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Patent US5646829A successfully refreshed from Google Patents.
US5646829A
Expired / Lapsed
US
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Resin sealing type semiconductor device having fixed inner leads
Assignee: Sharp Corp
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Filing: 1995-05-31
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Granted: 1997-07-08
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Expires: 2015-05-31
Abstract
Abstract A resin sealing type semiconductor device is arranged such that respective surfaces of plural semiconductor chips, opposite to a circuit forming side, are fixed to both surfaces of a die pad having a smaller area than an area of one surface of each semiconductor chip and to both surfaces of leading end portions of inner leads using an insulating resin having a higher melting point than a heating temperature in a wire bonding process. According to the described arrangement, the deformation of the die pad and the inner lead by the molding process of the resin can be prevented, thereby reducing the production of inferior semiconductor devices in which metal wires or semiconductor chips protrude.
Inventors
- 👤 Yoshiki Sota
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:38
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/811; H10W72/00; H10W72/071; H10W72/073; H10W72/075; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/753; H10W90/756
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
116 words
A resin sealing type semiconductor device, comprising: a die pad; inner leads; an insulating fixing member for securing leading end portions on a die pad side of the inner leads to said die pad in a flat state and coating both surfaces of said die pad; semiconductor chips directly die-bonded to said fixing member; and bonding wires for electrically connecting said semiconductor chips to said inner leads, wherein the leading end portions of said inner leads are extended so as to be inserted between a bottom surface of said semiconductor chip mounted on one surface of said die pad and a bottom surface of the semiconductor chip mounted on the other surface of said die pad.
Claim 2
Dependent Claim
116 words
A resin sealing type semiconductor device, comprising: a die pad; inner leads; an insulating fixing member for securing leading end portions on a die pad side of the inner leads to said die pad in a flat state and coating both surfaces of said die pad; semiconductor chips directly die-bonded to said fixing member; and bonding wires for electrically connecting said semiconductor chips to said inner leads, wherein the leading end portions of said inner leads are extended so as to be inserted between a bottom surface of said semiconductor chip mounted on one surface of said die pad and a bottom surface of the semiconductor chip mounted on the other surface of said die pad.
Claim 3
Dependent Claim
36 words
The resin sealing type semiconductor device as set forth in claim 1, wherein: said insulating fixing member is made of insulating resin having a higher melting point than a heating temperature in a wire bonding process.
Claim 4
Dependent Claim
20 words
The resin sealing type semiconductor device as set forth in claim 2, wherein: said melting point is above 250° C.
Claim 5
Dependent Claim
20 words
The resin sealing type semiconductor device as set forth in claim 1, wherein: said inner leads are entirely silver plated.
Claim 6
Dependent Claim
40 words
The resin sealing type semiconductor device as set forth in claim 1, wherein: said insulating fixing member is composed of a tape substrate member made of insulating resin, an adhesive agent made of insulating resin being applied to both surfaces.
Claim 7
Dependent Claim
39 words
The resin sealing type semiconductor device as set forth in claim 1, wherein: said insulating fixing member is composed of a tape substrate member made of insulating resin, having an adhesive agent made of insulating resin on one surface.
Claim 8
Dependent Claim
28 words
The resin sealing type semiconductor device as set forth in claim 1, wherein: said insulating fixing member is composed of a tape adhesive agent made of insulating resin.
Claim 9
Dependent Claim
27 words
The resin sealing type semiconductor device as set forth in claim 1, wherein: said insulating fixing member is inserted in a space formed between said inner leads.
Claim 10
Dependent Claim
114 words
A resin sealing type semiconductor device, comprising: inner leads; semiconductor chips; an insulating fixing member for securing leading end portions of said inner leads in a flat state and for forming mounting surfaces for said semiconductor chips; and bonding wires for electrically connecting said semiconductor chips to said inner leads, wherein said semiconductor chips are directly die-bonded to both of the mounting surfaces, and the leading end portions of said inner leads are extended so as to be inserted between a bottom surface of said semiconductor chip mounted on one mounting surface of said fixing member and a bottom surface of the semiconductor chip mounted on the other mounting surface of said fixing member.
Claim 11
Dependent Claim
114 words
A resin sealing type semiconductor device, comprising: inner leads; semiconductor chips; an insulating fixing member for securing leading end portions of said inner leads in a flat state and for forming mounting surfaces for said semiconductor chips; and bonding wires for electrically connecting said semiconductor chips to said inner leads, wherein said semiconductor chips are directly die-bonded to both of the mounting surfaces, and the leading end portions of said inner leads are extended so as to be inserted between a bottom surface of said semiconductor chip mounted on one mounting surface of said fixing member and a bottom surface of the semiconductor chip mounted on the other mounting surface of said fixing member.
Claim 12
Dependent Claim
36 words
The resin sealing type semiconductor device as set forth in claim 9, wherein: said insulating fixing member is made of insulating resin having a higher melting point than a heating temperature in a wire bonding process.
Claim 13
Dependent Claim
20 words
The resin sealing type semiconductor device as set forth in claim 9 wherein said inner leads are entirely silver plated.
Claim 14
Dependent Claim
22 words
The resin sealing type semiconductor device as set forth in claim 9, wherein: said insulating fixing member includes a thermal hardening resin.
Claim 15
Dependent Claim
45 words
The resin sealing type semiconductor device as set forth in claim 9, wherein: said insulating fixing member is made of a thermal plasticizing resin, and the resin placed between said inner leads and the semiconductor chips has a thickness in a range of 20-30 μm.
Claim 16
Dependent Claim
40 words
The resin sealing type semiconductor device as set forth in claim 9, wherein: said insulating fixing member is composed of a tape substrate member made of insulating resin, an adhesive agent made of insulating resin being applied to both surfaces.
Claim 17
Dependent Claim
45 words
The resin sealing type semiconductor device as set forth in claim 9, wherein: said insulating fixing member is composed of a tape substrate member made of insulating resin having an adhesive agent made of insulating resin formed on one surface of said tape substrate member.
Claim 18
Dependent Claim
21 words
The resin sealing type semiconductor device as set forth in claim 15, wherein: said adhesive agent includes a thermal hardening resin.
Claim 19
Dependent Claim
28 words
The resin sealing type semiconductor device as set forth in claim 9, wherein: said insulating fixing member is composed of a tape adhesive agent made of insulating resin.
Claim 20
Dependent Claim
26 words
The resin sealing type semiconductor device as set forth in claim 9, wherein: said insulating fixing member is inserted into a space between said inner leads.
Claim 21
Dependent Claim
32 words
The resin sealing type semiconductor device as set forth in claim 9, having no die pad such that said semiconductor chips are supported by only said inner leads and said fixing member.
References Cited (Backward Citations)
JPS62147360A
Cited
US4908933A
Cited
JPH0258356A
Cited
JPH02105450A
Cited
JPH02302069A
Cited
JPH02304961A
Cited
JPH03120851A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-07-07 | 2001-01-06 | 2001-07-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-07-07 | 2005-01-06 | 2005-07-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-07-07 | 2009-01-06 | 2009-07-08 | $7700.00 | Window Closed / Lapsed |