Coupled, flux transformer heat pipes

Claim 2

A heat pipe including: a heat input end including an evaporator, a hollow adiabatic section, and an output end including a condenser, said evaporator and said condenser being joined by said hollow adiabatic section containing a wicking material and a coolant, said heat pipe having a larger inner cross-sectional area at said condenser than at said evaporator, said heat pipe including a plurality of individual, flexible heat pipe stages connected in cascade with the condenser of the preceding stage secured directly by a joint to the corresponding evaporator of a succeeding stage leading from a proximal input end of a first one of said stages to a distal, output end of a last one of said stages, with the condenser of the preceding stage integral with the evaporator of the succeed stage, and each of said stages having a larger inner cross-sectional area at the condenser thereof than at the evaporator thereof.

Claim 3

A device in accordance with claim 1 wherein said heat pipe stages have said condenser of one of said heat pipe stages and said corresponding evaporator of a succeeding one of said heat pipe stages screwed together.

Claim 4

A device in accordance with claim 1 wherein said stages of heat pipes are interconnected to form an integral part of a unitary heat pipe for maximum heat transfer.

Claim 5

A device in accordance with claim 1 wherein said individual heat pipe stages are interconnected by sleeves of variable lengths screwed one into the other.

Claim 6

A device in accordance with claim 1 wherein said heat pipe stages are composed of flexible material.

Claim 7

A device in accordance with claim 1 wherein each of said heat pipe stages is composed of flexible material and said heat pipe is connected at said distal, output end to a heat dissipating member.

Claim 8

A device in accordance with claim 3 wherein said heat pipe is composed of flexible material, and said heat pipe is connected at said distal, output end to a heat dissipating member.

Claim 9

A device in accordance with claim 4 wherein said heat pipe stages are composed of flexible material, and the condenser at the distal output end of said pipe is connected to a heat dissipating member.

Claim 10

A heat pipe device including: a plurality of heat pipe stages, each of said heat pipe stages including: a heat input end including an evaporator, a hollow adiabatic section, and an output end including a condenser, with said evaporator and said condenser joined by said hollow adiabatic section containing a wicking material and a coolant, said plurality of heat pipe stages being connected in cascade with the condenser of the preceding stage secured integrally and directly by a joint to the corresponding evaporator of the succeeding stage, said joint providing for maximum heat transfer, and each of said stages having a larger inner cross-sectional area at said condenser thereof than at said evaporator thereof, with a first stage of said stages of said heat pipe including at its said evaporator a heat input end for said heat pipe device and the last of said stages of said heat pipe having an output end including the condenser of said last heat pipe stage.

Claim 11

A heat pipe device including: a plurality of heat pipe stages, each of said heat pipe stages including: a heat input end including an evaporator, a hollow adiabatic section, and an output end including a condenser, with said evaporator and said condenser joined by said hollow adiabatic section containing a wicking material and a coolant, said plurality of heat pipe stages being connected in cascade with the condenser of the preceding stage secured integrally and directly by a joint to the corresponding evaporator of the succeeding stage, said joint providing for maximum heat transfer, and each of said stages having a larger inner cross-sectional area at said condenser thereof than at said evaporator thereof, with a first stage of said stages of said heat pipe including at its said evaporator a heat input end for said heat pipe device and the last of said stages of said heat pipe having an output end including the condenser of said last heat pipe stage.

Claim 12

A device in accordance with claim 9 wherein said heat pipe stages are interconnected with said condenser and said corresponding evaporator of said succeeding stage being screwed together.

Claim 13

A device in accordance with claim 9 wherein said heat pipe heat pipes are interconnected to form an integral part of a unitary heat pipe.

Claim 14

A device in accordance with claim 9 wherein individual heat pipes stages are interconnected by sleeves of variable lengths screwed one into the other.

Claim 15

A device in accordance with claim 11 wherein said heat pipe stages have said condenser and said corresponding evaporator screwed together and each of said heat pipes comprises an integral structure including an evaporator, an adiabatic section and a condenser section, and said heat pipe stages vary continuously in cross-sectional area.

Claim 16

A device in accordance with claim 9 wherein said heat pipe stages are composed of flexible material.

Claim 17

A device in accordance with claim 10 wherein said heat pipe stages are composed of flexible material.

Claim 18

A device in accordance with claim 11 wherein said heat pipe stages are composed of flexible material, each of said heat pipes stages comprises an integral structure including an evaporator, an adiabatic section and a condenser section, and said heat pipe stages vary continuously and non-linearly in cross-sectional area.

Claim 19

A semiconductor substrate carrying a plurality of semiconductor chips and a package for cooling said semiconductor chips, said package including cooling apparatus including a heat pipe device with a heat input end including an evaporator, and a hollow adiabatic section, an output end including a condenser, with said evaporator and said condenser joined by said hollow adiabatic section containing a wicking material and a coolant, said heat pipe including a plurality of heat pipe stages connected in cascade with the condenser of the preceding stage secured directly by a joint to the corresponding evaporator of the succeeding stage each of said stages having a larger inner cross-sectional area at said condenser thereof than at said evaporator thereof, said individual heat pipes being interconnected by sleeves of variable lengths screwed one into the other to provide joints, wherein said device is connected to cool chips mounted on a substrate, said substrate being mounted in a box, and said heat pipe is composed of flexible material connected to said box containing said substrate as a heat sink, the evaporator section of one of said heat pipe stages is made out of silicon which is sealed to the proximal end of the heat pipe which in turn is soldered to said chip, said joints providing for maximum heat transfer, whereby said heat pipe and said box comprise an integral cooling structure for said semiconductor chip.

Claim 20

A semiconductor substrate carrying a plurality of semiconductor chips and a package for cooling said semiconductor chips, said package including cooling apparatus including a heat pipe device with a heat input end including an evaporator, and a hollow adiabatic section, an output end including a condenser, with said evaporator and said condenser joined by said hollow adiabatic section containing a wicking material and a coolant, said heat pipe including a plurality of heat pipe stages connected in cascade with the condenser of the preceding stage secured directly by a joint to the corresponding evaporator of the succeeding stage each of said stages having a larger inner cross-sectional area at said condenser thereof than at said evaporator thereof, said individual heat pipes being interconnected by sleeves of variable lengths screwed one into the other to provide joints, wherein said device is connected to cool chips mounted on a substrate, said substrate being mounted in a box, and said heat pipe is composed of flexible material connected to said box containing said substrate as a heat sink, the evaporator section of one of said heat pipe stages is made out of silicon which is sealed to the proximal end of the heat pipe which in turn is soldered to said chip, said joints providing for maximum heat transfer, whereby said heat pipe and said box comprise an integral cooling structure for said semiconductor chip.

Claim 21

A device in accordance with claim 9 wherein said heat pipe stages increase in diameter in steps stage by stage and, the distal, output end of said heat pipe is connected to a heat dissipating member.

Claim 22

A device in accordance with claim 18 wherein said heat pipe stages increase in diameter linearly stage by stage and within a stage, said heat pipe stages connected in cascade being connected to chips by a low temperature solder selected from Woods metal and an alloy selected from the group consisting of the alloys of indium and cadmium.

Claim 23

A device in accordance with claim 1 wherein said heat pipe stages are composed of a material selected from the group consisting of copper, aluminum, steel, polymeric materials, an aromatic polyamide fiber of extremely high tensile strength, polytetrafluoroethylene, nylon, and polyimides.