Patent US5661647A successfully refreshed from Google Patents.
US5661647A
Expired / Lapsed
US
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Low temperature co-fired ceramic UHF/VHF power converters
Assignee: Raytheon Co
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Filing: 1995-06-07
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Granted: 1997-08-26
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Expires: 2015-06-07
Abstract
Abstract Electronic VHF/UHF power conversion circuitry is manufactured using the benefits of low temperature co-fired ceramic substrates to provide interconnection between the discrete components of the power conversion circuit, and integrate various non-semiconductor devices into the body of the low temperature co-fired ceramic structure, such as resistors, capacitors, inductors and transformers. Use of a low temperature co-fired ceramic structure as a substrate on and within which VHF/UHF power conversion circuitry is formed allows selection of various conductive and resistive inks to precisely form interconnection circuitry and selected non-semiconductor components which improves the stability and reduces the cost of VHF/UHF power conversion circuits.
Inventors
- 👤 Robert D. Washburn
- 👤 Robert F. McClanahan
- 👤 Andrew A. Shapiro
- 👤 Ramona G. Pond
- 👤 Gerald P. Chernicky
- 👤 William J. Council
- 👤 Earl H. Martin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 18:34
CPC Classifications
H; H03; H03F; H03F3/00; H03F3/189; H03F3/19; H02; H02M; H02M3/00; H02M3/003; H05; H05K; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K1/0204; H05K1/0206; H05K1/16; H05K1/0296; H05K1/0298; H05K1/03; H05K1/0306; H05K1/162; H05K1/165; H05K1/18; H05K1/182; H05K1/183; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/09; H05K2201/09009; H05K2201/09054; H05K3/00; H05K3/0058; H05K3/0061; H05K3/40; H05K3/4038; H05K3/4053; Y; Y10; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24926
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
84 words
A VHF/UHF electronic power converter circuit formed within a low temperature co-fired ceramic substrate comprising: (1) a low temperature co-fired ceramic substrate; and (2) a VHF/UHF electronic power converter circuit, a selected plurality of the passive components thereof buried within said low-temperature co-fired ceramic substrate, the buried components comprising at least one buried capacitor and at least one buried inductor, and wherein said buried components are defined by conductive traces formed within said substrate whose dimensions determine respective component values of said buried components.
Claim 2
Dependent Claim
84 words
A VHF/UHF electronic power converter circuit formed within a low temperature co-fired ceramic substrate comprising: (1) a low temperature co-fired ceramic substrate; and (2) a VHF/UHF electronic power converter circuit, a selected plurality of the passive components thereof buried within said low-temperature co-fired ceramic substrate, the buried components comprising at least one buried capacitor and at least one buried inductor, and wherein said buried components are defined by conductive traces formed within said substrate whose dimensions determine respective component values of said buried components.
Claim 3
Dependent Claim
35 words
The converter circuit of claim 1, further comprising at least one conductive layer located on or within the low temperature co-fired ceramic substrate, which electrically connects the circuitry of the VHF/UHF electronic power converter circuit.
Claim 4
Dependent Claim
29 words
The converter circuit of claim 2, further comprising a plurality of conductive pads for electronically connecting the components of the VHF/UHF electronic power converter circuit to said conductive layer.
Claim 5
Dependent Claim
20 words
The converter circuit of claim 3, further comprising at least one cavity formed within said low temperature co-fired ceramic substrate.
Claim 6
Dependent Claim
22 words
The converter circuit of claim 4, and further comprising at least one thermal via formed within said low temperature co-fired ceramic substrate.
Claim 7
Dependent Claim
21 words
The converter circuit of claim 3, further comprising at least one discrete component mounted on said low temperature co-fired ceramic substrate.
Claim 8
Dependent Claim
19 words
The converter circuit of claim 1, in which the buried passive components further include at least one buried resistor.
Claim 9
Dependent Claim
19 words
The converter circuit of claim 1, in which the buried passive components further include at least one buried transformer.
Claim 10
Dependent Claim
27 words
The converter circuit of claim 1, in which all of the passive components comprising a power oscillator, except a load, are buried within said co-fired ceramic structure.
Claim 11
Dependent Claim
50 words
The converter circuit of claim 1, including a tuned based power oscillator having an operating frequency of 100 mhz, ±3 mhz and an output power of between 3 and 11 watts, with all of the oscillator components, except a single RF power transistor, being an integral part of the substrate.
Claim 12
Dependent Claim
27 words
The converter circuit of claim 1, in which all passive components needed to form an RF amplifier, except the load, are buried within said co-fired ceramic structure.
Claim 13
Dependent Claim
24 words
The power conversion system of claim 11, wherein said low temperature co-fired ceramic structure comprises additionally: transformer means coupled to said second filter network.
Claim 14
Dependent Claim
150 words
A VHF/UHF power conversion system incorporating a low temperature co-fired ceramic structure containing first and second filter networks, comprising: a low temperature co-fired ceramic structure containing a plurality of buried capacitor, buried inductor and buried resistor elements, wherein said buried elements are defined by conductive traces formed within said substrate whose dimensions determine respective component values of said buried components, the structure comprising: a plurality of capacitors, inductors and resistors configured to form a first filter network and a plurality of capacitors, inductors and resistors configured to form a second filter network; and an active circuit amplifier means mounted on the external surface of said co-fired ceramic structure, the input to said amplifier means being supplied by the output of said first filter network, the input of said first filter network being supplied by external means, said output of said amplifier means driving the input of said second filter network.
Claim 15
Dependent Claim
150 words
A VHF/UHF power conversion system incorporating a low temperature co-fired ceramic structure containing first and second filter networks, comprising: a low temperature co-fired ceramic structure containing a plurality of buried capacitor, buried inductor and buried resistor elements, wherein said buried elements are defined by conductive traces formed within said substrate whose dimensions determine respective component values of said buried components, the structure comprising: a plurality of capacitors, inductors and resistors configured to form a first filter network and a plurality of capacitors, inductors and resistors configured to form a second filter network; and an active circuit amplifier means mounted on the external surface of said co-fired ceramic structure, the input to said amplifier means being supplied by the output of said first filter network, the input of said first filter network being supplied by external means, said output of said amplifier means driving the input of said second filter network.
Claim 16
Dependent Claim
24 words
The power conversion system of claim 13, wherein said low temperature co-fired ceramic structure comprises additionally: transformer means coupled to said first filter network.
Claim 17
Dependent Claim
20 words
The power conversion system of claim 13, wherein said transformer means is buried within said low temperature co-fired ceramic structure.
Claim 18
Dependent Claim
16 words
The power conversion system of claim 15, wherein said transformer means is buried within said structure.
Claim 19
Dependent Claim
148 words
In a VHF/UHF power conversion system, a low temperature co-fired ceramic structure containing buried passive circuitry: said passive circuitry including at least one component selected from the class consisting of resistors, capacitors, inductors and transformers, the buried components comprising at least one buried capacitor and at least one buried inductor, and wherein said buried capacitor and inductor components are defined by conductive traces formed within said substrate whose dimensions determine respective component values of said buried components; said buried passive components being surrounded on all sides by non-conductive ceramic material; said buried passive components being interconnected with other buried components by way of at least one interconnection means selected from the class consisting of vias and conductive structures; said buried passive components being connected to other components which are not buried through interconnection contact pads which are located on a surface of said low temperature co-fired ceramic structure.
Claim 20
Dependent Claim
148 words
In a VHF/UHF power conversion system, a low temperature co-fired ceramic structure containing buried passive circuitry: said passive circuitry including at least one component selected from the class consisting of resistors, capacitors, inductors and transformers, the buried components comprising at least one buried capacitor and at least one buried inductor, and wherein said buried capacitor and inductor components are defined by conductive traces formed within said substrate whose dimensions determine respective component values of said buried components; said buried passive components being surrounded on all sides by non-conductive ceramic material; said buried passive components being interconnected with other buried components by way of at least one interconnection means selected from the class consisting of vias and conductive structures; said buried passive components being connected to other components which are not buried through interconnection contact pads which are located on a surface of said low temperature co-fired ceramic structure.
Claim 21
Dependent Claim
163 words
A VHF/UHF power conversion system, selected from the class consisting of AC-AC, AC-DC and DC-DC power conversion systems, and comprising a low temperature co-fired ceramic structure containing buried passive circuitry: said passive circuitry including at least one component selected from the class consisting of resistors, capacitors, inductors and transformer, the buried components comprising at least one buried capacitor and at least one buried inductor, and wherein said buried capacitor and inductor components are defined by conductive traces formed within said substrate whose dimensions determine respective component values of said buried components; said buried passive components being surrounded on all sides by non-conductive ceramic material; said buried passive components being interconnected with other buried passive components by way of at least one interconnection means selected from the class consisting of vias and conductive structures; said buried passive components being connected to other components which are not buried through interconnection contact pads which are located on a surface of said low temperature co-fired ceramic structure.
Claim 22
Dependent Claim
163 words
A VHF/UHF power conversion system, selected from the class consisting of AC-AC, AC-DC and DC-DC power conversion systems, and comprising a low temperature co-fired ceramic structure containing buried passive circuitry: said passive circuitry including at least one component selected from the class consisting of resistors, capacitors, inductors and transformer, the buried components comprising at least one buried capacitor and at least one buried inductor, and wherein said buried capacitor and inductor components are defined by conductive traces formed within said substrate whose dimensions determine respective component values of said buried components; said buried passive components being surrounded on all sides by non-conductive ceramic material; said buried passive components being interconnected with other buried passive components by way of at least one interconnection means selected from the class consisting of vias and conductive structures; said buried passive components being connected to other components which are not buried through interconnection contact pads which are located on a surface of said low temperature co-fired ceramic structure.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-08-25 | 2001-02-24 | 2001-08-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-08-25 | 2005-02-24 | 2005-08-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-08-25 | 2009-02-24 | 2009-08-26 | $7700.00 | Window Closed / Lapsed |