US5660738A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Direct etch processes for the manufacture of high density modules
Assignee: LITEL INTERCONNECT Inc
•
Filing: 1996-03-11
•
Granted: 1997-08-26
•
Expires: 2016-03-11
Abstract
Abstract The process of the manufacture of both the conductive layers and dielectric layers of multichip modules of the deposited variety is set forth with direct etch techniques being substituted for photolithography. Simply stated, entire circuit layers of the modules are directly etched or patterned with the circuit configuration required. Three processes are disclosed for processing the individual layers including subtractive patterning of a metallic conductor layer and direct patterning of the dielectric layer; direct etch metal processing (DEMI) involving direct removal of the metal layer with subsequent direct patterning of the dielectric layer; and, plating form process involving additive metallization and direct etching of the dielectric layer. By utilizing the disclosed processes alone or in combination, fabrication of multichip modules can occur.
Inventors
- 👤 Robert O. Hunter, Jr.
- 👤 Adlai H. Smith
- 👤 Bruce B. McArthur
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 13:18
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H05; H05K; H05K3/00; H05K3/0011; H05K3/0017; H05K3/0026; H05K3/0032; H05K3/0035; H05K3/02; H05K3/06; H05K3/061; H05K3/10; H05K3/108; H05K3/46; H05K3/4644; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K2203/00; H05K2203/05; H05K2203/0548; H05K2203/056; H05K2203/0562; H05K2203/0571; H05K3/0073; H05K3/0082; H05K3/22; H05K3/24; H05K3/244
Claims Analysis
Total Claims: 62
Claim 1
Independent Claim
112 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern comprising the steps of: providing a substrate; coating the substrate with metal; coating metal with etch block; directly patterning utilizing light ablation said etch block to expose said metal in a pattern for removal with remaining etch block overlying metallic traces in the required circuit pattern; etching the exposed metal to leave etch block overlying metallic traces in the required circuit pattern; stripping the remaining etch block overlying the blocked metal traces of the required circuit pattern; coating the patterned metal with dielectric material; and, patterning the dielectric material for forming vertical interconnects.
Claim 2
Dependent Claim
112 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern comprising the steps of: providing a substrate; coating the substrate with metal; coating metal with etch block; directly patterning utilizing light ablation said etch block to expose said metal in a pattern for removal with remaining etch block overlying metallic traces in the required circuit pattern; etching the exposed metal to leave etch block overlying metallic traces in the required circuit pattern; stripping the remaining etch block overlying the blocked metal traces of the required circuit pattern; coating the patterned metal with dielectric material; and, patterning the dielectric material for forming vertical interconnects.
Claim 3
Dependent Claim
43 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 1, wherein said substrate is selected from the group consisting of glass, ceramic, alumina, silicon, glass-ceramic, and copper with dielectric coating.
Claim 4
Dependent Claim
42 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 1 and further comprising the steps of: providing said substrate with metal and etch block layers already disposed on it.
Claim 5
Dependent Claim
51 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 1 and further comprising the steps of: providing said substrate with circuit components selected from the group consisting of active MOS capacitors, passive MOS capacitors, resistors, diodes, and transistors.
Claim 6
Dependent Claim
38 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 1, wherein said metal is selected from the group consisting of copper, aluminum, copper/aluminum, and gold.
Claim 7
Dependent Claim
51 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 1 and further comprising the steps of: coating the substrate with metal includes coating said metal sufficiently thick to be capable of withstanding the patterning utilized during etch block.
Claim 8
Dependent Claim
41 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 1, wherein said metal is applied using a process selected from the group consisting of sputter coating and plating.
Claim 9
Dependent Claim
46 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 1, wherein said etch block is selected from the group consisting of screen ink, shellac, polyvinylidene chloride, photoresist, polyimide, photoimageable polyimide, benzocyclobutene, and polyphenylquinoxaline.
Claim 10
Dependent Claim
62 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 1 and further comprising the steps of: said directly patterning utilizing light ablation of said etch block step includes, providing a mask having a pattern for said etch block; and, projecting light through said mask to pattern said etch block.
Claim 11
Dependent Claim
59 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 9, wherein said mask is selected from the group consisting of dielectric coated masks, chrome coated masks, iron oxide coated masks, transparent masks having phase shifting portions, full aperture computer generated. holograms, and subaperture computer generated holograms.
Claim 12
Dependent Claim
79 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 9, wherein said light is projected using a process selected from the group consisting of moving said light in a programmable pattern, addressing a computer generated hologram having subapertures one aperture at a time, addressing a computer generated hologram having subapertures a group of subapertures at a time, raster scanning a laser, and vector scanning a laser.
Claim 13
Dependent Claim
45 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 1, wherein said etching step utilizes a technique selected from the group consisting of a wet etch process and a dry etch process.
Claim 14
Dependent Claim
44 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 1, wherein said remaining etch block is stripped using a technique selected from the group consisting of wet etching and dry etching.
Claim 15
Dependent Claim
50 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 1, wherein said etch block is applied to said metal using a process selected from the group consisting of squeegee application, spin coating, spray coating, and screen application.
Claim 16
Dependent Claim
76 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 1, wherein said directly patterning utilizing light ablation of said dielectric uses a technique selected from the group consisting of a scanning image system, an image system including computer generated hologram, an image system including subaperture computer generated hologram, an image system including a dielectric coated mask, and a step and repeat imaging system.
Claim 17
Dependent Claim
37 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 1, wherein said dielectric material is selected from the group consisting of polyamide and benzocyclobutene.
Claim 18
Dependent Claim
56 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 1 and further comprising the steps of: said patterning of said dielectric includes providing a mask having a pattern for said dielectric material; and, projecting light through said mask to pattern said dielectric material.
Claim 19
Dependent Claim
59 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 17, wherein said mask is selected from the group consisting of dielectric coated masks, chrome coated masks, iron oxide coated masks, transparent masks having phase shifting portions, full aperture computer generated holograms, and subaperture computer generated holograms.
Claim 20
Dependent Claim
79 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 17, wherein said light is projected using a process selected from the group consisting of moving said light in a programmable pattern, addressing a computer generated hologram having subapertures one aperture at a time, addressing a computer generated hologram having subapertures a group of subapertures at a time, raster scanning a laser, and vector scanning a laser.
Claim 21
Dependent Claim
66 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern comprising the steps of: providing a substrate; coating the substrate with continuous blanket metal layer; directly patterning utilizing light ablation said metal layer to ablate said metal in a circuit pattern; coating the patterned metal with dielectric material; and patterning the dielectric material for forming vertical interconnects.
Claim 22
Dependent Claim
66 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern comprising the steps of: providing a substrate; coating the substrate with continuous blanket metal layer; directly patterning utilizing light ablation said metal layer to ablate said metal in a circuit pattern; coating the patterned metal with dielectric material; and patterning the dielectric material for forming vertical interconnects.
Claim 23
Dependent Claim
43 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 20, wherein said substrate is selected from the group consisting of glass, ceramic, alumina, silicon, glass-ceramic, and copper with dielectric coating.
Claim 24
Dependent Claim
40 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 20 and further comprising the steps of: providing said substrate with said metal layer already disposed on it.
Claim 25
Dependent Claim
51 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 20 and further comprising the steps of: providing said substrate with circuit components selected from the group consisting of active MOS capacitors, passive MOS capacitors, resistors, diodes, and transistors.
Claim 26
Dependent Claim
38 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 20, wherein said metal is selected from the group consisting of copper, aluminum, copper/aluminum, and gold.
Claim 27
Dependent Claim
41 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 20, wherein said metal is applied using a process selected from the group consisting of sputter coating and plating.
Claim 28
Dependent Claim
65 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 20, wherein said directly patterning utilizing light ablation of said metal layer uses a technique selected from the group consisting of a scanning image system, computer generated hologram, subaperture computer generated hologram, a dielectric coated mask, and a step and repeat imaging system.
Claim 29
Dependent Claim
37 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 20, wherein said dielectric material is selected from the group consisting of polyamide and benzocyclobutene.
Claim 30
Dependent Claim
56 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 20 and further comprising the steps of: said patterning of said dielectric includes providing a mask having a pattern for said dielectric material; and, projecting light through said mask to pattern said dielectric material.
Claim 31
Dependent Claim
59 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 28, wherein said mask is selected from the group consisting of dielectric coated masks, chrome coated masks, iron oxide coated masks, transparent masks having phase shifting portions, full aperture computer generated holograms, and subaperture computer generated holograms.
Claim 32
Dependent Claim
79 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 28, wherein said light is projected using a technique selected from the group consisting of moving said light in a programmable pattern, addressing a computer generated hologram having subapertures one aperture at a time, addressing a computer generated hologram having subapertures a group of subapertures at a time, raster scanning a laser, and vector scanning a laser.
Claim 33
Dependent Claim
93 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern comprising the steps of: providing a substrate; coating the substrate with a blanket metal layer; coating the blanket metal layer with a blanket layer plating form; directly patterning utilizing light ablation said blanket layer plating form; plating up the exposed parts of the blanket metal layer; stripping the remaining plating form; etching back the plated up metal layer; coating the patterned metal with dielectric material; and, patterning the dielectric material for forming vertical interconnects.
Claim 34
Dependent Claim
93 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern comprising the steps of: providing a substrate; coating the substrate with a blanket metal layer; coating the blanket metal layer with a blanket layer plating form; directly patterning utilizing light ablation said blanket layer plating form; plating up the exposed parts of the blanket metal layer; stripping the remaining plating form; etching back the plated up metal layer; coating the patterned metal with dielectric material; and, patterning the dielectric material for forming vertical interconnects.
Claim 35
Dependent Claim
43 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 31, wherein said substrate is selected from the group consisting of glass, ceramic, alumina, silicon, glass-ceramic, and copper with dielectric coating.
Claim 36
Dependent Claim
42 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 31 and further comprising the steps of: providing said substrate with metal and plating form layers already disposed on it.
Claim 37
Dependent Claim
51 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 31 and further comprising the steps of: providing said substrate with circuit components selected from the group consisting of active MOS capacitors, passive MOS capacitors, resistors, diodes, and transistors.
Claim 38
Dependent Claim
38 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 31, wherein said metal is selected from the group consisting of copper, aluminum, copper/aluminum, and gold.
Claim 39
Dependent Claim
39 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 31, wherein said plating form is selected from the group consisting of photoresist, photoimageable polyimide, and ink.
Claim 40
Dependent Claim
43 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 31, wherein said plating form is applied using a technique selected from the group consisting of spin coating and spray coating.
Claim 41
Dependent Claim
62 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 31 and further comprising the steps of: said directly patterning utilizing light ablation of said blanket layer step includes, providing a mask having a pattern for said etch block; and, projecting light through said mask to pattern said etch block.
Claim 42
Dependent Claim
59 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 38, wherein said mask is selected from the group consisting of dielectric coated masks, chrome coated masks, iron oxide coated masks, transparent masks having phase shifting portions, full aperture computer generated holograms, and subaperture computer generated holograms.
Claim 43
Dependent Claim
76 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 38, wherein said projecting step is selected from the group consisting of moving said light in a programmable pattern, addressing a computer generated hologram having subapertures one aperture at a time, addressing a computer generated hologram having subapertures a group of subapertures at a time, raster scanning a laser, and vector scanning a laser.
Claim 44
Dependent Claim
42 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 31, wherein said plating up step utilizes a technique selected from the group consisting of electroless plating and electrolytic plating.
Claim 45
Dependent Claim
45 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 31, wherein said stripping step utilizes a technique selected from the group consisting of a wet chemical process and a dry chemical process.
Claim 46
Dependent Claim
45 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 31, wherein said etching step utilizes a technique selected from the group consisting of a dry etch process and a wet etch process.
Claim 47
Dependent Claim
37 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 31, wherein said dielectric material is selected from the group consisting of polyamide and benzocyclobutene.
Claim 48
Dependent Claim
56 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 44 and further comprising the steps of: said patterning of said dielectric includes providing a mask having a pattern for said dielectric material; and, projecting light through said mask to pattern said dielectric material.
Claim 49
Dependent Claim
59 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 45, wherein said mask is selected from the group consisting of dielectric coated masks, chrome coated masks, iron oxide coated masks, transparent masks having phase shifting portions, full aperture computer generated holograms, and subaperture computer generated holograms.
Claim 50
Dependent Claim
79 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 45, wherein said light is projected using a process selected from the group consisting of moving said light in a programmable pattern, addressing a computer generated hologram having subapertures one aperture at a time, addressing a computer generated hologram having subapertures a group of subapertures at a time, raster scanning a laser, and vector scanning a laser.
Claim 51
Dependent Claim
97 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern comprising the steps of: providing a substrate; coating the substrate with metal; coating metal with etch block; directly patterning utilizing light ablation said etch block to expose said metal in a pattern for removal with remaining etch block overlying metallic traces in the required circuit pattern; etching the exposed metal to leave etch block overlying metallic traces in the required circuit pattern; and stripping the remaining etch block overlying the blocked metal traces of the required circuit pattern.
Claim 52
Dependent Claim
97 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern comprising the steps of: providing a substrate; coating the substrate with metal; coating metal with etch block; directly patterning utilizing light ablation said etch block to expose said metal in a pattern for removal with remaining etch block overlying metallic traces in the required circuit pattern; etching the exposed metal to leave etch block overlying metallic traces in the required circuit pattern; and stripping the remaining etch block overlying the blocked metal traces of the required circuit pattern.
Claim 53
Dependent Claim
50 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern comprising the steps of: providing a substrate; coating the substrate with a metal layer; and directly patterning utilizing light ablation said metal layer to ablate said metal in a circuit pattern.
Claim 54
Dependent Claim
50 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern comprising the steps of: providing a substrate; coating the substrate with a metal layer; and directly patterning utilizing light ablation said metal layer to ablate said metal in a circuit pattern.
Claim 55
Dependent Claim
75 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern comprising the steps of: providing a substrate; coating the substrate with a metal layer; coating said metal layer with a blanket layer plating form; directly patterning utilizing light ablation said blanket layer plating form; plating up the exposed parts of the metal layer; stripping the remaining plating form; and etching back the plated up metal layer.
Claim 56
Dependent Claim
75 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern comprising the steps of: providing a substrate; coating the substrate with a metal layer; coating said metal layer with a blanket layer plating form; directly patterning utilizing light ablation said blanket layer plating form; plating up the exposed parts of the metal layer; stripping the remaining plating form; and etching back the plated up metal layer.
Claim 57
Dependent Claim
38 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 1 and wherein the module is chosen from the class including flat panel displays and microchips.
Claim 58
Dependent Claim
38 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 20 and wherein the module is chosen from the class including flat panel displays and microchips.
Claim 59
Dependent Claim
38 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 31 and wherein the module is chosen from the class including flat panel displays and microchips.
Claim 60
Dependent Claim
37 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit according to claim 48 and wherein the module is chosen from the class including flat panel displays and microchips.
Claim 61
Dependent Claim
38 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 49 and wherein the module is chosen from the class including flat panel displays and microchips.
Claim 62
Dependent Claim
38 words
A process for the manufacture of modules of the deposited variety having metallic traces in a required circuit pattern according to claim 50 and wherein the module is chosen from the class including flat panel displays and microchips.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-08-25 | 2001-02-24 | 2001-08-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-08-25 | 2005-02-24 | 2005-08-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-08-25 | 2009-02-24 | 2009-08-26 | $7700.00 | Window Closed / Lapsed |