Integrated circuit component package with integral passive component

Claim 1

A high-performance, high-density integrated circuit (IC) component package comprising: an IC chip having a plurality of IC bond pads extending along an outer periphery of said IC chip; an interconnect substrate bonded to said IC chip with a die attach, said interconnect substrate being mounted as an integral part of the component package and providing structural support to the component package, said interconnect substrate including: a plurality of I/O surface pads arrayed across a surface of said interconnect substrate, said I/O surface pads being electrically connected to said IC bond pads via a plurality of traces internal to said interconnect substrate; at least one layer comprising capacitive, resistive or inductive material integrally formed within said interconnect substrate, said at least one layer comprising capacitive material having a capacitance between 20 pF and 0.1 μF, said at least one layer comprising resistive material having a resistance between 25Ω and 200 kΩ, said at least one layer comprising inductive material having an inductance between 1 nH and 1,000 nH; and distinguishable power and ground planes integrally formed within said interconnect substrate; and a plurality of wire bonds between said traces and said IC bond pads.

Claim 26

A method of manufacturing a high-performance, high-density integrated circuit (IC) component package comprising the steps of: (a) providing an IC chip having a plurality of IC bond pads; (b) separately manufacturing an interconnect substrate including at least one layer comprising capacitive, resistive or inductive material integrally formed within the interconnect substrate, said interconnect substrate including a plurality of I/O surface pads arrayed across a surface of the interconnect substrate and a plurality of traces internal to the interconnect substrate; (c) thereafter bonding said interconnect substrate to said IC chip with a die attach; and (d) electrically connecting said I/O surface pads to said IC bond pads via said plurality of traces.

Claim 27

A method of manufacturing a high-performance, high-density integrated circuit (IC) component package comprising the steps of: (a) providing an IC chip having a plurality of IC bond pads; (b) separately manufacturing an interconnect substrate including at least one layer comprising capacitive, resistive or inductive material integrally formed within the interconnect substrate, said interconnect substrate including a plurality of I/O surface pads arrayed across a surface of the interconnect substrate and a plurality of traces internal to the interconnect substrate; (c) thereafter bonding said interconnect substrate to said IC chip with a die attach; and (d) electrically connecting said I/O surface pads to said IC bond pads via said plurality of traces.