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US5664986A Expired / Lapsed US ⏱️ 0.0 years remaining

Apparatus for polishing a dielectric layer formed on a substrate

Assignee: WiniaDaewoo Co Ltd
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Filing: 1995-11-27
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Granted: 1997-09-09
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Expires: 2015-11-27
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Abstract

Abstract An apparatus for polishing a dielectric layer deposited on a top surface of a semiconductor substrate includes a table, a semiconductor substrate, a carrier, a pipe, a nozzle and an actuator assembly provided with a base, a power source, a cavity and a thermally expanding material. The actuator assembly controls the vertical position of the table by supplying a current to the thermally expanding material.

Inventors

  • 👤 Jae-Woo Roh

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 12:54
CPC Classifications
B; B24; B24B; B24B37/00; B24B37/005; B24B37/015; H; H10; H10P; H10P14/00; H10P14/60; B24B47/00; B24B47/20; H10P52/00

Claims Analysis

Total Claims: 15
Claim 1
Independent Claim 174 words
An improved polishing apparatus for polishing a dielectric layer deposited on a top surface of a semiconductor substrate, the apparatus having a base provided with a top and a bottom surfaces, a table placed on the top surface of the base and provided with a top surface made of a porous material capable of absorbing particulate matters and a bottom surface, means for holding the semiconductor substrate, means for delivering an abrasive material to the top surface of the table, means for rotating the holding means to cause a friction between the abrasive material and the dielectric layer, the rotating means being fixed on a predetermined position from the bottom surface of the base, wherein the improvement comprises: thermally expanding means disposed between the top surface of the base and the bottom surface of the table; heat insulating means, encompassing the thermally expanding means, for maintaining the temperature inside the thermally expanding means substantially constant; and means for applying heat to the thermally expanding means to thereby control a vertical position of the table.
Claim 2
Dependent Claim 174 words
An improved polishing apparatus for polishing a dielectric layer deposited on a top surface of a semiconductor substrate, the apparatus having a base provided with a top and a bottom surfaces, a table placed on the top surface of the base and provided with a top surface made of a porous material capable of absorbing particulate matters and a bottom surface, means for holding the semiconductor substrate, means for delivering an abrasive material to the top surface of the table, means for rotating the holding means to cause a friction between the abrasive material and the dielectric layer, the rotating means being fixed on a predetermined position from the bottom surface of the base, wherein the improvement comprises: thermally expanding means disposed between the top surface of the base and the bottom surface of the table; heat insulating means, encompassing the thermally expanding means, for maintaining the temperature inside the thermally expanding means substantially constant; and means for applying heat to the thermally expanding means to thereby control a vertical position of the table.
Claim 3
Dependent Claim 31 words
The apparatus of claim 1, wherein the vertical position of the table is defined by a distance between the bottom surface of the base and the top surface of the table.
Claim 4
Dependent Claim 17 words
The apparatus of claim 1, wherein the heating means includes a power source and a heating coil.
Claim 5
Dependent Claim 19 words
The apparatus of claim 1, wherein the thermally expanding means is made of aluminum oxide(Al 2 O 3 ).
Claim 6
Dependent Claim 14 words
The apparatus of claim 1, wherein the thermally expanding means is made of zirconium(Zr).
Claim 7
Dependent Claim 15 words
The apparatus of claim 1, wherein the thermally expanding means is made of silicon carbide(SiC).
Claim 8
Dependent Claim 16 words
The apparatus of claim 1, wherein the thermally expanding means is made of fused silica glass.
Claim 9
Dependent Claim 104 words
A polishing table for use in a polishing apparatus, comprising: a table having a bottom surface; a base having a bottom surface; thermally expanding means disposed between the base and the bottom surface of the table, for controlling the height of the table, wherein the height is defined by a length between the bottom surface of the base and the top surface of the table; heat insulating means, enclosing the thermally expanding means, for maintaining substantially constant the temperature inside the thermally expanding means; and means for applying a heat to the thermally expanding means to thereby control a vertical position of the table.
Claim 10
Dependent Claim 104 words
A polishing table for use in a polishing apparatus, comprising: a table having a bottom surface; a base having a bottom surface; thermally expanding means disposed between the base and the bottom surface of the table, for controlling the height of the table, wherein the height is defined by a length between the bottom surface of the base and the top surface of the table; heat insulating means, enclosing the thermally expanding means, for maintaining substantially constant the temperature inside the thermally expanding means; and means for applying a heat to the thermally expanding means to thereby control a vertical position of the table.
Claim 11
Dependent Claim 17 words
The apparatus of claim 8, wherein the heating means includes a power source and a heating coil.
Claim 12
Dependent Claim 19 words
The apparatus of claim 8, wherein the thermally expanding means is made of aluminum oxide(Al 2 O 3 ).
Claim 13
Dependent Claim 14 words
The apparatus of claim 8, wherein the thermally expanding means is made of zirconium(Zr).
Claim 14
Dependent Claim 15 words
The apparatus of claim 8, wherein the thermally expanding means is made of silicon carbide(SiC).
Claim 15
Dependent Claim 16 words
The apparatus of claim 8, wherein the thermally expanding means is made of fused silica glass.

References Cited (Backward Citations)

US3948089A Cited
US4045654A Cited
US5113622A Cited
US5127196A Cited
US5476414A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2000-09-08 2001-03-10 2001-09-09 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2004-09-08 2005-03-10 2005-09-09 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2008-09-08 2009-03-10 2009-09-09 $7700.00 Window Closed / Lapsed

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