Claims Analysis
Total Claims: 44
Claim 1
Independent Claim
82 words
A semiconductor IC comprising: a substrate; a VCO portion disposed on said substrate, said VCO portion including first, second, and third transistors, each transistor having an emitter, a collector, and a base wherein the emitter of the first transistor is connected to the base of the second and third transistors; an internal circuit disposed on said substrate; and a capacitor coupled between said VCO portion and said internal circuit to cut off direct current between the VCO portion and the internal circuit.
Claim 2
Dependent Claim
82 words
A semiconductor IC comprising: a substrate; a VCO portion disposed on said substrate, said VCO portion including first, second, and third transistors, each transistor having an emitter, a collector, and a base wherein the emitter of the first transistor is connected to the base of the second and third transistors; an internal circuit disposed on said substrate; and a capacitor coupled between said VCO portion and said internal circuit to cut off direct current between the VCO portion and the internal circuit.
Claim 3
Dependent Claim
78 words
A semiconductor IC comprising: a substrate; a VCO portion disposed on said substrate; an internal circuit disposed on said substrate; a differential buffer circuit connected to said internal circuit and arranged on said substrate to cut off direct current between said VCO portion and said internal circuit; a capacitor having a first terminal connected to said VCO portion and a second terminal connected to said differential buffer; and a constant voltage source connected to said differential buffer circuit.
Claim 4
Dependent Claim
78 words
A semiconductor IC comprising: a substrate; a VCO portion disposed on said substrate; an internal circuit disposed on said substrate; a differential buffer circuit connected to said internal circuit and arranged on said substrate to cut off direct current between said VCO portion and said internal circuit; a capacitor having a first terminal connected to said VCO portion and a second terminal connected to said differential buffer; and a constant voltage source connected to said differential buffer circuit.
Claim 5
Dependent Claim
117 words
A semiconductor IC comprising: a substrate; a VCO portion disposed on said substrate, said VCO portion having an input and an output; an internal circuit disposed on said substrate; a differential buffer circuit having an input and an output, said differential buffer circuit being arranged on said substrate to cut off direct current between said VCO portion and said internal circuit; a series circuit of a resistor and a capacitor, a first end of said series circuit being connected to the output of said VCO portion, and a second end of said series circuit being connected to the input of said differential buffer circuit; and a constant voltage source connected to the input of said differential buffer.
Claim 6
Dependent Claim
117 words
A semiconductor IC comprising: a substrate; a VCO portion disposed on said substrate, said VCO portion having an input and an output; an internal circuit disposed on said substrate; a differential buffer circuit having an input and an output, said differential buffer circuit being arranged on said substrate to cut off direct current between said VCO portion and said internal circuit; a series circuit of a resistor and a capacitor, a first end of said series circuit being connected to the output of said VCO portion, and a second end of said series circuit being connected to the input of said differential buffer circuit; and a constant voltage source connected to the input of said differential buffer.
Claim 7
Dependent Claim
119 words
The semiconductor IC of claim 2 wherein said differential buffer includes a differential amplifier having first and second transistors and an emitter follower output circuit including first and second output transistors, the first transistor of the differential amplifier being coupled with said VCO portion; wherein said constant voltage source is connected to respective bases of the first and second transistors of the differential amplifier; and wherein respective collectors of the first and second transistors of the differential amplifier are connected to corresponding bases of the first and second output transistors, respectively; and further comprising first and second constant current sources, the first and second constant current sources being connected to emitters of the first and second output transistors, respectively.
Claim 8
Dependent Claim
119 words
The semiconductor IC of claim 3 wherein said differential buffer includes a differential amplifier having first and second transistors and an emitter follower output circuit including first and second output transistors, the first transistor of the differential amplifier being coupled with said VCO portion; wherein said constant voltage source is connected to respective bases of the first and second transistors of the differential amplifier; and wherein respective collectors of the first and second transistors of the differential amplifier are connected to corresponding bases of the first and second output transistors, respectively and further comprising first and second constant current sources, the first and second constant current sources being connected to emitters of the first and second output transistors, respectively.
Claim 9
Dependent Claim
48 words
The semiconductor IC of claim 2 further comprising: means for receiving power from a first power supply and for transmitting the received power to said VCO portion; and means for receiving power from a second power supply and for transmitting the received power to said differential buffer circuit.
Claim 10
Dependent Claim
48 words
The semiconductor IC of claim 3 further comprising: means for receiving power from a first power supply and for transmitting the received power to said VCO portion; and means for receiving power from a second power supply and for transmitting the received power to said differential buffer circuit.
Claim 11
Dependent Claim
74 words
A semiconductor IC on a silicon wafer chip comprising: a VCO portion; a single buffer; a first capacitor connected to said VCO portion and to said single buffer to cut off direct current flow between said VCO and said single buffer; a differential buffer; an internal circuit connected to said differential buffer; and a second capacitor having a first terminal connected to said single buffer and a second terminal connected to said differential buffer.
Claim 12
Dependent Claim
74 words
A semiconductor IC on a silicon wafer chip comprising: a VCO portion; a single buffer; a first capacitor connected to said VCO portion and to said single buffer to cut off direct current flow between said VCO and said single buffer; a differential buffer; an internal circuit connected to said differential buffer; and a second capacitor having a first terminal connected to said single buffer and a second terminal connected to said differential buffer.
Claim 13
Dependent Claim
73 words
A semiconductor IC on a silicon wafer chip comprising: a VCO portion; a single buffer; a first capacitor connected to said VCO portion and to said single buffer to cut off direct current flow between said VCO and said single buffer; an internal circuit; and a series circuit of a second capacitor and a resistor connected to said single buffer and said internal circuit for separating said single buffer from said internal circuit.
Claim 14
Dependent Claim
73 words
A semiconductor IC on a silicon wafer chip comprising: a VCO portion; a single buffer; a first capacitor connected to said VCO portion and to said single buffer to cut off direct current flow between said VCO and said single buffer; an internal circuit; and a series circuit of a second capacitor and a resistor connected to said single buffer and said internal circuit for separating said single buffer from said internal circuit.
Claim 15
Dependent Claim
67 words
A semiconductor IC on a silicon wafer chip comprising: a first capacitor connected to a VCO portion and to a single buffer to cut off direct current flow between said VCO and said single buffer; a differential buffer; an internal circuit connected to said differential buffer; and a series circuit of a second capacitor and a resistor connected to said differential buffer and to said internal circuit.
Claim 16
Dependent Claim
67 words
A semiconductor IC on a silicon wafer chip comprising: a first capacitor connected to a VCO portion and to a single buffer to cut off direct current flow between said VCO and said single buffer; a differential buffer; an internal circuit connected to said differential buffer; and a series circuit of a second capacitor and a resistor connected to said differential buffer and to said internal circuit.
Claim 17
Dependent Claim
40 words
The semiconductor IC of claim 8 wherein said single buffer includes a buffer transistor having a base connected to a constant current source and to a plurality of diodes, said buffer transistor having an emitter connected to a grounded resistor.
Claim 18
Dependent Claim
40 words
The semiconductor IC of claim 9 wherein said single buffer includes a buffer transistor having a base connected to a constant current source and to a plurality of diodes, said buffer transistor having an emitter connected to a grounded resistor.
Claim 19
Dependent Claim
40 words
The semiconductor IC of claim 10 wherein said single buffer includes a buffer transistor having a base connected to a constant current source and to a plurality of diodes, said buffer transistor having an emitter connected to a grounded resistor.
Claim 20
Dependent Claim
47 words
The semiconductor IC of claim 8 wherein said single buffer includes a buffer transistor having a base connected to a constant current source and to a series circuit of a plurality of diodes and a resistor, said buffer transistor having an emitter connected to a grounded resistor.
Claim 21
Dependent Claim
47 words
The semiconductor IC of claim 9 wherein said single buffer includes a buffer transistor having a base connected to a constant current source and to a series circuit of a plurality of diodes and a resistor, said buffer transistor having an emitter connected to a grounded resistor.
Claim 22
Dependent Claim
47 words
The semiconductor IC of claim 10 wherein said single buffer includes a buffer transistor having a base connected to a constant current source and to a series circuit of a plurality of diodes and a resistor, said buffer transistor having an emitter connected to a grounded resistor.
Claim 23
Dependent Claim
96 words
A semiconductor IC having a VCO portion, a single buffer, and an internal circuit on a silicon wafer chip comprising: a first capacitor interconnecting said VCO portion and said single buffer to cut off direct current between said VCO portion and said single buffer; and a second capacitor interconnecting the internal circuit and said single buffer to cut off direct current between said single buffer and said internal circuit; said single buffer including a buffer transistor having a base connected to a resistor, the buffer transistor having an emitter connected to a grounded constant current source.
Claim 24
Dependent Claim
96 words
A semiconductor IC having a VCO portion, a single buffer, and an internal circuit on a silicon wafer chip comprising: a first capacitor interconnecting said VCO portion and said single buffer to cut off direct current between said VCO portion and said single buffer; and a second capacitor interconnecting the internal circuit and said single buffer to cut off direct current between said single buffer and said internal circuit; said single buffer including a buffer transistor having a base connected to a resistor, the buffer transistor having an emitter connected to a grounded constant current source.
Claim 25
Dependent Claim
102 words
A semiconductor IC having a VCO portion, a single buffer, and an internal circuit on a silicon wafer chip comprising: a first capacitor interconnecting the VCO portion and the single buffer to cut off direct current between the VCO portion and the single buffer; and a series circuit of a second capacitor and a resistor, the series circuit interconnecting the single buffer and the internal circuit for separating the single buffer from the internal circuit; said single buffer including a buffer transistor having a base connected to a resistor, the buffer transistor having an emitter connected to a grounded constant current source.
Claim 26
Dependent Claim
102 words
A semiconductor IC having a VCO portion, a single buffer, and an internal circuit on a silicon wafer chip comprising: a first capacitor interconnecting the VCO portion and the single buffer to cut off direct current between the VCO portion and the single buffer; and a series circuit of a second capacitor and a resistor, the series circuit interconnecting the single buffer and the internal circuit for separating the single buffer from the internal circuit; said single buffer including a buffer transistor having a base connected to a resistor, the buffer transistor having an emitter connected to a grounded constant current source.
Claim 27
Dependent Claim
97 words
A semiconductor IC having a VCO portion, a single buffer, and an internal circuit on a silicon wafer chip comprising: a first capacitor interconnecting the VCO portion and the single buffer to cut off direct current between the VCO portion and the single buffer; and a second capacitor interconnecting the single buffer with the internal circuit to cut off direct current between the single buffer and the internal circuit; said single buffer including a buffer transistor having a base connected to a constant voltage source (V1), and having an emitter connected to a grounded constant current source.
Claim 28
Dependent Claim
97 words
A semiconductor IC having a VCO portion, a single buffer, and an internal circuit on a silicon wafer chip comprising: a first capacitor interconnecting the VCO portion and the single buffer to cut off direct current between the VCO portion and the single buffer; and a second capacitor interconnecting the single buffer with the internal circuit to cut off direct current between the single buffer and the internal circuit; said single buffer including a buffer transistor having a base connected to a constant voltage source (V1), and having an emitter connected to a grounded constant current source.
Claim 29
Dependent Claim
100 words
A semiconductor IC having a VCO portion, a single buffer, and an internal circuit on a silicon wafer chip comprising: a first capacitor interconnecting the VCO portion and the single buffer to cut off direct current between the VCO portion and the single buffer; and a series circuit of a second capacitor and a resistor interconnecting the single buffer and the internal circuit to separate the single buffer from the internal circuit; said single buffer including a buffer transistor having a base connected to a constant voltage source and having an emitter connected to a grounded a constant current source.
Claim 30
Dependent Claim
100 words
A semiconductor IC having a VCO portion, a single buffer, and an internal circuit on a silicon wafer chip comprising: a first capacitor interconnecting the VCO portion and the single buffer to cut off direct current between the VCO portion and the single buffer; and a series circuit of a second capacitor and a resistor interconnecting the single buffer and the internal circuit to separate the single buffer from the internal circuit; said single buffer including a buffer transistor having a base connected to a constant voltage source and having an emitter connected to a grounded a constant current source.
Claim 31
Dependent Claim
107 words
A semiconductor IC having a VCO portion, a single buffer, and an internal circuit on a silicon wafer chip comprising: a series circuit of a first capacitor and a resistor, said series circuit interconnecting the VCO portion and the differential buffer to separate the VCO portion from the single buffer; a second capacitor interconnecting the single buffer and the internal circuit to cut off direct current between the single buffer and the internal circuit; and a constant voltage source connected to a node of the first capacitor and the resistor; said single buffer including a buffer transistor having an emitter connected to a grounded constant current source.
Claim 32
Dependent Claim
107 words
A semiconductor IC having a VCO portion, a single buffer, and an internal circuit on a silicon wafer chip comprising: a series circuit of a first capacitor and a resistor, said series circuit interconnecting the VCO portion and the differential buffer to separate the VCO portion from the single buffer; a second capacitor interconnecting the single buffer and the internal circuit to cut off direct current between the single buffer and the internal circuit; and a constant voltage source connected to a node of the first capacitor and the resistor; said single buffer including a buffer transistor having an emitter connected to a grounded constant current source.
Claim 33
Dependent Claim
113 words
A semiconductor IC having a VCO portion, a single buffer, and an internal circuit on a silicon wafer chip comprising: a series circuit of a first capacitor and a resistor, the capacitor and the resistor being connected at a node, the series circuit interconnecting the single buffer and the VCO portion to separate the VCO portion from the single buffer; a series circuit of a second capacitor and a resistor interconnecting the single buffer and the internal circuit to separate the single buffer from the internal circuit; and a constant voltage source connected to the node; said single buffer including a buffer transistor having an emitter connected to a grounded constant current source.
Claim 34
Dependent Claim
113 words
A semiconductor IC having a VCO portion, a single buffer, and an internal circuit on a silicon wafer chip comprising: a series circuit of a first capacitor and a resistor, the capacitor and the resistor being connected at a node, the series circuit interconnecting the single buffer and the VCO portion to separate the VCO portion from the single buffer; a series circuit of a second capacitor and a resistor interconnecting the single buffer and the internal circuit to separate the single buffer from the internal circuit; and a constant voltage source connected to the node; said single buffer including a buffer transistor having an emitter connected to a grounded constant current source.
Claim 35
Dependent Claim
29 words
The semiconductor IC of claim 17 further comprising a differential buffer having a first terminal connected to said second capacitor and a second terminal connected to said internal circuit.
Claim 36
Dependent Claim
29 words
The semiconductor IC of claim 19 further comprising a differential buffer having a first terminal connected to said second capacitor and a second terminal connected to said internal circuit.
Claim 37
Dependent Claim
29 words
The semiconductor IC of claim 21 further comprising a differential buffer having a first terminal connected to said second capacitor and a second terminal connected to said internal circuit.
Claim 38
Dependent Claim
32 words
The semiconductor IC of claim 18 further comprising a differential buffer having a first terminal connected to the resistor of said series circuit and a second terminal connected to said internal circuit.
Claim 39
Dependent Claim
28 words
The semiconductor IC of claim 20 further comprising a differential buffer having a first terminal connected to said resistor and a second terminal connected to said internal circuit.
Claim 40
Dependent Claim
28 words
The semiconductor IC of claim 22 further comprising a differential buffer having a first terminal connected to said resistor and a second terminal connected to said internal circuit.
Claim 41
Dependent Claim
137 words
A semiconductor IC comprising: a substrate; a VCO portion disposed on said substrate; a single buffer disposed on said substrate and including a buffer transistor having a base connected to a constant current source and to a plurality of diodes, said buffer transistor having an emitter connected to a grounded resistor; an internal circuit disposed on said substrate; a first capacitor connected to said VCO portion and to said single buffer; and a second capacitor connected to said single buffer and to said internal circuit such that a signal path is formed from said VCO portion to said internal circuit, said first capacitor being arranged on said substrate to cut off direct current between said VCO portion and said single buffer, said second capacitor being arranged on said substrate to attenuate feedback signals from said internal circuit.
Claim 42
Dependent Claim
137 words
A semiconductor IC comprising: a substrate; a VCO portion disposed on said substrate; a single buffer disposed on said substrate and including a buffer transistor having a base connected to a constant current source and to a plurality of diodes, said buffer transistor having an emitter connected to a grounded resistor; an internal circuit disposed on said substrate; a first capacitor connected to said VCO portion and to said single buffer; and a second capacitor connected to said single buffer and to said internal circuit such that a signal path is formed from said VCO portion to said internal circuit, said first capacitor being arranged on said substrate to cut off direct current between said VCO portion and said single buffer, said second capacitor being arranged on said substrate to attenuate feedback signals from said internal circuit.
Claim 43
Dependent Claim
144 words
A semiconductor IC comprising: a substrate; a VCO portion disposed on said substrate; a single buffer disposed on said substrate and including a buffer transistor having a base connected to a constant current source and to a series circuit of a plurality of diodes and a resistor, said buffer transistor having an emitter connected to a grounded resistor; an internal circuit disposed on said substrate; a first capacitor connected to said VCO portion and to said single buffer; and a second capacitor connected to said single buffer and to said internal circuit such that a signal path is formed from said VCO portion to said internal circuit, said first capacitor being arranged on said substrate to cut off direct current between said VCO portion and said single buffer, said second capacitor being arranged on said substrate to attenuate feedback signals from said internal circuit.
Claim 44
Dependent Claim
144 words
A semiconductor IC comprising: a substrate; a VCO portion disposed on said substrate; a single buffer disposed on said substrate and including a buffer transistor having a base connected to a constant current source and to a series circuit of a plurality of diodes and a resistor, said buffer transistor having an emitter connected to a grounded resistor; an internal circuit disposed on said substrate; a first capacitor connected to said VCO portion and to said single buffer; and a second capacitor connected to said single buffer and to said internal circuit such that a signal path is formed from said VCO portion to said internal circuit, said first capacitor being arranged on said substrate to cut off direct current between said VCO portion and said single buffer, said second capacitor being arranged on said substrate to attenuate feedback signals from said internal circuit.