor substrate in said in-line optical thickness measurement tool; remeasuring, after chemical-mechanical polishing (CMP), the thickness of said second insulating layer over said metallization pattern; remeasuring, after chemical-mechanical polishing (CMP), the combined thicknesses of said second insulating layer and said first insulating layer over said semiconductor substrate; computing a first polish removal rate of said second insulating layer over said metallization pattern; computing a second polish removal rate of said second insulating layer over said semiconductor substrate; computing a polish removal rate ratio by dividing said first polish removal rate by said second polish removal rate; and performing additional chemical-mechanical polishing (CMP) until said polish removal rate ratio is less than between about 0.9 to 1.1.
Claim 13
Independent Claim
256 words
A method of chemical-mechanical polishing (CMP) a semiconductor substrate comprising: depositing a first insulating layer on said semiconductor substrate; forming a metallization pattern on said first insulating layer; conformally depositing a second insulating layer over said first insulating layer and said metallization pattern; measuring the thickness of said second insulating layer over said metallization pattern; measuring the combined thicknesses of said second insulating layer and said first insulating layer over said semiconductor substrate; performing chemical-mechanical polishing (CMP) of said second insulating layer; transferring said semiconductor substrate to an in-line cleaning station comprising a water spray nozzle and an air spray nozzle; removing the polishing slurry from the semiconductor substrate with water from said water spray nozzle; drying the semiconductor substrate with air from said air spray nozzle; transferring said semiconductor substrate to an in-line optical thickness measurement tool; aligning said semiconductor substrate in said in-line optical thickness measurement tool; remeasuring, after chemical-mechanical polishing (CMP), the thickness of said second insulating layer over said metallization pattern; remeasuring, after chemical-mechanical polishing (CMP), the combined thicknesses of said second insulating layer and said first insulating layer over said semiconductor substrate; computing a first polish removal rate of said second insulating layer over said metallization pattern; computing a second polish removal rate of said second insulating layer over said semiconductor substrate; computing a polish removal rate ratio by dividing said first polish removal rate by said second polish removal rate; and performing additional chemical-mechanical polishing (CMP) until said polish removal rate ratio is less than between about 0.9 to 1.1.
Claim 14
Dependent Claim
13 words
The method of claim 11, wherein said first insulating layer is silicon oxide.
Claim 15
Dependent Claim
35 words
The method of claim 12, wherein said silicon oxide is deposited using CVD (Chemical Vapor Deposition) processing, at a temperature between about 200° to 450° C., to a thickness between about 2,000 to 20,000 Angstroms.
Claim 16
Dependent Claim
24 words
The method of claim 11, wherein said metallization pattern comprises a metal island having length and width dimension between about 50 to 1,000 μm.
Claim 17
Dependent Claim
18 words
The method of claim 14, wherein said metal island has a thickness between about 3,000 to 8,000 Angstroms.
Claim 18
Dependent Claim
11 words
The method of claim 14, wherein said metal island is aluminum.
Claim 19
Dependent Claim
11 words
The method of claim 14, wherein said metal island is aluminum-copper-silicon.
Claim 20
Dependent Claim
13 words
The method of claim 11, wherein said second insulating layer is silicon oxide.
Claim 21
Dependent Claim
35 words
The method of claim 18, wherein said silicon oxide is deposited using CVD (Chemical Vapor Deposition) processing, at a temperature between about 200° to 450° C., to a thickness between about 2,000 to 20,000 Angstroms.
Claim 22
Dependent Claim
23 words
The method of claim 11, wherein measuring the thickness of said second insulating layer over said metallization pattern is done by optical interferometry.
Claim 23
Dependent Claim
29 words
The method of claim 11, wherein measuring the combined thicknesses of said second insulating layer and said first insulating layer over said semiconductor substrate is done by optical interferometry.
Claim 24
Dependent Claim
35 words
The method of claim 11, wherein said chemical-mechanical polishing of said second insulating layer is performed using a polishing slurry containing abrasive particles and a chemical etchant, at a pH between about pH=9 to pH=14.
Claim 25
Dependent Claim
26 words
The method of claim 11, wherein remeasuring, after chemical-mechanical polishing, the thickness of said second insulating layer over said metallization pattern is done by optical interferometry.
Claim 26
Dependent Claim
32 words
The method of claim 11, wherein remeasuring, after chemical-mechanical polishing, the combined thicknesses of said second insulating layer and said first insulating layer over said semiconductor substrate is done by optical interferometry.
Claim 27
Independent Claim
256 words
A method of chemical-mechanical polishing (CMP) a semiconductor substrate comprising: depositing a first insulating layer on said semiconductor substrate; forming a metallization pattern on said first insulating layer; conformally depositing a second insulating layer over said first insulating layer and said metallization pattern; measuring the thickness of said second insulating layer over said metallization pattern; measuring the combined thicknesses of said second insulating layer and said first insulating layer over said semiconductor substrate; performing chemical-mechanical polishing (CMP) of said second insulating layer; transferring said semiconductor substrate to an in-line cleaning station comprising a water spray nozzle and an air spray nozzle; removing the polishing slurry from the semiconductor substrate with water from said water spray nozzle; drying the semiconductor substrate with air from said air spray nozzle; transferring said semiconductor substrate to an in-line optical thickness measurement tool; aligning said semiconductor substrate in said in-line optical thickness measurement tool; remeasuring, after chemical-mechanical polishing (CMP), the thickness of said second insulating layer over said metallization pattern; remeasuring, after chemical-mechanical polishing (CMP), the combined thicknesses of said second insulating layer and said first insulating layer over said semiconductor substrate; computing a first polish removal rate of said second insulating layer over said metallization pattern; computing a second polish removal rate of said second insulating layer over said semiconductor substrate; computing a polish removal rate ratio by dividing said second polish removal rate by said first polish removal rate; and performing additional chemical-mechanical polishing (CMP) until said polish removal rate ratio is greater than between about 0.9 to 1.1.
Claim 28
Independent Claim
256 words
A method of chemical-mechanical polishing (CMP) a semiconductor substrate comprising: depositing a first insulating layer on said semiconductor substrate; forming a metallization pattern on said first insulating layer; conformally depositing a second insulating layer over said first insulating layer and said metallization pattern; measuring the thickness of said second insulating layer over said metallization pattern; measuring the combined thicknesses of said second insulating layer and said first insulating layer over said semiconductor substrate; performing chemical-mechanical polishing (CMP) of said second insulating layer; transferring said semiconductor substrate to an in-line cleaning station comprising a water spray nozzle and an air spray nozzle; removing the polishing slurry from the semiconductor substrate with water from said water spray nozzle; drying the semiconductor substrate with air from said air spray nozzle; transferring said semiconductor substrate to an in-line optical thickness measurement tool; aligning said semiconductor substrate in said in-line optical thickness measurement tool; remeasuring, after chemical-mechanical polishing (CMP), the thickness of said second insulating layer over said metallization pattern; remeasuring, after chemical-mechanical polishing (CMP), the combined thicknesses of said second insulating layer and said first insulating layer over said semiconductor substrate; computing a first polish removal rate of said second insulating layer over said metallization pattern; computing a second polish removal rate of said second insulating layer over said semiconductor substrate; computing a polish removal rate ratio by dividing said second polish removal rate by said first polish removal rate; and performing additional chemical-mechanical polishing (CMP) until said polish removal rate ratio is greater than between about 0.9 to 1.1.
Claim 29
Dependent Claim
13 words
The method of claim 25, wherein said first insulating layer is silicon oxide.
Claim 30
Dependent Claim
35 words
The method of claim 25, wherein said silicon oxide is deposited using CVD (Chemical Vapor Deposition) processing, at a temperature between about 200° to 450° C., to a thickness between about 2,000 to 20,000 Angstroms.
Claim 31
Dependent Claim
24 words
The method of claim 25, wherein said metallization pattern comprises a metal island having length and width dimension between about 50 to 1,000 μm.
Claim 32
Dependent Claim
18 words
The method of claim 28, wherein said metal island has a thickness between about 3,000 to 8,000 Angstroms.
Claim 33
Dependent Claim
11 words
The method of claim 28, wherein said metal island is aluminum.
Claim 34
Dependent Claim
11 words
The method of claim 28, wherein said metal island is aluminum-copper-silicon.
Claim 35
Dependent Claim
13 words
The method of claim 25, wherein said second insulating layer is silicon oxide.
Claim 36
Dependent Claim
35 words
The method of claim 32, wherein said silicon oxide is deposited using CVD (Chemical Vapor Deposition) processing, at a temperature between about 200° to 450° C., to a thickness between about 2,000 to 20,000 Angstroms.
Claim 37
Dependent Claim
23 words
The method of claim 25, wherein measuring the thickness of said second insulating layer over said metallization pattern is done by optical interferometry.
Claim 38
Dependent Claim
29 words
The method of claim 25, wherein measuring the combined thicknesses of said second insulating layer and said first insulating layer over said semiconductor substrate is done by optical interferometry.
Claim 39
Dependent Claim
35 words
The method of claim 25, wherein said chemical-mechanical polishing of said second insulating layer is performed using a polishing slurry containing abrasive particles and a chemical etchant, at a pH between about pH=9 to pH=14.
Claim 40
Dependent Claim
26 words
The method of claim 25, wherein remeasuring, after chemical-mechanical polishing, the thickness of said second insulating layer over said metallization pattern is done by optical interferometry.
Claim 41
Dependent Claim
32 words
The method of claim 25, wherein remeasuring, after chemical-mechanical polishing, the combined thicknesses of said second insulating layer and said first insulating layer over said semiconductor substrate is done by optical interferometry.
References Cited (Backward Citations)
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