Distributed microwave plasma reactor for semiconductor processing

Claim 2

A plasma reactor, comprising: a vacuum chamber and a wafer supporter for holding a semiconductor wafer in said chamber; a reactant gas source for furnishing at least a reactant gas; a radiation applicator outside said chamber; and plural gas flow channels outside of said chamber, each having a hollow interior and plural respective individually adjustable valves, said channels extending from said reactant gas source and through a ceiling of said chamber, a portion of each one of said channels extending through said radiation applicator for irradiation of an interior of each of said channels whereby to generate a plasma therein which can be transported through said channels toward said chamber, said reactant gas source establishing gas flow rates in respective ones of said gas flow channels in accordance with adjustments of respective ones of said valves whereby said reactant gas flows through each of said channels toward said chamber.

Claim 3

The reactor of claim 1 wherein said wafer supporter comprises a wafer pedestal near a floor of said chamber and wherein said channels extend through said ceiling of said chamber and toward a top surface of said wafer.

Claim 4

The reactor of claim 2 further comprising a bias RF power source coupled to said wafer pedestal for controlling ion energy near said wafer.

Claim 5

The reactor of claim 1 wherein each of said channels comprises a channel formed of a dielectric material of the type including quartz or sapphire.

Claim 6

The reactor of claim 1 wherein said gas source comprises: a valve apparatus for individually supplying gas to respective ones of said channels at respective individual gas flow rates.

Claim 7

The reactor of claim 5 wherein said valve apparatus for individually supplying gas to respective ones of said channels comprises plural mass flow controllers, each one of said mass flow controllers having a gas input connected to a common supply, a gas output connected to a respective one of said channels and an electrical control input for setting a gas flow rate between said input and output in accordance with an electrical signal applied to said control line.

Claim 8

The apparatus of claim 6 further comprising an array controller connected to each said control line for simultaneously controlling individual gas flow rates through each of said channels.

Claim 9

The apparatus of claim 6 further comprising a means for establishing a gas pressure within said chamber.

Claim 10

The reactor of claim 1 wherein said plural gas flow channels comprise at least five individual channels.

Claim 11

The reactor of claim 1 wherein said plural gas flow channels comprise at least nine individual channels.

Claim 12

The reactor of claim 1 wherein said plural gas flow channels comprise channels each with a diameter of less than one-fifth of diameter of said chamber.

Claim 13

The reactor of claim 1 wherein said radiation applicator comprises a waveguide through which said portion of respective ones of said channels extend.

Claim 14

The reactor of claim 12 wherein said waveguide comprises a fan-shaped main portion through which said channels extend and a neck coupled to an apex of said fan-shaped main portion, and wherein said means for irradiating further comprises a source of electromagnetic radiation coupled to said neck.

Claim 15

The reactor of claim 13 wherein said source of electromagnetic radiation comprises a microwave generator, and wherein said waveguide comprises a microwave guide.

Claim 16

The reactor of claim 1 wherein said radiation applicator comprises an inductive applicator.

Claim 17

The reactor of claim 15 wherein said inductive applicator comprises an inductor coil surrounding said plural gas flow channels.

Claim 18

The reactor of claim 1 wherein said radiation applicator comprises inductor coils surrounding respective ones of said plural gas flow channels.

Claim 19

The reactor of claim 1 wherein said radiation applicator comprises a capacitive applicator.

Claim 20

The reactor of claim 18 wherein said capacitive applicator comprises a pair of capacitor plates sandwiching said plural gas flow channels.

Claim 21

The reactor of claim 1 wherein said radiation applicator comprises capacitor plates radially sandwiching respective ones of said plural gas flow channels.

Claim 22

A plasma reactor, comprising: a vacuum chamber and a wafer supporter for holding a semiconductor wafer in said chamber; a reactant gas source for furnishing at least a reactant gas; plural gas flow channels extending from said reactant gas source and through a ceiling of said chamber, said reactant gas source establishing gas flow rates in respective ones of said plural gas flow channels whereby said reactant gas flows through each of said channels toward said chamber, each of said plural gas flow channels having an intermediate portion lying between said reactant gas source and said chamber; a radiation applicator for irradiating an interior of said intermediate portion of respective ones of said channels whereby to provide a plasma therein, the gas flow rates in said channels being sufficient to transport the plasma in each channel into said chamber; said radiation applicator comprises a waveguide; said waveguide comprises a fan-shaped main portion through which said channels extend and a neck coupled to an apex of said fan-shaped main portion, and wherein said radiation applicator further comprises a source of electromagnetic radiation coupled to said neck; and said source of electromagnetic radiation comprises a microwave generator, and wherein said waveguide comprises a microwave guide.

Claim 23

A plasma reactor, comprising: a vacuum chamber and a wafer supporter for holding a semiconductor wafer in said chamber; a reactant gas source for furnishing at least a reactant gas; plural gas flow channels extending from said reactant gas source and through a ceiling of said chamber, said reactant gas source establishing gas flow rates in respective ones of said plural gas flow channels whereby said reactant gas flows through each of said channels toward said chamber, each of said plural gas flow channels having an intermediate portion lying between said reactant gas source and said chamber; a radiation applicator for irradiating an interior of said intermediate portion of respective ones of said channels whereby to provide a plasma therein, the gas flow rates in said channels being sufficient to transport the plasma in each channel into said chamber; said radiation applicator comprises a waveguide; said waveguide comprises a fan-shaped main portion through which said channels extend and a neck coupled to an apex of said fan-shaped main portion, and wherein said radiation applicator further comprises a source of electromagnetic radiation coupled to said neck; and said source of electromagnetic radiation comprises a microwave generator, and wherein said waveguide comprises a microwave guide.

Claim 24

The reactor of claim 21 wherein said plural gas flow channels comprise at least five individual channels.

Claim 25

The reactor of claim 21 wherein said plural gas flow channels comprise at least nine individual channels.

Claim 26

The reactor of claim 21 wherein said plural gas flow channels comprise channels each with a diameter of less than one-fifth of diameter of said chamber.

Claim 27

In a plasma reactor for processing a semiconductor wafer inside a vacuum chamber, a method for providing uniform gas flow rates across a wafer surface, said method comprising: providing an array of gas distribution channels outside of said chamber, each of said channels having a hollow interior and plural respective individually adjustable valves, said channels extending through a ceiling of said chamber such that said channels are facing said wafer; providing a gas flow supply; supplying gas to respective ones of said gas distribution channels from said gas flow supply at respective individual gas flow rates; and irradiating portions of each of said channels outside of said chamber with sufficient radiation to ionize gases within said channels, whereby to furnish plasma from said channels to said chamber.

Claim 28

In a plasma reactor for processing a semiconductor wafer inside a vacuum chamber, a method for providing uniform gas flow rates across a wafer surface, said method comprising: providing an array of gas distribution channels outside of said chamber, each of said channels having a hollow interior and plural respective individually adjustable valves, said channels extending through a ceiling of said chamber such that said channels are facing said wafer; providing a gas flow supply; supplying gas to respective ones of said gas distribution channels from said gas flow supply at respective individual gas flow rates; and irradiating portions of each of said channels outside of said chamber with sufficient radiation to ionize gases within said channels, whereby to furnish plasma from said channels to said chamber.

Claim 29

The method of claim 25 further comprising simultaneously controlling individual gas flow rates through each of said channels to achieve an optimization of gas flow uniformity across the surface of said wafer.

Claim 30

The method of claim 26 further comprising establishing a gas pressure within said chamber.

Claim 31

A plasma reactor, comprising: a vacuum chamber and a wafer supporter for holding a semiconductor wafer in said chamber; a reactant gas source for furnishing at least a reactant gas; a radiation apparatus outside said chamber; and plural gas flow channels outside of said chamber, each having a hollow interior and plural respective individually adjustable valves, said channels extending from said reactant gas source and through a ceiling of said chamber, a portion of each one of said channels extending through said radiation apparatus for irradiation of an interior of each of said channels whereby to generate plasma therein which can be transported through said channels toward said chamber.

Claim 32

A plasma reactor, comprising: a vacuum chamber and a wafer supporter for holding a semiconductor wafer in said chamber; a reactant gas source for furnishing at least a reactant gas; a radiation apparatus outside said chamber; and plural gas flow channels outside of said chamber, each having a hollow interior and plural respective individually adjustable valves, said channels extending from said reactant gas source and through a ceiling of said chamber, a portion of each one of said channels extending through said radiation apparatus for irradiation of an interior of each of said channels whereby to generate plasma therein which can be transported through said channels toward said chamber.

Claim 33

The reactor of claim 28 wherein said wafer supporter comprises a wafer pedestal near a floor of said chamber and wherein said channels extend through said ceiling of said chamber and toward a top surface of said wafer.

Claim 34

The reactor of claim 28 wherein each of said channels comprises a channel formed of a dielectric material of the type including quartz or sapphire.

Claim 35

The reactor of claim 28 wherein said gas source comprises: an apparatus for individually supplying gas to respective ones of said plural gas flow channels at respective individual gas flow rates.

Claim 36

The reactor of claim 28 wherein said plural gas flow channels comprise at least five individual channels.

Claim 37

The reactor of claim 28 wherein said plural gas flow channels comprise at least nine individual channels.

Claim 38

The reactor of claim 28 wherein said plural gas flow channels comprise channels each with a diameter of less than one-fifth of diameter of said chamber.

Claim 39

The reactor of claim 28 wherein said radiation apparatus comprises a waveguide through which said portion of respective ones of said channels extend.

Claim 40

The reactor of claim 35 wherein said waveguide comprises a fan-shaped main portion through which said channels extend and a neck coupled to an apex of said fan-shaped main portion, and wherein said means for irradiating further comprises a source of electromagnetic radiation coupled to said neck.

Claim 41

The reactor of claim 36 wherein said source of electromagnetic radiation comprises a microwave generator, and wherein said waveguide comprises a microwave guide.

Claim 42

The reactor of claim 28 wherein said radiation apparatus comprises an inductive applicator.

Claim 43

The reactor of claim 38 wherein said inductive applicator comprises an inductor coil surrounding said plural gas flow channels.

Claim 44

The reactor of claim 28 wherein said radiation apparatus comprises inductor coils surrounding respective ones of said plural gas flow channels.

Claim 45

The reactor of claim 28 wherein said radiation apparatus comprises a capacitive applicator.

Claim 46

The reactor of claim 41 wherein said capacitive applicator comprises a pair of capacitor plates sandwiching said plural gas flow channels.

Claim 47

The reactor of claim 28 wherein said radiation apparatus comprises capacitor plates radially sandwiching respective ones of said plural gas flow channels.

Claim 48

A plasma reactor, comprising: a vacuum chamber and a wafer supporter for holding a semiconductor wafer in said chamber; a reactant gas source for furnishing at least a reactant gas; plural gas flow channels extending from said reactant gas source and through a ceiling of said chamber, each of said plural gas flow channels having an intermediate portion lying between said reactant gas source and said chamber; a radiation apparatus for irradiating an interior of said intermediate portion of each of said channels whereby to provide a plasma therein, the gas flow rates in said channels being sufficient to transport the plasma in each of said channels into said chamber; said radiation apparatus comprises a waveguide; said waveguide comprises a fan-shaped main portion through which said channels extend and a neck coupled to an apex of said fan-shaped main portion, and wherein said radiation apparatus further comprises a source of electromagnetic radiation coupled to said neck; and said source of electromagnetic radiation comprises a microwave generator, and wherein said waveguide comprises a microwave guide.

Claim 49

A plasma reactor, comprising: a vacuum chamber and a wafer supporter for holding a semiconductor wafer in said chamber; a reactant gas source for furnishing at least a reactant gas; plural gas flow channels extending from said reactant gas source and through a ceiling of said chamber, each of said plural gas flow channels having an intermediate portion lying between said reactant gas source and said chamber; a radiation apparatus for irradiating an interior of said intermediate portion of each of said channels whereby to provide a plasma therein, the gas flow rates in said channels being sufficient to transport the plasma in each of said channels into said chamber; said radiation apparatus comprises a waveguide; said waveguide comprises a fan-shaped main portion through which said channels extend and a neck coupled to an apex of said fan-shaped main portion, and wherein said radiation apparatus further comprises a source of electromagnetic radiation coupled to said neck; and said source of electromagnetic radiation comprises a microwave generator, and wherein said waveguide comprises a microwave guide.

Claim 50

The reactor of claim 44 wherein said plural gas flow channels comprise at least five individual channels.

Claim 51

The reactor of claim 44 wherein said plural gas flow channels comprise at least nine individual channels.

Claim 52

The reactor of claim 44 wherein said plural gas flow channels comprise channels each with a diameter of less than one-fifth of diameter of said chamber.

Claim 53

A plasma reactor, including a reactor chamber for processing a substrate therewithin in a subatmospheric gaseous environment, said plasma reactor being adapted to accept an external supply of gas, and an external supply of electromagnetic radiation, said plasma reactor comprising: a workpiece support; a plurality of gas flow channels outside of said chamber, each having a hollow interior and plural respective individually adjustable valves, said channels extending through the ceiling of said reactor chamber and terminating in respective orifices directing gas towards said workpiece support within said chamber, each of said plural gas flow channels adapted to communicate with a supply of gas outside of said plasma reactor; and an electromagnetic radiation applicator outside said chamber through which each of said plural gas flow channels extend and transmitting electromagnetic radiation from an external source of electromagnetic radiation to locations within each of said plural gas flow channels; whereby gas flowing through each of said plural gas flow channels is ignited into a plasma, said plasma being transported into said chamber and directed toward said workpiece support.

Claim 54

A plasma reactor, including a reactor chamber for processing a substrate therewithin in a subatmospheric gaseous environment, said plasma reactor being adapted to accept an external supply of gas, and an external supply of electromagnetic radiation, said plasma reactor comprising: a workpiece support; a plurality of gas flow channels outside of said chamber, each having a hollow interior and plural respective individually adjustable valves, said channels extending through the ceiling of said reactor chamber and terminating in respective orifices directing gas towards said workpiece support within said chamber, each of said plural gas flow channels adapted to communicate with a supply of gas outside of said plasma reactor; and an electromagnetic radiation applicator outside said chamber through which each of said plural gas flow channels extend and transmitting electromagnetic radiation from an external source of electromagnetic radiation to locations within each of said plural gas flow channels; whereby gas flowing through each of said plural gas flow channels is ignited into a plasma, said plasma being transported into said chamber and directed toward said workpiece support.

Claim 55

A plasma reactor as in claim 48, wherein said workpiece support is adapted to accept RF power from an external source of RF power, so that said workpiece support may be biased for control of plasma ion energy.

Claim 56

A plasma reactor as in claim 48 wherein each of said channels comprises a channel formed of a dielectric material.

Claim 57

A plasma reactor as in claim 48, wherein said plural valves comprises mass flow controllers at inputs of said channels, whereby a gas flow can be controlled and plasma characteristics can be varied over an area of said workpiece support.

Claim 58

A plasma reactor as in claim 48, which further includes a plurality of gas flow controllers, one for each respective particular desired source gas, and having a common output supplying the inputs of said channels, such that the gas composition of the plasma may be controlled.

Claim 59

A plasma reactor as in claim 48 wherein said plural gas flow channels comprise at least five individual channels.

Claim 60

A plasma reactor as in claim 48 wherein said plural gas flow channels comprise at least nine individual channels.

Claim 61

A plasma reactor as in claim 48 wherein said plural gas flow channels comprise channels each with a diameter of less than one-fifth of diameter of said chamber.

Claim 62

A plasma reactor as in claim 48 wherein said electromagnetic radiation applicator comprises a waveguide through which said plural gas flow channels extend.

Claim 63

A plasma reactor as in claim 56 wherein said waveguide comprises a fan-shaped main portion through which said channels extend and a neck coupled to an apex of said fan-shaped main portion, and wherein said electromagnetic radiation applicator further comprises a source of electromagnetic radiation coupled to said neck.

Claim 64

A plasma reactor as in claim 57 wherein said source of electromagnetic radiation comprises a microwave generator, and wherein said waveguide comprises a microwave guide.

Claim 65

A plasma reactor as in claim 48 wherein said electromagnetic radiation applicator comprises an inductive applicator.

Claim 66

A plasma reactor as in claim 59 wherein said inductive applicator comprises an inductor coil surrounding said plural gas flow channels.

Claim 67

A plasma reactor as in claim 48 wherein said electromagnetic radiation applicator comprises inductor coils surrounding respective ones of said plural gas flow channels.

Claim 68

A plasma reactor as in claim 48 wherein said electromagnetic radiation applicator comprises a capacitive applicator.

Claim 69

A plasma reactor as in claim 62 wherein said capacitive applicator comprises a pair of capacitor plates sandwiching said plural gas flow channels.

Claim 70

A plasma reactor as in claim 48 wherein said electromagnetic radiation applicator comprises capacitor plates radially sandwiching respective ones of said plural gas flow channels.