Patent US5699227A successfully refreshed from Google Patents.
US5699227A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Heat pipe to baseplate attachment method
Assignee: Intel Corp
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Filing: 1996-06-28
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Granted: 1997-12-16
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Expires: 2016-06-28
Abstract
Abstract An integrated circuit package which has a heat pipe that is incorporated into the body of the package. The package contains an integrated circuit which is mounted to a package substrate. The integrated circuit die is enclosed by a cover plate that is attached to the substrate. The heat pipe is attached to a nut that is screwed into the cover plate. The heat pipe has a bottom surface that is thermally coupled to the die to provide a direct thermal path between the integrated circuit and the heat pipe.
Inventors
- 👤 Frank Kolman
- 👤 Michael Brownell
- 👤 Hong Xie
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:15
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/774; H10W40/73; H10W72/00; H10W72/851; H10W72/874; H10W72/877; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/4935; Y10T29/49353
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
48 words
An integrated circuit package, comprising: a substrate; an integrated circuit mounted to said substrate; a cover plate that encloses said integrated circuit; a nut that is attached to said cover plate; and, a heat pipe that is attached to said nut and thermally coupled to said integrated circuit.
Claim 2
Dependent Claim
48 words
An integrated circuit package, comprising: a substrate; an integrated circuit mounted to said substrate; a cover plate that encloses said integrated circuit; a nut that is attached to said cover plate; and, a heat pipe that is attached to said nut and thermally coupled to said integrated circuit.
Claim 3
Dependent Claim
23 words
The package as recited in claim 1, further comprising a layer of thermal grease located between said heat pipe and said integrated circuit.
Claim 4
Dependent Claim
24 words
The package as recited in claim 1, wherein said nut has a thread that is screwed into a corresponding thread of said cover plate.
Claim 5
Dependent Claim
16 words
The package as recited in claim 1, wherein said heat pipe is bonded to said nut.
Claim 6
Dependent Claim
16 words
The package as recited in claim 1, wherein said heat pipe is brazed to said nut.
Claim 7
Dependent Claim
20 words
The package as recited in claim 1, wherein said heat pipe extends below a lower surface of said cover plate.
Claim 8
Dependent Claim
59 words
A printed circuit board assembly, comprising: a printed circuit board; a substrate mounted to said printed circuit board; an integrated circuit mounted to said substrate; a cover plate that encloses said integrated circuit; a nut that is attached to said cover plate; and, a heat pipe that is attached to said nut and thermally coupled to said integrated circuit.
Claim 9
Dependent Claim
59 words
A printed circuit board assembly, comprising: a printed circuit board; a substrate mounted to said printed circuit board; an integrated circuit mounted to said substrate; a cover plate that encloses said integrated circuit; a nut that is attached to said cover plate; and, a heat pipe that is attached to said nut and thermally coupled to said integrated circuit.
Claim 10
Dependent Claim
22 words
The assembly as recited in claim 7, further comprising a layer of thermal grease located between said nut and said integrated circuit.
Claim 11
Dependent Claim
24 words
The assembly as recited in claim 7, wherein said nut has a thread that is screwed into a corresponding thread of said cover plate.
Claim 12
Dependent Claim
16 words
The assembly as recited in claim 7, wherein said heat pipe is bonded to said nut.
Claim 13
Dependent Claim
16 words
The assembly as recited in claim 7, wherein said heat pipe is brazed to said nut.
Claim 14
Dependent Claim
20 words
The assembly as recited in claim 7, wherein said heat pipe extends below a lower surface of said cover plate.
Claim 15
Independent Claim
57 words
A method for assembling an integrated circuit package, comprising the steps of: a) mounting an integrated circuit to a substrate; b) attaching a heat pipe to a nut; c) screwing said nut into a cover plate; and, d) attaching said cover plate to said substrate so that said heat pipe is thermally coupled to said integrated circuit.
Claim 16
Independent Claim
57 words
A method for assembling an integrated circuit package, comprising the steps of: a) mounting an integrated circuit to a substrate; b) attaching a heat pipe to a nut; c) screwing said nut into a cover plate; and, d) attaching said cover plate to said substrate so that said heat pipe is thermally coupled to said integrated circuit.
Claim 17
Dependent Claim
31 words
The method as recited in claim 13, further comprising the step of applying a layer of thermal grease to said integrated circuit before said cover plate is attached to said substrate.
Claim 18
Dependent Claim
26 words
The method as recited in claim 13, wherein said nut is screwed into said cover plate after said cover plate is attached to said base plate.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-12-15 | 2001-06-16 | 2001-12-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-12-15 | 2005-06-16 | 2005-12-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-12-15 | 2009-06-16 | 2009-12-16 | $7700.00 | Window Closed / Lapsed |