US5618379A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Selective deposition process
Assignee: International Business Machines Corp
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Filing: 1991-04-01
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Granted: 1997-04-08
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Expires: 2011-04-01
Abstract
Abstract Disclosed is a process for depositing a conformal polymer coating on selected areas of a silicon substrate. The substrate is first exposed through a mask to a gaseous plasma so as to form a film of desired pattern, the plasma comprising a compound having strong electron donating characteristics. Then, the patterned film and the remaining substrate not covered by the film are exposed to the vapor of a monomer, which condenses and polymerizes on the exposed substrate surfaces, but not on the film. The film serves to inhibit substantial deposition of the coating, so as to provide a selective deposition, where the coating is formed only on those areas of the substrate where desired.
Inventors
- 👤 Michael D. Armacost
- 👤 Steven A. Grundon
- 👤 David L. Harmon
- 👤 Son V. Nguyen
- 👤 John F. Rembetski
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 16:08
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/60; H10P14/68; H10P14/683; B; B05; B05D; B05D1/00; B05D1/60; H10P14/65; H10P14/6516; H10P14/6529; H10P14/6532; H10P50/00; H10P50/20; H10P50/24; H10P50/242; H10P50/244; H10W; H10W10/00; H10W10/01; H10W10/011; H10W10/014; H10W10/0145; H10W10/10; H10W10/17; H10P14/63; H10P14/6326; H10P14/6328; H10P14/6334; H10P14/6336; H10P14/687
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
92 words
A process for selectively depositing a conformal polymer coating on a substrate, comprising: forming a patterned film on said substrate, so as to expose selected areas of said substrate, said film being formed by treating said substrate with a compound having strong electron donor characteristics; and exposing said patterned film and said substrate to the vapor of a monomer under such conditions as to condense said monomer to form a conformal polymer coating on said selected areas not covered by said patterned film, said film inhibiting substantial deposition of said coating thereon.
Claim 2
Dependent Claim
92 words
A process for selectively depositing a conformal polymer coating on a substrate, comprising: forming a patterned film on said substrate, so as to expose selected areas of said substrate, said film being formed by treating said substrate with a compound having strong electron donor characteristics; and exposing said patterned film and said substrate to the vapor of a monomer under such conditions as to condense said monomer to form a conformal polymer coating on said selected areas not covered by said patterned film, said film inhibiting substantial deposition of said coating thereon.
Claim 3
Dependent Claim
22 words
The process of claim 1, wherein said film is formed by exposing said substrate to a gaseous plasma comprising a halogen-containing compound.
Claim 4
Dependent Claim
11 words
The process of claim 2, wherein said halogen-containing compound contains fluorine.
Claim 5
Dependent Claim
12 words
The process of claim 3, wherein said halogen-containing compound is a fluorocarbon.
Claim 6
Dependent Claim
13 words
The process of claim 4, wherein said plasma comprises trifluoromethane and carbon dioxide.
Claim 7
Dependent Claim
14 words
The process of claim 1, wherein said monomer comprises p-xylylene or a derivative thereof.
Claim 8
Dependent Claim
19 words
The process of claim 6, wherein said coating has a thickness ranging from about 50 to about 4000 Å.
Claim 9
Dependent Claim
39 words
The process of claim 7, wherein p-xylylene is heated to a temperature of about 600° to about 850° C. at a pressure of about 30 to about 1000 millitorr for a time from about 0.5 to about 45 minutes.
Claim 10
Dependent Claim
36 words
The process of claim 8, wherein said coating has a thickness ranging from about 1000 to about 3000 Å, and wherein said p-xylylene is heated for a time ranging from about 7 to about 30 minutes.
Claim 11
Dependent Claim
94 words
A process for selectively depositing a conformal polymer coating on a substrate, comprising: exposing said substrate through a mask to a gaseous plasma comprising a halogen-containing compound to form a film thereon, said film containing a pattern of openings that expose selected areas of said substrate; and exposing said patterned film and said selected areas of said substrate to the vapor of a monomer under such conditions as to condense said monomer to form a conformal polymer coating on said selected areas of said substrate, which does not substantially form on said patterned film.
Claim 12
Dependent Claim
94 words
A process for selectively depositing a conformal polymer coating on a substrate, comprising: exposing said substrate through a mask to a gaseous plasma comprising a halogen-containing compound to form a film thereon, said film containing a pattern of openings that expose selected areas of said substrate; and exposing said patterned film and said selected areas of said substrate to the vapor of a monomer under such conditions as to condense said monomer to form a conformal polymer coating on said selected areas of said substrate, which does not substantially form on said patterned film.
Claim 13
Dependent Claim
21 words
The process of claim 10, wherein said halogen-containing compound is a fluorocarbon and said monomer comprises p-xylylene or a derivative thereof.
Claim 14
Dependent Claim
39 words
The process of claim 11, wherein p-xylylene is heated to a temperature of about 600° to about 850° C. at a pressure of about 30 to about 1000 millitorr for a time from about 0.5 to about 45 minutes.
Claim 15
Dependent Claim
122 words
A process for selectively depositing a conformal polymer coating on the surfaces of a substrate trench, comprising: forming a patterned masking material on a substrate, so as to expose selected areas of said substrate; exposing said selected areas of said substrate to a gaseous plasma comprising a halogen-containing compound to form a trench having sidewall surfaces and a bottom surface, and as to form a halide film on the sidewall surfaces of said trench; and exposing said film and said substrate to the vapor of a monomer under such conditions as to condense said monomer to form a conformal polymer coating on said substrate and on the bottom surface of said trench, said halide film inhibiting substantial deposition of said coating thereon.
Claim 16
Dependent Claim
122 words
A process for selectively depositing a conformal polymer coating on the surfaces of a substrate trench, comprising: forming a patterned masking material on a substrate, so as to expose selected areas of said substrate; exposing said selected areas of said substrate to a gaseous plasma comprising a halogen-containing compound to form a trench having sidewall surfaces and a bottom surface, and as to form a halide film on the sidewall surfaces of said trench; and exposing said film and said substrate to the vapor of a monomer under such conditions as to condense said monomer to form a conformal polymer coating on said substrate and on the bottom surface of said trench, said halide film inhibiting substantial deposition of said coating thereon.
Claim 17
Dependent Claim
32 words
The process of claim 13, wherein said trench is formed by exposing said substrate to a gaseous plasma comprising a chlorine-containing compound; and wherein said monomer comprises p-xylylene or a derivative thereof.
Claim 18
Dependent Claim
25 words
The process of claim 14, wherein said trench is formed by exposing said substrate to a gaseous plasma comprising hydrogen chloride, oxygen and boron trichloride.
Claim 19
Dependent Claim
177 words
A process for selectively depositing a conformal polymer coating on the surfaces of a substrate trench, comprising: forming a patterned masking material on a substrate, so as to expose selected areas of said substrate; exposing said selected areas of said substrate to a gaseous plasma comprising a halogen-containing compound to form a trench having substantially vertical sidewall surfaces and a bottom surface, and as to form a halide film on the sidewall surfaces of said trench; removing said halide film; exposing said substrate to a gaseous plasma comprising a halogen-containing compound to form a film on the sidewall surfaces and the bottom surface of said trench; ansiotropically etching said film, so as to remove said film from the bottom surface of said trench, while allowing said film to remain on said sidewall surfaces of said trench; and exposing said remaining film and said substrate to the vapor of a monomer under such conditions as to condense said monomer to form a conformal polymer coating on the bottom surface of said trench, where said film has been removed.
Claim 20
Dependent Claim
177 words
A process for selectively depositing a conformal polymer coating on the surfaces of a substrate trench, comprising: forming a patterned masking material on a substrate, so as to expose selected areas of said substrate; exposing said selected areas of said substrate to a gaseous plasma comprising a halogen-containing compound to form a trench having substantially vertical sidewall surfaces and a bottom surface, and as to form a halide film on the sidewall surfaces of said trench; removing said halide film; exposing said substrate to a gaseous plasma comprising a halogen-containing compound to form a film on the sidewall surfaces and the bottom surface of said trench; ansiotropically etching said film, so as to remove said film from the bottom surface of said trench, while allowing said film to remain on said sidewall surfaces of said trench; and exposing said remaining film and said substrate to the vapor of a monomer under such conditions as to condense said monomer to form a conformal polymer coating on the bottom surface of said trench, where said film has been removed.
Claim 21
Dependent Claim
18 words
The process of claim 16, wherein said halide film is removed with a solution of buffered hydrofluoric acid.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-04-07 | 2000-10-07 | 2001-04-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-04-07 | 2004-10-07 | 2005-04-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-04-07 | 2008-10-07 | 2009-04-08 | $7700.00 | Window Closed / Lapsed |