Selective etch process

Claim 2

An etch process which forms substantially anisotropic sidewalls and which has a high selectivity to oxide and photoresist, the etch process comprising: (a) preparing a pattered film to be etched on an in-process integrated semiconductor circuit; and (b) exposing the film to ionized hydrogen monoiodide (HI), the film being selected from the group consisting of single crystal silicon, polysilicon, silicon nitride, and refractory metal silicide, whereby a geometric feature is formed in the film, the geometric feature defining an anisotropic sidewall.

Claim 3

An etch process as recited in claim 1, wherein the patterned film is exposed to an iodide containing compound in combination with a fluorine-containing compound.

Claim 4

An etch process as recited in claim 1, wherein the patterned film is exposed to an iodide containing compound in combination with a chlorine-containing compound.

Claim 5

An etch process as recited in claim 1, wherein the patterned film is exposed to an iodide containing compound in combination with a bromine containing compound.

Claim 6

An etch process as recited in claim 1, wherein the patterned film is exposed to an iodide containing compound in combination with at least one of the group comprising fluorine, chlorine, and bromine.

Claim 7

An etch process as recited in claim 1, wherein the etch process deposits a passivation layer on the sidewall, the passivation layer comprising a polymer containing silicon iodide, and wherein the passivation layer prevents the etch process from substantially etching into the sidewall.

Claim 8

An etch process as recited in claim 1, wherein the patterned film is covered with a photoresist layer, the photoresist layer being patterned such that sidewalls are defined in the photoresist layer, and wherein the etch process does not substantially etch into the sidewalls of the photoresist layer.

Claim 9

An etch process as recited in claim 1, further comprising the step of conducting a primary etch prior to exposing the patterned film to ionized an iodide containing compound, the primary etch comprising exposing the patterned film to an ionized etchant having a high etch rate, and wherein the step of exposing the patterned film to an ionized iodide containing compound further comprises a secondary etch of exposing the patterned film to a compound containing an iodide containing compound, the compound containing an iodide containing compound providing a substantially slower etch rate than the high etch rate of the ionized etchant of the primary etch.

Claim 10

An etch process as recited in claim 8, wherein the primary etch is conducted with an etchant comprising a chlorine-containing compound.

Claim 11

An etch as recited in claim 8, wherein the compound of the secondary etch comprises SF 6 and an iodide containng compound.

Claim 12

An etch process as recited in claim 1, further comprising a pad oxide underlying the patterned film to be etched and wherein the etch step etches up to and not into the pad oxide so as to selectively stop on the pad oxide.

Claim 13

An etch process which forms substantially anisotropic sidewalls and which has a high selectivity to oxide and photoresist, the etch process comprising: (a) preparing a patterned film to be etched on a silicon substrate of an in-process integrated semiconductor circuit; (b) conducting a primary etch by exposing the patterned film to an ionized etchant having a high etch rate; and (c) conducting a secondary etch by exposing the patterned film to a compound containing ionized hydrogen monoiodide (HI), the secondary etch having a substantially slower etch rate than the primary etch, and the patterned film being selected from the group consisting of single crystal silicon, polysilicon, silicon nitride, and refractory metal silicide, whereby a geometric feature is formed in the patterned film as a result of the primary and secondary etch steps, the geometric feature defining a sidewall.

Claim 14

An etch process which forms substantially anisotropic sidewalls and which has a high selectivity to oxide and photoresist, the etch process comprising: (a) preparing a patterned film to be etched on a silicon substrate of an in-process integrated semiconductor circuit; (b) conducting a primary etch by exposing the patterned film to an ionized etchant having a high etch rate; and (c) conducting a secondary etch by exposing the patterned film to a compound containing ionized hydrogen monoiodide (HI), the secondary etch having a substantially slower etch rate than the primary etch, and the patterned film being selected from the group consisting of single crystal silicon, polysilicon, silicon nitride, and refractory metal silicide, whereby a geometric feature is formed in the patterned film as a result of the primary and secondary etch steps, the geometric feature defining a sidewall.

Claim 15

An etch process as recited in claim 12, wherein the secondary etch deposits a passivation layer on the sidewall, the passivation layer comprising a polymer containing silicon iodide, containing polymer, and wherein the passivation layer prevents etching into the sidewall.

Claim 16

An etch process as recited in claim 13, wherein the patterned film is covered with a photoresist layer, the photoresist layer being patterned such that sidewalls are defined in the photoresist layer, and wherein the etch process does not substantially etch into the sidewalls of the photoresist layer.

Claim 17

An etch process as recited in claim 14, wherein the ionized etchant used in the primary etch step comprises Cl 2 and NF 3 .

Claim 18

An etch process as recited in claim 15, wherein the compound of the secondary etch comprises ionized NF 3 and an iodide containng compound.

Claim 19

An etch process as recited in claim 15, wherein the patterned film overlies a pad oxide, and wherein the etch is selective to the pad oxide such that the secondary etch does not etch into the pad oxide so as to be selective to the pad oxide.

Claim 20

An etch process as recited in claim 17, wherein the patterned film being etched by the primary and secondary etch steps comprises polysilicon.

Claim 21

An etch process as recited in claim 18, wherein the primary and secondary etch steps are conducted by ionizing the etchants thereof in a reactive ion etcher.

Claim 22

An etch process which forms substantially anisotropic sidewalls of an in-process semiconductor circuit, the etch process having highly selectivity to oxide and to photoresist, the etch process comprising the steps of: (a) preparing a patterned polysilicon film to be etched on an in-process integrated semiconductor circuit; (b) conducting a primary etch in a reactive ion etcher by exposing the patterned polysilicon film to an ionized etchant comprising Cl 2 and NF 3 ; and (c) conducting a secondary etch in the reactive ion etcher by exposing the patterned polysilicon film to an ionized etchant comprising NF 3 and an iodide containng compound, the secondary etch having a substantially slower etch rate than the primary etch, with the patterned polysilicon film being disposed over a pad oxide, and the secondary etch being selective to the pad oxide such that the etch stops on and does not etch into the pad oxide, and wherein a geometric feature is formed by the etch process, the geometric feature defining a sidewall, the etch process depositing a passivation layer on the sidewall, the passivation layer comprising silicon iodide, and the passivation layer preventing the secondary etch from substantially etching into the sidewall, and wherein the patterned polysilicon film is covered with a photoresist layer, the photoresist layer being patterned such that sidewalls are defined in the photoresist layer, and wherein the etch process does not substantially etch into the sidewalls of the photoresist layer.

Claim 23

An etch process which forms substantially anisotropic sidewalls of an in-process semiconductor circuit, the etch process having highly selectivity to oxide and to photoresist, the etch process comprising the steps of: (a) preparing a patterned polysilicon film to be etched on an in-process integrated semiconductor circuit; (b) conducting a primary etch in a reactive ion etcher by exposing the patterned polysilicon film to an ionized etchant comprising Cl 2 and NF 3 ; and (c) conducting a secondary etch in the reactive ion etcher by exposing the patterned polysilicon film to an ionized etchant comprising NF 3 and an iodide containng compound, the secondary etch having a substantially slower etch rate than the primary etch, with the patterned polysilicon film being disposed over a pad oxide, and the secondary etch being selective to the pad oxide such that the etch stops on and does not etch into the pad oxide, and wherein a geometric feature is formed by the etch process, the geometric feature defining a sidewall, the etch process depositing a passivation layer on the sidewall, the passivation layer comprising silicon iodide, and the passivation layer preventing the secondary etch from substantially etching into the sidewall, and wherein the patterned polysilicon film is covered with a photoresist layer, the photoresist layer being patterned such that sidewalls are defined in the photoresist layer, and wherein the etch process does not substantially etch into the sidewalls of the photoresist layer.