Input/output buffer layout having overlapping buffers for reducing die area of pad-limited integrated circuit

Claim 2

A rectangular integrated-circuit chip comprising: a chip core containing core logic; a pad ring having a plurality of partially-overlapping input/output buffer arrays arranged in a pinwheel pattern around said chip core, each of said input/output buffer arrays containing a plurality of buffers each comprising an electronic circuit, said electronic circuit coupling said core logic to a pad located at the periphery of said chip; and a plurality of power rails coupling said plurality of buffers without abutting an adjacent power rail, each of said power rails having a straight section and a corner section, said corner section being located at a corner of said chip, said straight and corner sections of said power rails having substantially the same width.

Claim 3

The rectangular integrated-circuit chip of claim 1 wherein the partially-overlapping input/output buffer arrays are separated by routing channels.

Claim 4

The rectangular integrated-circuit chip of claim 1 wherein the electronic circuit of at least one said buffer of each said input/output buffer array is abridged.

Claim 5

The rectangular integrated-circuit chip of claim 3 further including routing channels between the partially-overlapping input/output buffer arrays.

Claim 6

An integrated-circuit die having a reduced area, comprising: a core containing a core logic and a pad ring including a plurality of input/output buffers forming a plurality of input/output buffer-circuit arrays arranged around said core in a pinwheel pattern, said input/output buffers being electrically coupled to said core logic, each of said input/output buffer-circuit arrays having a plurality of pads located at the periphery of said die, each of said input/output buffer-circuit arrays further comprising at least one first buffer transversely overlapping one said input/output buffer-circuit array adjacent to said at least one first buffer and at least one second buffer with an abridged circuitry, said at least one second buffer longitudinally overlapping another said input/output buffer-circuit array adjacent to said at least one second buffer.

Claim 7

An integrated-circuit die having a reduced area, comprising: a core containing a core logic and a pad ring including a plurality of input/output buffers forming a plurality of input/output buffer-circuit arrays arranged around said core in a pinwheel pattern, said input/output buffers being electrically coupled to said core logic, each of said input/output buffer-circuit arrays having a plurality of pads located at the periphery of said die, each of said input/output buffer-circuit arrays further comprising at least one first buffer transversely overlapping one said input/output buffer-circuit array adjacent to said at least one first buffer and at least one second buffer with an abridged circuitry, said at least one second buffer longitudinally overlapping another said input/output buffer-circuit array adjacent to said at least one second buffer.

Claim 8

The integrated-circuit die of claim 5 wherein said at least one first buffer is coupled to said core logic by electrical wiring.

Claim 9

The integrated-circuit die of claim 6 wherein said electrical wiring is routed through said at least one second buffer.

Claim 10

The integrated-circuit die of claim 6 wherein said electrical wiring is routed through a channel formed between said input/output buffer-circuit array adjacent to each other.

Claim 11

The integrated-circuit die of claim 8 wherein said electrical wiring is also routed through said at least one second buffer.

Claim 12

The integrated-circuit die of claim 5 wherein said integrated-circuit die has a square shape and said plurality of input/output buffer-circuit arrays is four.

Claim 13

The integrated-circuit die of claim 5 wherein said pad ring further includes a plurality of power rails routed around said core, each of said power rails electrically coupling each of said plurality of input/output buffers without abutting an adjacent power rail.

Claim 14

The integrated-circuit die of claim 5 wherein said abridged circuitry comprises electrostatic-discharge-protection circuitry.

Claim 15

The integrated-circuit die of claim 5 wherein said pad ring defines die corners having identical dimensions.

Claim 16

An integrated-circuit package comprising: a rectangular die having a core containing a core logic and a pad ring including a plurality of partially overlapping input/output buffer arrays arranged around said core in a pinwheel pattern around said core, each of said input/output buffer arrays containing a plurality of buffers each comprising an electronic circuit, said electronic circuit coupling said core logic to an input/output pad located at the periphery of said die, each of said input/output buffer-circuit arrays having at least one first buffer transversely overlapping one said input/output buffer-circuit array adjacent to said at least one first buffer and at least one second buffer with an abridged circuitry, said at least one second buffer longitudinally overlapping another said input/output buffer-circuit array adjacent to said at least one second buffer, said pad ring further including a plurality of power rails coupling said plurality of buffers without abutting an adjacent power rail, each of said power rails having a straight section and a corner section, said corner section being located adjacent a corner of said chip, said straight and corner sections of said power rails having substantially the same width; a square lead frame supporting said die, bond wires electrically coupling the input/output pads of said die to said square lead frame; and an encapsulant encasing said die and said lead frame.

Claim 17

An integrated-circuit package comprising: a rectangular die having a core containing a core logic and a pad ring including a plurality of partially overlapping input/output buffer arrays arranged around said core in a pinwheel pattern around said core, each of said input/output buffer arrays containing a plurality of buffers each comprising an electronic circuit, said electronic circuit coupling said core logic to an input/output pad located at the periphery of said die, each of said input/output buffer-circuit arrays having at least one first buffer transversely overlapping one said input/output buffer-circuit array adjacent to said at least one first buffer and at least one second buffer with an abridged circuitry, said at least one second buffer longitudinally overlapping another said input/output buffer-circuit array adjacent to said at least one second buffer, said pad ring further including a plurality of power rails coupling said plurality of buffers without abutting an adjacent power rail, each of said power rails having a straight section and a corner section, said corner section being located adjacent a corner of said chip, said straight and corner sections of said power rails having substantially the same width; a square lead frame supporting said die, bond wires electrically coupling the input/output pads of said die to said square lead frame; and an encapsulant encasing said die and said lead frame.

Claim 18

The integrated-circuit package of claim 14 wherein said die is pad limited.

Claim 19

The integrated-circuit package of claim 14 wherein said integrated-circuit die has a square shape and said plurality of input/output buffer-circuit arrays is four.

Claim 20

The integrated-circuit package of claim 14 wherein said pad ring defines die corners having identical dimensions.

Claim 21

An integrated-circuit chip comprising: a chip core containing a core logic, said core logic comprising a plurality of logic elements that are interconnected to form a circuit; a plurality of input/output pads disposed about the periphery of said chip; a plurality of input/output buffers forming a first input/output buffer-circuit array and a second input/output buffer-circuit array, said input/output buffers disposed between said chip core and said input/output pads to electrically couple said core logic to said input/output pads, said first input/output buffer-circuit array having at least one first buffer transversely overlapping a second buffer of said second input/output buffer-circuit array, said second buffer longitudinally overlapping said at least one first buffer, said second buffer having a first space containing an abridged second buffer circuitry and a second space devoid of said second buffer circuitry; and electrical wiring routed through said second space of said second buffer to electrically couple said at least one first buffer to said core logic.

Claim 22

An integrated-circuit chip comprising: a chip core containing a core logic, said core logic comprising a plurality of logic elements that are interconnected to form a circuit; a plurality of input/output pads disposed about the periphery of said chip; a plurality of input/output buffers forming a first input/output buffer-circuit array and a second input/output buffer-circuit array, said input/output buffers disposed between said chip core and said input/output pads to electrically couple said core logic to said input/output pads, said first input/output buffer-circuit array having at least one first buffer transversely overlapping a second buffer of said second input/output buffer-circuit array, said second buffer longitudinally overlapping said at least one first buffer, said second buffer having a first space containing an abridged second buffer circuitry and a second space devoid of said second buffer circuitry; and electrical wiring routed through said second space of said second buffer to electrically couple said at least one first buffer to said core logic.

Claim 23

The integrated-circuit chip of claim 18 further comprising a routing channel formed between said at least one first buffer and said second buffer.

Claim 24

The integrated-circuit chip of claim 19 wherein said electrical wiring is also routed through said routing channel to electrically couple said at least one first buffer to said core logic.

Claim 25

The integrated-circuit chip of claim 18 wherein said integrated-circuit chip has a rectangular shape.

Claim 26

The integrated-circuit chip of claim 21 further comprising a plurality of power rails coupling said first and second input/output buffer-circuit arrays, each of said power rails having a straight section and a corner section, said corner section being located adjacent a corner of said chip, said straight and corner sections of said power rails having substantially the same width.

Claim 27

The integrated-circuit chip of claim 20 wherein said integrated-circuit chip has a rectangular shape.

Claim 28

The integrated-circuit chip of claim 23 further comprising a plurality power rails coupled to said first and second input/output buffer-circuit arrays, each of said power rails having a straight section and a corner section, said straight and corner sections of said power rails having substantially the same width.

Claim 29

The integrated-circuit die of claim 18 wherein said abridged circuitry comprises electrostatic-discharge-protection circuitry.

Claim 30

An integrated-circuit chip comprising: a chip core containing a core logic, said core logic comprising a plurality of logic elements that are interconnected to form a circuit; a plurality of input/output pads disposed about the periphery of said chip; a plurality of input/output buffers forming a first input/output buffer-circuit array and a second input/output buffer-circuit array, said input/output buffers disposed between said chip core and said input/output pads to electrically couple said core logic to said input/output pads, said first input/output buffer-circuit array having at least one first buffer transversely overlapping a second buffer of said second input/output buffer-circuit array, said second buffer longitudinally overlapping said at least one first buffer; a channel formed between said at least one first buffer and said second buffer; and electrical wiring routed through said channel and said second space of said second buffer to electrically couple said at least one first buffer to said core logic.

Claim 31

An integrated-circuit chip comprising: a chip core containing a core logic, said core logic comprising a plurality of logic elements that are interconnected to form a circuit; a plurality of input/output pads disposed about the periphery of said chip; a plurality of input/output buffers forming a first input/output buffer-circuit array and a second input/output buffer-circuit array, said input/output buffers disposed between said chip core and said input/output pads to electrically couple said core logic to said input/output pads, said first input/output buffer-circuit array having at least one first buffer transversely overlapping a second buffer of said second input/output buffer-circuit array, said second buffer longitudinally overlapping said at least one first buffer; a channel formed between said at least one first buffer and said second buffer; and electrical wiring routed through said channel and said second space of said second buffer to electrically couple said at least one first buffer to said core logic.

Claim 32

The integrated-circuit chip of claim 26 wherein said second buffer has a first space containing an abridged second buffer circuitry and a second space devoid of said second buffer circuitry.

Claim 33

The integrated-circuit chip of claim 27 wherein said electrical wiring is also routed through said second space of said second buffer to electrically couple said at least one first buffer to said core logic.

Claim 34

The integrated-circuit chip of claim 26 wherein said integrated-circuit chip has a rectangular shape.

Claim 35

The integrated-circuit chip of claim 29 further comprising a plurality of power rails coupling said first and second input/output buffer-circuit arrays, each of said power rails having a straight section and a corner section, said corner section being located adjacent a corner of said chip, said straight and corner sections of said power rails having substantially the same width.

Claim 36

The integrated-circuit chip of claim 28 wherein said integrated-circuit chip has a rectangular shape.

Claim 37

The integrated-circuit chip of claim 31 further comprising a plurality of power rails coupling said first and second input/output buffer-circuit arrays, each of said power rails having a straight section and a corner section, said corner section being located adjacent a corner of said chip, said straight and corner sections of said power rails having substantially the same width.

Claim 38

A rectangular integrated-circuit chip comprising: a chip core containing a core logic, said core logic comprising a plurality of logic elements that are interconnected to form a circuit; a plurality of input/output pads disposed about the periphery of said chip; a plurality of input/output buffers forming a first input/output buffer-circuit array and a second input/output buffer-circuit array, said input/output buffers disposed between said chip core and said input/output pads to electrically couple said core logic to said input/output pads, said first input/output buffer-circuit array having at least one first buffer transversely overlapping a second buffer of said second input/output buffer-circuit array, said second buffer longitudinally overlapping said at least one first buffer, said second buffer having a first space containing an abridged second buffer circuitry and a second space devoid of said second buffer circuitry; a plurality of power rails coupling said first and second input/output buffer-circuit arrays without abutting an adjacent power rail, each of said power rails having a straight section and a corner section, said corner section being located at a corner of said chip, said straight and corner sections of said power rails having substantially the same width; a channel formed between said at least one first buffer and said second buffer; and electrical wiring routed through said channel and second space of said second buffer to electrically couple said at least one first buffer to said core logic.

Claim 39

A rectangular integrated-circuit chip comprising: a chip core containing a core logic, said core logic comprising a plurality of logic elements that are interconnected to form a circuit; a plurality of input/output pads disposed about the periphery of said chip; a plurality of input/output buffers forming a first input/output buffer-circuit array and a second input/output buffer-circuit array, said input/output buffers disposed between said chip core and said input/output pads to electrically couple said core logic to said input/output pads, said first input/output buffer-circuit array having at least one first buffer transversely overlapping a second buffer of said second input/output buffer-circuit array, said second buffer longitudinally overlapping said at least one first buffer, said second buffer having a first space containing an abridged second buffer circuitry and a second space devoid of said second buffer circuitry; a plurality of power rails coupling said first and second input/output buffer-circuit arrays without abutting an adjacent power rail, each of said power rails having a straight section and a corner section, said corner section being located at a corner of said chip, said straight and corner sections of said power rails having substantially the same width; a channel formed between said at least one first buffer and said second buffer; and electrical wiring routed through said channel and second space of said second buffer to electrically couple said at least one first buffer to said core logic.

Claim 40

The integrated-circuit die of claim 11 wherein said each of said power rails contain at least one straight section and at least one corner section, said straight and corner sections having substantially the same width.