US5662987A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multilayer printed wiring board and method of making same
Assignee: International Business Machines Corp
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Filing: 1996-02-01
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Granted: 1997-09-02
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Expires: 2016-02-01
Abstract
Abstract A multilayered printed wiring board includes two or more layers each having a via hole therein, these holes aligned vertically above one another to minimize board real estate while assuring an effective circuit path between respective points on the two layers. One or both via holes can be filled with either an electrically conductive material (e.g., copper paste) or a non-conductive material (e.g., resin).
Inventors
- 👤 Shogo Mizumoto
- 👤 Yutaka Tsukada
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:19
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K1/113; H05K3/00; H05K3/40; H05K3/42; H05K3/421; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09509; H05K2201/09563; H05K2201/0959; H05K2201/096; H05K2203/00; H05K2203/02; H05K2203/025; H05K3/0094; H05K3/10; H05K3/108; H05K3/4038; H05K3/4053; H05K3/4069; H05K3/423; H05K3/46; H05K3/4644; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49128; Y10T29/49155; Y10T29/49156; Y10T29/49165; Y10T29/49167; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/24926
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
111 words
A multilayered printed wiring board comprising: a first insulating layer defining a first via hole therein, said first via hole including a first conductive layer thereon and substantially filled with a first quantity of filler material, said first quantity of filler material having a smooth upper surface; and a second insulating layer formed above and in contact with said first insulating layer and having a second via hole located directly above said first via hole and including a second conductive layer thereon and a second quantity of filler material therein, said second conductive layer being positioned on said smooth upper surface of said first filler material in said first via hole.
Claim 2
Dependent Claim
111 words
A multilayered printed wiring board comprising: a first insulating layer defining a first via hole therein, said first via hole including a first conductive layer thereon and substantially filled with a first quantity of filler material, said first quantity of filler material having a smooth upper surface; and a second insulating layer formed above and in contact with said first insulating layer and having a second via hole located directly above said first via hole and including a second conductive layer thereon and a second quantity of filler material therein, said second conductive layer being positioned on said smooth upper surface of said first filler material in said first via hole.
Claim 3
Dependent Claim
23 words
The multilayered printed wiring board of claim 1 wherein said first quantity of filler material within said first via hole is electrically conductive.
Claim 4
Dependent Claim
18 words
The multilayered printed wiring board of claim 2 wherein said first filler material is comprised of metal material.
Claim 5
Dependent Claim
17 words
The multilayered printed wiring board of claim 3 wherein said first filler material is comprised of copper.
Claim 6
Dependent Claim
18 words
The multilayered printed wiring board of claim 2 wherein said first filler material is comprised of metal paste.
Claim 7
Dependent Claim
114 words
A multilayered primed wiring board comprising: a first insulating layer defining a first via hole therein including a first conductive layer thereon and a first quantity of filler material, said first quantity of filler material having a smooth upper surface; a second conductive layer positioned on said smooth upper surface of said first quantity of filler material; and a second insulating layer defining a second via hole therein located directly above said first via hole and including a third conductive layer thereon and a second quantity of filler material therein, said third conductive layer being positioned on said second conductive layer positioned on said smooth upper surface of said first quantity of filler material.
Claim 8
Dependent Claim
114 words
A multilayered primed wiring board comprising: a first insulating layer defining a first via hole therein including a first conductive layer thereon and a first quantity of filler material, said first quantity of filler material having a smooth upper surface; a second conductive layer positioned on said smooth upper surface of said first quantity of filler material; and a second insulating layer defining a second via hole therein located directly above said first via hole and including a third conductive layer thereon and a second quantity of filler material therein, said third conductive layer being positioned on said second conductive layer positioned on said smooth upper surface of said first quantity of filler material.
Claim 9
Dependent Claim
23 words
The multilayered printed wiring board of claim 6 wherein said first quantity of filler material within said first via hole is electrically insulative.
Claim 10
Dependent Claim
19 words
The multilayered printed wiring board of claim 7 wherein said first quantity of insulative material is comprised of resin.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-09-01 | 2001-03-03 | 2001-09-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-09-01 | 2005-03-03 | 2005-09-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-09-01 | 2009-03-03 | 2009-09-02 | $7700.00 | Window Closed / Lapsed |