Heat sink having air movement device positioned among tins and between heating elements

Claim 2

A heat sink for removing heat from at least two heating elements mounted on a printed wiring board, comprising: a base member having a lower surface and an upper surface, said lower surface being mounted on said first and second heating elements, said upper surface having a blowing region located between said first and second heating elements, and a plurality of upwardly projecting radiation fins formed on the upper surface except at said blowing region; and an air blower provided in said blowing region for circulating air through said radiation fins.

Claim 3

A heat sink according to claim 1, wherein said air blower comprises: a cover fixed to said radiation fins so as to cover said blowing region; a motor fixed to said cover and having a spindle extending in a direction of thickness of said base member; a blade adapted to be rotated by said motor; and a driving circuit for driving said motor.

Claim 4

A heat sink according to claim 2, wherein said cover covers substantially all of the radiation fins.

Claim 5

A heat sink according to claim 1, wherein said base member has a multilayer structure including a first member mounted on said first and second heating elements and a second member from which the radiation fins project, the second member being integrally formed with said radiation fins.

Claim 6

A heat sink according to claim 4, wherein said first member has a thermal conductivity larger than that of said second member.

Claim 7

A heat sink according to claim 5, wherein said first member is formed of a material selected from copper and copper tungsten, and said second member is formed of aluminum.

Claim 8

A heat sink according to claim 6, wherein said second member has a nickel plating layer formed on at least a lower surface thereof, and said first member and said second member are bonded together by soldering.

Claim 9

A heat sink according to claim 4, wherein said first member and said second member respectively have opposing surfaces bonded together, the opposing surfaces having irregularities meshing with each other to increase a bonding area.

Claim 10

A heat sink according to claim 4, wherein said first member has an edge portion projecting outside of said second member and auxiliary fins integral with said edge portion.

Claim 11

A heat sink according to claim 1, wherein said base member has an air circulation hole extending from said upper surface to said lower surface in said blowing region for providing external air communication to the air blower.

Claim 12

A heat sink according to claim 4, wherein a portion of said first member located between said first and second heating elements is thicker than a remainder, portion of said first member located adjacent to one of said first and second heating elements.

Claim 13

A heat sink according to claim 1, wherein said radiation fins are regularly spaced at a first pitch in a longitudinal direction of said base member and regularly spaced at a second pitch in a lateral direction of said base member, and the first pitch of said radiation fins is different from the second pitch of said radiation fins.

Claim 14

A heat sink according to claim 12, wherein said heat sink is part of a device in which an air flow is generated by an external device to flow in one of said longitudinal direction and said lateral direction, and the pitch of said radiation fins is smaller in the direction of said air flow generated by said external device.

Claim 15

A heat sink according to claim 2, wherein said cover covers a first portion of said radiation fins and does not cover a second portion of said radiation fins, said first portion being located in the vicinity of said blowing region, and said first portion encompassing fewer radiation fins than said second portion.

Claim 16

A heat sink according to claim 1, wherein the first and second heating elements are semiconductor chips.

Claim 17

A heat sink according to claim 1, wherein the first and second heating elements are semiconductor chips enclosed respectively in first and second integrated circuit packages.

Claim 18

A heat generating and cooling device, comprising: two heating elements mounted on a printed circuit board with a spacing area therebetween; a base member having opposing lower and upper surfaces, the lower surface being secured to the two heating elements and having a spacing area facing the spacing area between the heating elements, the upper surface having a blowing region located to oppose at least a portion of the spacing area of the lower surface, the upper surface having upwardly projecting heat radiation fins formed thereon except at the blowing region; and an air blower positioned in the blowing region for moving air through the heat radiation fins.

Claim 19

A heat generating and cooling device, comprising: two heating elements mounted on a printed circuit board with a spacing area therebetween; a base member having opposing lower and upper surfaces, the lower surface being secured to the two heating elements and having a spacing area facing the spacing area between the heating elements, the upper surface having a blowing region located to oppose at least a portion of the spacing area of the lower surface, the upper surface having upwardly projecting heat radiation fins formed thereon except at the blowing region; and an air blower positioned in the blowing region for moving air through the heat radiation fins.