Patent US5665654A successfully refreshed from Google Patents.
US5665654A
Expired / Lapsed
US
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Method for forming an electrical connection to a semiconductor die using loose lead wire bonding
Assignee: Micron Technology Inc
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Filing: 1996-02-09
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Granted: 1997-09-09
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Expires: 2016-02-09
Abstract
Abstract A method for forming an electrical connection between a semiconductor die and a corresponding electrical component mounted within an electrical device is provided. The method includes wire bonding metal wires to the bond pads of the die and then severing the metal wires to form loose leads attached to the bond pads. With the die mounted to the electrical device, the loose leads are bonded to the electrical component using a bonding tip. In an illustrative embodiment, the electrical device is a field emission display package and the electrical component is conductive traces for the package. Advantageous, the method can be used to form the electrical connection between the die mounted in a sealed space and the corresponding electrical component which is outside of the sealed space.
Inventors
- 👤 Darryl M. Stansbury
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 15:31
CPC Classifications
H; H01; H01J; H01J9/00; H01J9/02; H01J9/18; H01J9/185; H01J29/00; H01J29/02; H01J29/028; H01J29/92; H01J9/24; H01J9/241; H01J2329/00; H01J2329/86; H01J2329/8625; H01J2329/92; H10; H10W; H10W72/00; H10W72/01; H10W72/015; H10W72/01551; H10W72/071; H10W72/0711; H10W72/075; H10W72/07511; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/5525
Claims Analysis
Total Claims: 47
Claim 1
Independent Claim
53 words
A method for forming an electrical connection to a semiconductor die, comprising: wire bonding a metal wire to a pad of the die; severing the metal wire to form a loose lead attached to the pad; assembling the die in an electronic device; and then bonding the loose lead to an electrical component.
Claim 2
Independent Claim
53 words
A method for forming an electrical connection to a semiconductor die, comprising: wire bonding a metal wire to a pad of the die; severing the metal wire to form a loose lead attached to the pad; assembling the die in an electronic device; and then bonding the loose lead to an electrical component.
Claim 3
Dependent Claim
28 words
The method as claimed in claim 1 and wherein bonding the loose lead is by applying heat and pressure to the loose lead using a heated bonding tip.
Claim 4
Dependent Claim
36 words
The method as claimed in claim 1 and further comprising assembling the die in a sealed space of the electronic device and bonding the loose lead to the electrical component located outside of the sealed space.
Claim 5
Dependent Claim
29 words
The method as claimed in claim 1 and wherein wire bonding the metal wire is with a method selected from the group consisting of ultrasonic, thermocompression and thermosonic bonding.
Claim 6
Dependent Claim
32 words
The method as claimed in claim 1 and wherein bonding the loose lead to the electrical component is with a method selected from the group consisting of ultrasonic, thermocompression and thermosonic bonding.
Claim 7
Dependent Claim
16 words
The method as claimed in claim 1 and wherein the electrical component is a conductive trace.
Claim 8
Dependent Claim
17 words
The method as claimed in claim 1 and wherein the electronic device is a field emission display.
Claim 9
Independent Claim
84 words
A method for forming an electrical connection to a semiconductor die, said method comprising: wire bonding a metal wire to a bond pad of the die; severing the metal wire to form a loose lead attached to the bond pad and having a desired length; assembling the die in an electronic device with the loose lead extending therefrom; forming a peripheral seal around the die and over the loose lead; and bonding the loose lead to an electrical component located outside of the seal.
Claim 10
Independent Claim
84 words
A method for forming an electrical connection to a semiconductor die, said method comprising: wire bonding a metal wire to a bond pad of the die; severing the metal wire to form a loose lead attached to the bond pad and having a desired length; assembling the die in an electronic device with the loose lead extending therefrom; forming a peripheral seal around the die and over the loose lead; and bonding the loose lead to an electrical component located outside of the seal.
Claim 11
Dependent Claim
18 words
The method as claimed in claim 8 and further comprising evacuating a sealed space formed by the seal.
Claim 12
Dependent Claim
18 words
The method as claimed in claim 9 and wherein the electronic device is a field emission display package.
Claim 13
Dependent Claim
21 words
The method as claimed in claim 10 and wherein the die is a base plate for the field emission display package.
Claim 14
Dependent Claim
23 words
The method as claimed in claim 11 and wherein the die is mounted to a face plate of the field emission display package.
Claim 15
Dependent Claim
28 words
The method as claimed in claim 12 and wherein the metal wire is formed of a metal selected from the Group consisting of aluminum alloys, gold and copper.
Claim 16
Dependent Claim
19 words
The method as claimed in claim 13 and wherein the metal wire is formed of aluminum alloyed with silicon.
Claim 17
Independent Claim
71 words
A method for forming an electrical connection to a semiconductor die, said method comprising: wire bonding a metal wire to a bond pad of the die; severing the metal wire to form a loose lead attached to the bond pad; mounting the die to a first surface of an electronic device; forming an electronic component on a second surface of the device; and bonding the loose lead to the electronic component.
Claim 18
Independent Claim
71 words
A method for forming an electrical connection to a semiconductor die, said method comprising: wire bonding a metal wire to a bond pad of the die; severing the metal wire to form a loose lead attached to the bond pad; mounting the die to a first surface of an electronic device; forming an electronic component on a second surface of the device; and bonding the loose lead to the electronic component.
Claim 19
Dependent Claim
19 words
The method as recited in claim 15 and wherein the first surface is generally orthogonal to the second surface.
Claim 20
Dependent Claim
21 words
The method as recited in claim 15 and wherein the first surface is on a different level than the second surface.
Claim 21
Dependent Claim
27 words
The method as recited in claim 15 and wherein the first surface is in a sealed space and the second surface is outside of the sealed space.
Claim 22
Dependent Claim
25 words
The method as recited in claim 15 and wherein the die includes field emitter sites and the electronic device is a field emission display package.
Claim 23
Dependent Claim
33 words
The method as recited in claim 15 and wherein severing the wire is by providing a forming substrate and tearing the wire at a surface of the forming substrate using a bonding tool.
Claim 24
Dependent Claim
26 words
The method as recited in claim 15 and wherein the loose lead has a length of at least 100 times a diameter of the loose lead.
Claim 25
Dependent Claim
24 words
The method as recited in claim 15 and wherein a plurality of loose leads are formed and then gang bonded to the electronic component.
Claim 26
Dependent Claim
29 words
The method as recited in claim 15 and wherein a plurality of loose leads are formed, assembled on a secondary substrate and then gang bonded to the electronic component.
Claim 27
Independent Claim
63 words
A method for forming a field emission display package comprising: wire bonding a metal wire to a pad of a semiconductor die; severing the metal wire to form a loose lead attached to the pad; assembling the die within the field emission display package; and forming an electrical connection between the loose lead and an electrical component for the field emission display package.
Claim 28
Independent Claim
63 words
A method for forming a field emission display package comprising: wire bonding a metal wire to a pad of a semiconductor die; severing the metal wire to form a loose lead attached to the pad; assembling the die within the field emission display package; and forming an electrical connection between the loose lead and an electrical component for the field emission display package.
Claim 29
Dependent Claim
16 words
The method as claimed in claim 24 and wherein the electrical component is a conductive trace.
Claim 30
Dependent Claim
33 words
The method as claimed in claim 24 and wherein the die is mounted on a first surface and the electrical component is mounted on a second surface generally orthogonal to the first surface.
Claim 31
Dependent Claim
35 words
The method as claimed in claim 24 and wherein the die is mounted on a first surface and the electrical component is mounted on a second surface on a different level than the first surface.
Claim 32
Dependent Claim
27 words
The method as claimed in claim 24 and wherein the die is mounted in a sealed space and the electrical component is outside of the sealed space.
Claim 33
Dependent Claim
28 words
The method as claimed in claim 24 and wherein the loose lead is formed of a material selected from the group consisting of aluminum alloys, copper and gold.
Claim 34
Dependent Claim
25 words
The field emission display as claimed in claim 24 and wherein the die is mounted on a face plate for the field emission display package.
Claim 35
Independent Claim
100 words
A method for forming a field emission display package comprising: wire bonding a metal wire to a bond pad of a semiconductor die; severing the metal wire to form a loose lead attached to the bond pad; forming a first plate and a second plate; mounting the die between the first and second plates; forming a peripheral seal between the first and second plates and over the loose lead to form a sealed space for the die with the loose lead extending from the sealed space; and bonding the loose lead to an electrical component outside of the sealed space.
Claim 36
Independent Claim
100 words
A method for forming a field emission display package comprising: wire bonding a metal wire to a bond pad of a semiconductor die; severing the metal wire to form a loose lead attached to the bond pad; forming a first plate and a second plate; mounting the die between the first and second plates; forming a peripheral seal between the first and second plates and over the loose lead to form a sealed space for the die with the loose lead extending from the sealed space; and bonding the loose lead to an electrical component outside of the sealed space.
Claim 37
Dependent Claim
23 words
The method as claimed in claim 31 and wherein the die includes a field emitter site in electrical communication with the bond pad.
Claim 38
Dependent Claim
14 words
The method as claimed in claim 32 and further comprising evacuating the sealed space.
Claim 39
Dependent Claim
19 words
The method as claimed in claim 33 and further comprising evacuating the sealed space as the seal is formed.
Claim 40
Dependent Claim
25 words
The method as claimed in claim 34 and wherein a plurality of loose leads are formed and bonded to the electrical component by gang bonding.
Claim 41
Dependent Claim
22 words
The method as claimed in claim 35 and wherein the loose leads are assembled on a secondary substrate prior to gang bonding.
Claim 42
Dependent Claim
22 words
The method as claimed in claim 36 and wherein the first plate is a face plate having a display screen formed thereon.
Claim 43
Dependent Claim
19 words
The method as claimed in claim 37 and wherein the die is mounted on spacers to the face plate.
Claim 44
Dependent Claim
26 words
The method as claimed in claim 38 and wherein the seal is formed as glass frit deposited in as a viscous paste in a peripheral pattern.
Claim 45
Dependent Claim
19 words
The method as claimed in claim 39 and wherein the paste is cured to seal around the lose lead.
Claim 46
Dependent Claim
21 words
The method as claimed in claim 31 and further comprising mounting a plurality of dice between the first and second plates.
Claim 47
Dependent Claim
16 words
The method as claimed in claim 41 and wherein the dice are located on a wafer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-09-08 | 2001-03-10 | 2001-09-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-09-08 | 2005-03-10 | 2005-09-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-09-08 | 2009-03-10 | 2009-09-09 | $7700.00 | Window Closed / Lapsed |