Patent US5681883A successfully refreshed from Google Patents.
US5681883A
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Enhanced boron nitride composition and polymer based high thermal conductivity molding compound
Assignee: General Electric Co
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Filing: 1996-03-05
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Granted: 1997-10-28
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Expires: 2016-03-05
Abstract
Abstract The present invention relates to a boron nitride composition of particles of boron nitride and a nonionic surfactant for use as a filler with a distribution of agglomerates having an average particle size in the range of between 20-80 microns and to a molding compound having a high thermal conductivity of above at least 5 W/m DEG K. The molding compound comprises a polymer base material, a filler and a nonionic surfactant with the filler comprising boron nitride in a concentration of at least 60% by weight of said composition and wherein the nonionic surfactant is selected from the class consisting of carboxylic acid amides and carboxylic acid esters.
Inventors
- 👤 Richard Frank Hill
- 👤 Stephen Phillip DaVanzo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 20:21
CPC Classifications
C; C08; C08L; C08L101/00; C08K; C08K3/00; C08K3/38; C08K5/00; H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0373
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
71 words
A high thermal conductivity molding composition having a spiral flow of above 10 inches and a thermal conductivity of above 5 W/m° K. comprising a polymer base matrix, a boron nitride filler in a concentration of above 60% by weight and an additive consisting of a nonionic surfactant selected from the class consisting of carboxylic acid amides and carboxylic acid esters in a concentration of above at least 1% by weight.
Claim 2
Dependent Claim
71 words
A high thermal conductivity molding composition having a spiral flow of above 10 inches and a thermal conductivity of above 5 W/m° K. comprising a polymer base matrix, a boron nitride filler in a concentration of above 60% by weight and an additive consisting of a nonionic surfactant selected from the class consisting of carboxylic acid amides and carboxylic acid esters in a concentration of above at least 1% by weight.
Claim 3
Dependent Claim
17 words
A high thermal conductivity molding composition as defined in claim 1 wherein said additive is sorbitan monostearate.
Claim 4
Dependent Claim
29 words
A high thermal conductivity molding composition as defined in claim 2 wherein said polymer base matrix comprises an epoxy resin formulation of an epoxy cresol novolak and phenyl novolak.
Claim 5
Dependent Claim
23 words
A high thermal conductivity molding composition as defined in claim 3 wherein said additive lies in a range of between 1-4.5% by weight.
Claim 6
Dependent Claim
30 words
A high thermal conductivity molding composition as defined in claim 1 wherein said boron nitride filler is in a particulate form having an average particle size of between 20-80 microns.
Claim 7
Dependent Claim
31 words
A boron nitride composition for use as a filler consisting essentially of boron nitride and a nonionic surfactant selected from the class consisting of carboxylic acid amides and carboxylic acid esters.
Claim 8
Dependent Claim
31 words
A boron nitride composition for use as a filler consisting essentially of boron nitride and a nonionic surfactant selected from the class consisting of carboxylic acid amides and carboxylic acid esters.
Claim 9
Dependent Claim
41 words
A boron nitride composition as defined in claim 6 further comprising a polymer matrix with said polymer matrix consisting of epoxy cresol novolak and phenyl novolak and with the concentration of said surfactant in a range of between 1-4.5% by weight.
Claim 10
Dependent Claim
23 words
A boron nitride composition as defined in claim 6 further comprising a boron nitride powder with an average particle size of 20-80 microns.
Claim 11
Dependent Claim
23 words
A boron nitride composition as defined in claim 6 further comprising a boron nitride powder with an average particle size of 1-20 microns.
References Cited (Backward Citations)
US5011872A
Cited
US5498659A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-10-27 | 2001-04-28 | 2001-10-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-10-27 | 2005-04-28 | 2005-10-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-10-27 | 2009-04-28 | 2009-10-28 | $7700.00 | Window Closed / Lapsed |