US5346775A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Article comprising solder with improved mechanical properties
Assignee: AT&T Labs Inc
•
Filing: 1993-02-22
•
Granted: 1994-09-13
•
Expires: 2013-02-22
Abstract
Abstract New solder compositions which can have improved mechanical properties are disclosed. In a preferred embodiment, the solder comprises a matrix material and magnetically dispersed particles. A desirable dispersion of the magnetic particles in the matrix material, is accomplished by applying a magnetic field to the molten matrix material containing magnetic particles and solidifying it in the presence of the magnetic field. The particle-dispersed microstructures improve the mechanical properties of the solder composition. The improved solder composition can be made into a powder to be used in solder paste, cream or reshaped while substantially retaining the improved mechanical properties.
Inventors
- 👤 Sungho Jin
- 👤 Mark T. McCormack
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 00:30
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/24; B23K35/26; B23K1/00; B23K35/02; B23K35/0222; B23K35/0244; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3485; B23K35/262; B23K35/264; B23K35/268; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0215; H05K2201/08; H05K2201/083; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10719; H05K2203/00; H05K2203/10; H05K2203/104; H10; H10W; H10W72/00; H10W72/20; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12007; Y10T428/12486
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
80 words
An article comprising a solder composition comprising a solder matrix material and magnetic particles, wherein said particles have a magnetic field-induced substantially ordered distribution either in a columnar pattern oriented substantially in the direction of a magnetic field which was or is applied to said solder composition or in a three dimensional chain network in at least a portion of the solder matrix material and said particles represent a volume fraction of said solder composition in the range of 0.5-10%.
Claim 2
Dependent Claim
80 words
An article comprising a solder composition comprising a solder matrix material and magnetic particles, wherein said particles have a magnetic field-induced substantially ordered distribution either in a columnar pattern oriented substantially in the direction of a magnetic field which was or is applied to said solder composition or in a three dimensional chain network in at least a portion of the solder matrix material and said particles represent a volume fraction of said solder composition in the range of 0.5-10%.
Claim 3
Dependent Claim
14 words
An article according to claim 1, wherein said particles form a substantially columnar pattern.
Claim 4
Dependent Claim
15 words
An article according to claim 1, wherein said particles form a substantially three-dimensional chain network.
Claim 5
Dependent Claim
27 words
An article according to claim 1, wherein said solder matrix material comprises a metal selected from the group consisting of Sn, Bi, Sb, Zn, In and Pb.
Claim 6
Dependent Claim
37 words
An article according to claim 1, wherein said particles comprise material selected either from ferrimagnetic oxides or from ferromagnetic materials in the group consisting of element metal, mixtures of elemental metal oxides, nitrides, carbides, borides and fluorides.
Claim 7
Dependent Claim
17 words
An article according to claim 1, wherein said particles have a Curie temperature greater than 300° C.
Claim 8
Dependent Claim
19 words
An article according to claim 1, wherein said magnetic particles are in the range of 0.05 to 500 μm.
Claim 9
Dependent Claim
27 words
An article according to claim 1, wherein at least some of said magnetic particles are coated with a metal layer which is wettable in said matrix material.
Claim 10
Dependent Claim
18 words
An article according to claim 8, wherein the metal layer is more oxidation resistant than the magnetic particles.
Claim 11
Dependent Claim
46 words
A solder composition according to claim 1, wherein said solder composition has a room temperature yield strength and ultimate strength which respectively are at least 10% greater than the room temperature yield strength and ultimate strength of an otherwise identical comparison solder composition without magnetic particles.
Claim 12
Dependent Claim
41 words
A solder composition according to claim 1, wherein said solder composition has a creep deformation at 1000 psi at 100° C. which is at least 50% less than the creep deformation of an otherwise identical comparison solder composition without magnetic particles.
Claim 13
Dependent Claim
46 words
A solder composition according to claim 1, wherein said solder composition has a maximum stress for failure by fatigue crack growth which is at least 20% greater than the maximum stress for failure by fatigue crack growth of an otherwise identical solder composition without magnetic particles.
References Cited (Backward Citations)
US2451099A
Cited
US3566512A
Cited
US3998669A
Cited
DE2916299A1
Cited
US4663242A
Cited
SU1383517A1
Cited
US5134039A
Cited
US5093545A
Cited
JPH02281742A
Cited
US5066544A
Cited
US5089356A
Cited
US5088007A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-09-12 | 1998-03-14 | 1998-09-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-09-12 | 2002-03-14 | 2002-09-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-09-12 | 2006-03-14 | 2006-09-13 | $7700.00 | Window Closed / Lapsed |