Patent US5682297A successfully refreshed from Google Patents.
US5682297A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Dual pattern microprocessor package footprint
Assignee: AST Research Inc
•
Filing: 1996-03-12
•
Granted: 1997-10-28
•
Expires: 2016-03-12
Abstract
Abstract A dual footprint for servicing either of two types of microprocessor packaging systems. A first footprint capable of receiving and servicing a first type of microprocessor packaging system, for example, a tape carrier package microprocessor package, is formed within a second footprint capable of receiving and servicing a second type of microprocessor packaging system, for example, a pin grid array microprocessor package. In a preferred form, the two footprints are electrically interconnected and the first footprint is offset by a selected angle from the second footprint to allow increased connectivity between the two footprints.
Inventors
- 👤 David J. Silva
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 15:19
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K3/00; H05K3/30; H05K1/0286; H05K1/0295; H05K1/0201; H05K1/0203; H05K1/0204; H05K1/0206; H05K1/112; H05K1/114; H05K1/18; H05K1/181; H05K2201/00; H05K2201/09; H05K2201/09818; H05K2201/09954; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10681; H05K2201/10689; H05K2201/10704; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
81 words
A dual footprint for a PC board comprising: a first package array footprint; a second package array footprint; and a plurality of conductor traces interconnecting said first package array footprint and said second package array footprint such that said first package array footprint and said second package array footprint form a single dual footprint wherein said first package array footprint and said second package array footprint are alternatively capable of servicing a microprocessor package of either a first or second type.
Claim 2
Dependent Claim
81 words
A dual footprint for a PC board comprising: a first package array footprint; a second package array footprint; and a plurality of conductor traces interconnecting said first package array footprint and said second package array footprint such that said first package array footprint and said second package array footprint form a single dual footprint wherein said first package array footprint and said second package array footprint are alternatively capable of servicing a microprocessor package of either a first or second type.
Claim 3
Dependent Claim
30 words
The dual footprint of claim 1, wherein said first package array footprint comprises a pin grid array footprint and said second package array footprint comprises a tape carrier package footprint.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-10-27 | 2001-04-28 | 2001-10-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-10-27 | 2005-04-28 | 2005-10-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-10-27 | 2009-04-28 | 2009-10-28 | $7700.00 | Window Closed / Lapsed |