Resin composition for sealing film-made liquid crystal cells
Abstract
Abstract A resin composition for sealing liquid crystal cells comprising as principal ingredients epoxy resin containing a polysulfide modified epoxy resin, hydrazide compounds and fillers. The said epoxy resin contains a polysulfide modified epoxy resin expressed by the general formula (1) in an amount of 20 to 100% by weight in the entire epoxy resin and the average molecular weight of the entire epoxy resin is between 300 and 3000. Formula (1) is defined as follows: <IMAGE> (1) where each of R1 and R3 represents at least one organic group selected from a group consisting of bisphenol structures, aliphatic oxyether structures and aliphatic thioether structures and R2 represents a polysulfide structure expressed by -(C2H4OCH2OC2H4Sm)n-, wherein m represents the number of sulfur atoms contained in a polysulfide structure, which is 1 or 2, and n represents the average number of polysulfide structures contained in the above formula, which is between 1 and 50. A film-made liquid crystal cell made by using the resin composition is excellent in adhesion, flexibility, electric properties and has high reliability.
Inventors
- 👤 Syuji Tahara
- 👤 Koichi Machida
- 👤 Seiji Itami
- 👤 Masayuki Horiuchi
Bibliographic Details
Claims Analysis
Total Claims: 9References Cited (Backward Citations)
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