Patent JPH0241572A successfully refreshed from Google Patents.
Patent US5666003A successfully refreshed from Google Patents.
US5666003A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Packaged semiconductor device incorporating heat sink plate
Assignee: Rohm Co Ltd
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Filing: 1995-10-23
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Granted: 1997-09-09
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Expires: 2015-10-23
Abstract
Abstract A packaged semiconductor device is provided which comprises a die pad, a semiconductor chip mounted on the die pad, a plurality of leads electrically connected to the semiconductor chip, a heat sink plate bonded to the die pad opposite to the semiconductor chip, and a resin package enclosing at least the semiconductor chip together with the die pad and a part of each lead. The heat sink plate has a peripheral portion partially overlapping each lead but electrically insulated.
Inventors
- 👤 Kazutaka Shibata
- 👤 Sadahito Nishida
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 10:36
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5449; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
133 words
A packaged semiconductor device comprising: a die pad; a semiconductor chip mounted on the die pad; a plurality of leads electrically connected to the semiconductor chip; a heat sink plate bonded to the die pad opposite to the semiconductor chip, the heat sink plate having a peripheral portion partially overlapping each of the leads but electrically insulated therefrom; and a resin package enclosing at least the semiconductor chip together with the die pad and a part of each said lead; wherein the die pad has a contact surface for direct contact with the heat sink plate; wherein the heat sink plate is directly bonded to the die pad only in a limited central region without intervention of a separate bonding layer; and wherein the limited central region is smaller than said contact surface.
Claim 2
Dependent Claim
133 words
A packaged semiconductor device comprising: a die pad; a semiconductor chip mounted on the die pad; a plurality of leads electrically connected to the semiconductor chip; a heat sink plate bonded to the die pad opposite to the semiconductor chip, the heat sink plate having a peripheral portion partially overlapping each of the leads but electrically insulated therefrom; and a resin package enclosing at least the semiconductor chip together with the die pad and a part of each said lead; wherein the die pad has a contact surface for direct contact with the heat sink plate; wherein the heat sink plate is directly bonded to the die pad only in a limited central region without intervention of a separate bonding layer; and wherein the limited central region is smaller than said contact surface.
Claim 3
Dependent Claim
22 words
The device according to claim 1, wherein each said lead is electrically insulated from the heat sink plate by a spacing therebetween.
Claim 4
Dependent Claim
28 words
The device according to claim 1, wherein each said lead is electrically insulated from the heat sink plate by an insulating adhesive tape attached to each said lead.
Claim 5
Dependent Claim
35 words
The device according to claim 1, wherein each said lead is electrically insulated from the heat sink plate by a spacing therebetween as well as by an insulating adhesive tape attached to each said lead.
Claim 6
Dependent Claim
19 words
The device according to claim 1, wherein the heat sink plate has a surface exposed outside the resin package.
Claim 7
Dependent Claim
18 words
The device according to claim 1, wherein the heat sink plate is fully enclosed in the resin package.
Claim 8
Dependent Claim
17 words
The device according to claim 1, wherein the heat sink plate has a surface formed with depressions.
Claim 9
Dependent Claim
24 words
The device according to claim 1, wherein the die pad is integral with at least one heat dissipating fin located outside the resin package.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-09-08 | 2001-03-10 | 2001-09-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-09-08 | 2005-03-10 | 2005-09-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-09-08 | 2009-03-10 | 2009-09-09 | $7700.00 | Window Closed / Lapsed |