US5698160A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Lead-free alloys for use in solder bonding
Assignee: Nokia of America Corp
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Filing: 1996-08-29
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Granted: 1997-12-16
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Expires: 2016-08-29
Abstract
Abstract According to the present invention, an article of manufacture is provided having at least one region which includes a lead-free solder composition. The lead-free solder composition comprises an alloy of at least 50 wt. % tin and 7-30 wt. % zinc. An effective amount of silver is added to increase the ductility of the resultant alloy at least 25% over the ductility of the binary eutectic tin-zinc alloy. In a further embodiment, the present invention provides alloys useful in articles comprising lead-free solder compositions. The alloys include at least (8.0+y) wt. % zinc, 0.25 y to 0.5 y wt. % silver and at least 50 wt. % tin where y is from 0.2 to 22.
Inventors
- 👤 Ho Sou Chen
- 👤 Sungho Jin
- 👤 Mark Thomas McCormack
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 15:07
CPC Classifications
C; C22; C22C; C22C13/00; B; B23; B23K; B23K35/00; B23K35/22; B23K35/24; B23K35/26; B23K35/262
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
33 words
An article of manufacture having at least one region which includes a lead-free solder composition comprising an alloy consisting of: 59-82 wt. % tin; 16-30 wt. % zinc; and 2-11 wt. % silver.
Claim 2
Dependent Claim
33 words
An article of manufacture having at least one region which includes a lead-free solder composition comprising an alloy consisting of: 59-82 wt. % tin; 16-30 wt. % zinc; and 2-11 wt. % silver.
Claim 3
Dependent Claim
54 words
An article of manufacture having at least one region which includes a lead-free solder composition comprising an alloy consisting of: at least 85 wt. % tin; 7-13 wt. % zinc; and silver in an amount effective to maintain the melting temperature of the resultant alloy within the range of 189.5° C. to 209.5° C.
Claim 4
Dependent Claim
54 words
An article of manufacture having at least one region which includes a lead-free solder composition comprising an alloy consisting of: at least 85 wt. % tin; 7-13 wt. % zinc; and silver in an amount effective to maintain the melting temperature of the resultant alloy within the range of 189.5° C. to 209.5° C.
Claim 5
Dependent Claim
33 words
An article of manufacture according to claim 2 wherein silver is in an amount effective to maintain the melting temperature of the resultant alloy within the range of 194.5° C. to 204.5° C.
Claim 6
Dependent Claim
55 words
An article of manufacture having at least one region which includes a lead-free solder composition comprising and alloy consisting of: at least 85 wt. % tin; 7-13 wt. % zinc; and silver in an amount effective to decrease the ultimate tensile strength of the resultant alloy at least 25% over the binary eutectic tin-zinc alloy.
Claim 7
Dependent Claim
55 words
An article of manufacture having at least one region which includes a lead-free solder composition comprising and alloy consisting of: at least 85 wt. % tin; 7-13 wt. % zinc; and silver in an amount effective to decrease the ultimate tensile strength of the resultant alloy at least 25% over the binary eutectic tin-zinc alloy.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-12-15 | 2001-06-16 | 2001-12-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-12-15 | 2005-06-16 | 2005-12-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-12-15 | 2009-06-16 | 2009-12-16 | $7700.00 | Window Closed / Lapsed |