Bi-stable memory element

Claim 2

In an integrated circuit, a bi-stable memory element comprising: a base contact, made from an electrically conductive material; a bridging contact having first and second sides, made from an electrically conductive material, and dimensioned so as to have two stable positions, in one of which the bridging contact is in contact with the base contact, and in the other of which the bridging contact is spaced apart from the base contact; and deflection means, for deflecting the bridging contact from one stable position to the other, at least part of the deflection means and the base contact being on the first side of the bridging contact.

Claim 3

A bi-stable memory element according to claim 1, wherein the contacts and deflection means are formed by photolithography, chemical deposition, sputtering, or metal evaporation.

Claim 4

A bi-stable memory element according to claim 1, wherein the bridging contact is cantilevered with its fixed end attached to a base layer by a support, the bridging contact being biased into one of two stable positions by a biasing layer.

Claim 5

A hi-stable memory element according to claim 1, wherein the deflection means comprises a pair of electrodes, electrically insulated from the base contact and bridging contact, and operating in sequence to attract or deflect the bridging contact towards or away from the base contact by electrostatic forces.

Claim 6

A bi-stable memory element according to claim 1, further including deflection means both above and below the bridging contact.

Claim 7

A bi-stable memory element according to claim 1, wherein the element is in an atmosphere of high relative breakdown voltage gas.

Claim 8

A bi-stable memory element according to claim 6, wherein the gas is perfluoropropane.

Claim 9

A bi-stable memory element according to claim 1, wherein the bridging contact is strengthened across at least part of its unsupported length.

Claim 10

A hi-stable memory element according to claim 8, wherein the strengthening is provided by corrugations on the bridging contact surface.

Claim 11

A bi-stable memory element according to claim 8, wherein the strengthening is provided by an additional layer on the bridging contact surface.

Claim 12

A bi-stable memory element comprising: a base contact, made from an electrically conductive material; a bridging contact, made from an electrically conductive material, and dimensioned so as to have two stable positions, in one of which the bridging contact is in contact with the base contact, and in the other of which the bridging contact is spaced apart from the base contact; and deflection means, for deflecting the bridging contact from one stable position to the other, wherein said deflection means comprises a pair of electrodes, electrically insulated from the base contact and bridging contact, and operating in sequence to attract or deflect the bridging contact towards or away from the base contact by electrostatic forces.

Claim 13

A bi-stable memory element comprising: a base contact, made from an electrically conductive material; a bridging contact, made from an electrically conductive material, and dimensioned so as to have two stable positions, in one of which the bridging contact is in contact with the base contact, and in the other of which the bridging contact is spaced apart from the base contact; and deflection means, for deflecting the bridging contact from one stable position to the other, wherein said deflection means comprises a pair of electrodes, electrically insulated from the base contact and bridging contact, and operating in sequence to attract or deflect the bridging contact towards or away from the base contact by electrostatic forces.