US5646422A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor integrated circuit device
Assignee: Mitsubishi Electric Corp
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Filing: 1995-08-23
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Granted: 1997-07-08
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Expires: 2015-08-23
Abstract
Abstract A semiconductor integrated circuit device includes an internal function circuit formed on a first rectangular region on a rectangular semiconductor chip for implementing a function specific to the device, and a predetermined function control circuit formed on a second rectangular region for implementing a fixed function irrespective of the function implemented by said internal function circuit. First and second rectangular regions are separate regions. In the hierarchical design of an integrated circuit device, the circuit of the first rectangular region can be used as the structure component of another integrated circuit on another chip. The predetermined function control circuit can be laid out on the second rectangular region of another chip. The predetermined function control circuit is a testing circuit of boundary scan method, including a standardized structure component.
Inventors
- 👤 Takeshi Hashizume
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 15:50
CPC Classifications
G; G01; G01R; G01R31/00; G01R31/28; G01R31/317; G01R31/3181; G01R31/3185; G01R31/318533; G01R31/318536; G01R31/316; H; H10; H10D; H10D89/00; H10D89/10
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
263 words
A semiconductor integrated circuit device formed in a semiconductor chip, comprising; an I/O buffer region formed along the entire periphery of said semiconductor chip to delineate a rectangular chip inner region, said I/O buffer region having input and output buffers formed therein for signal transmission with an external world; inner circuitry region formed in said rectangular chip inner region including inner circuitry having a plurality of first components for implementing a signal processing function; and a single test circuit region formed on said chip inner region and having test circuitry for testing at least the inner circuitry formed in said chip inner region, said test circuitry including a plurality of second components and said test circuit region including no inner circuitry components for implementing the signal processing function, first interconnection lines for interconnecting first selected second components of said test circuitry with first selected first components of said inner circuitry, second interconnection lines for interconnecting second selected second components said test circuitry with the input and output buffers, third interconnection lines for interconnecting second selected first components of said inner circuitry with the input and output buffers, and no interconnection lines for interconnecting any first components of said inner circuitry with each other, wherein said inner circuitry region and said test circuit region each extend along substantially an entire length of one side of said rectangular chip inner region, said inner circuitry region forms a rectangular region sharing one side thereof with said test circuit region, and said test circuit region is placed between said I/O buffer region and said inner circuitry region.
Claim 2
Dependent Claim
263 words
A semiconductor integrated circuit device formed in a semiconductor chip, comprising; an I/O buffer region formed along the entire periphery of said semiconductor chip to delineate a rectangular chip inner region, said I/O buffer region having input and output buffers formed therein for signal transmission with an external world; inner circuitry region formed in said rectangular chip inner region including inner circuitry having a plurality of first components for implementing a signal processing function; and a single test circuit region formed on said chip inner region and having test circuitry for testing at least the inner circuitry formed in said chip inner region, said test circuitry including a plurality of second components and said test circuit region including no inner circuitry components for implementing the signal processing function, first interconnection lines for interconnecting first selected second components of said test circuitry with first selected first components of said inner circuitry, second interconnection lines for interconnecting second selected second components said test circuitry with the input and output buffers, third interconnection lines for interconnecting second selected first components of said inner circuitry with the input and output buffers, and no interconnection lines for interconnecting any first components of said inner circuitry with each other, wherein said inner circuitry region and said test circuit region each extend along substantially an entire length of one side of said rectangular chip inner region, said inner circuitry region forms a rectangular region sharing one side thereof with said test circuit region, and said test circuit region is placed between said I/O buffer region and said inner circuitry region.
Claim 3
Dependent Claim
68 words
A device according to claim 1, wherein the plurality of second components of said test circuitry comprise components for implementing a boundary scan test operation including a TAP controller for directing a test operation, two multiplexers, an instruction register for storing an applied instruction, a decoder for decoding the instruction in the instruction register, and bypass register for by-passing a test data to one of said two multiplexers.
Claim 4
Dependent Claim
255 words
A semiconductor integrated circuit device formed on a semiconductor chip, comprising: an I/O buffer region formed on said semiconductor chip to delineate a rectangular chip inner region and having input and output buffers for communication of signals with an external world; inner circuitry formed on said rectangular chip inner region and including first components to implement a signal processing function; and a test circuit region formed outside said I/O buffer region on said semiconductor chip and having test circuitry for testing at least said inner circuitry formed in said rectangular chip inner region; said test circuit region including second components for implementing the test circuitry, first interconnection lines for interconnection between first selected second components of the test circuitry and first selected first components of said inner circuitry, second interconnection lines for interconnection between second selected second components of the test circuitry and the input and output buffers, and no interconnection lines for interconnecting any first components of said inner circuitry with each other; the first interconnection lines for interconnection between the first selected second components of the test circuitry and the first selected first components of said inner circuitry running through the I/O buffer region, wherein said inner circuitry has said first components distributed over substantially the entire area of said rectangular chip inner region, said test circuit region extends substantially the entire length of one side of said semiconductor chip along said I/O buffer region, and said rectangular chip inner region is separated from said test circuit region by said I/O buffer region.
Claim 5
Dependent Claim
255 words
A semiconductor integrated circuit device formed on a semiconductor chip, comprising: an I/O buffer region formed on said semiconductor chip to delineate a rectangular chip inner region and having input and output buffers for communication of signals with an external world; inner circuitry formed on said rectangular chip inner region and including first components to implement a signal processing function; and a test circuit region formed outside said I/O buffer region on said semiconductor chip and having test circuitry for testing at least said inner circuitry formed in said rectangular chip inner region; said test circuit region including second components for implementing the test circuitry, first interconnection lines for interconnection between first selected second components of the test circuitry and first selected first components of said inner circuitry, second interconnection lines for interconnection between second selected second components of the test circuitry and the input and output buffers, and no interconnection lines for interconnecting any first components of said inner circuitry with each other; the first interconnection lines for interconnection between the first selected second components of the test circuitry and the first selected first components of said inner circuitry running through the I/O buffer region, wherein said inner circuitry has said first components distributed over substantially the entire area of said rectangular chip inner region, said test circuit region extends substantially the entire length of one side of said semiconductor chip along said I/O buffer region, and said rectangular chip inner region is separated from said test circuit region by said I/O buffer region.
Claim 6
Dependent Claim
74 words
A device according to claim 2, wherein the second components of the test circuit include a TAP controller for directing a test operation, two multiplexers, an instruction register for storing an applied instruction, a decoder for decoding the instruction in the instruction register, and bypass register for by-passing a test data to one of said two multiplexers, the TAP controller, two multiplexers, instruction register, decoder, and bypass register implementing a boundary scan test operation.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-07-07 | 2001-01-06 | 2001-07-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-07-07 | 2005-01-06 | 2005-07-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-07-07 | 2009-01-06 | 2009-07-08 | $7700.00 | Window Closed / Lapsed |