Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
42 words
A semiconductor device comprising interlayer insulative layers composed of amorphous carbon film including fluorine (F), wherein a content of said fluorine has a distribution in a depthwise direction of said amorphous carbon film such that said fluorine decreases in said depthwise direction.
Claim 2
Dependent Claim
42 words
A semiconductor device comprising interlayer insulative layers composed of amorphous carbon film including fluorine (F), wherein a content of said fluorine has a distribution in a depthwise direction of said amorphous carbon film such that said fluorine decreases in said depthwise direction.
Claim 3
Dependent Claim
38 words
The semiconductor device as recited in claim 1, wherein said distribution is designed so that no fluorine (F) is present at an interface between said amorphous carbon film and an underlying layer disposed below said amorphous carbon film.
Claim 4
Dependent Claim
17 words
The semiconductor device as recited in claim 1, wherein said amorphous carbon film further includes silicon (Si).
Claim 5
Dependent Claim
46 words
The semiconductor device as recited in claim 1, further including a buffer layer for suppressing gas discharge out of said amorphous carbon film, said buffer layer being disposed between said amorphous carbon film and elements of said semiconductor device disposed adjacent to said amorphous carbon film.
Claim 6
Dependent Claim
24 words
The semiconductor device as retired in claim 4, wherein said elements of said semiconductor device includes an electrode, a wiring and a transistor section.
Claim 7
Dependent Claim
45 words
The semiconductor device recited in claim 4 further including a transition layer interposed between said amorphous carbon film and said buffer layer, said transition layer having a composition gradually varying from a composition of said amorphous carbon film to a composition of said buffer layer.
Claim 8
Dependent Claim
22 words
The semiconductor device recited in claim 4, wherein said buffer layer has a smaller thickness than that of said amorphous carbon film.
Claim 9
Dependent Claim
34 words
The semiconductor device recited in claim 4, wherein said buffer layer has a thickness determined in accordance with a temperature of a heat treatment to be carried out in fabrication of said semiconductor device.
Claim 10
Dependent Claim
37 words
The semiconductor device recited in claim 4, wherein said buffer layer is composed of one of SiO 2 , Si 3 N 4 , amorphous carbon film including silicon therein, and amorphous carbon film including nitrogen therein.
Claim 11
Dependent Claim
21 words
A semiconductor device in which interlayer insulative layers are composed of amorphous carbon film which includes fluorine (F) and nitrogen (N).
Claim 12
Dependent Claim
21 words
A semiconductor device in which interlayer insulative layers are composed of amorphous carbon film which includes fluorine (F) and nitrogen (N).
Claim 13
Dependent Claim
86 words
A semiconductor device comprising: an interlayer insulative layer composed of amorphous carbon film; a buffer layer for suppressing gas discharge out of said amorphous carbon film, said buffer layer being disposed between said amorphous carbon film and elements of said semiconductor device disposed adjacent to said amorphous carbon film; and a transition layer interposed between said amorphous carbon film and said buffer layer, said transition layer having a composition gradually varying from a composition of said amorphous carbon film to a composition of said buffer layer.
Claim 14
Dependent Claim
86 words
A semiconductor device comprising: an interlayer insulative layer composed of amorphous carbon film; a buffer layer for suppressing gas discharge out of said amorphous carbon film, said buffer layer being disposed between said amorphous carbon film and elements of said semiconductor device disposed adjacent to said amorphous carbon film; and a transition layer interposed between said amorphous carbon film and said buffer layer, said transition layer having a composition gradually varying from a composition of said amorphous carbon film to a composition of said buffer layer.
Claim 15
Dependent Claim
23 words
The semiconductor device recited in claim 11, wherein said elements of said semiconductor device includes an electrode, a wiring and a transistor section.